Intermediate bonding

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H01L2224/80907

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80907Intermediate bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device and method for manufacturing the same
- Patent number 11,894,335
- Issue date Feb 6, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,847,571
- Issue date Nov 24, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,714,457
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,700,120
- Issue date Jun 30, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,615,139
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond structures and the methods of forming the same
- Patent number 10,510,699
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,290,611
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond structures and the methods of forming the same
- Patent number 10,269,741
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,211,178
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,134,803
- Issue date Nov 20, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 10,083,933
- Issue date Sep 25, 2018
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,020,279
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arranging method
- Patent number 9,806,057
- Issue date Oct 31, 2017
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stacked structures and methods for fab...
- Patent number 9,653,430
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattened substrate surface for substrate bonding
- Patent number 9,355,936
- Issue date May 31, 2016
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding and apparatus for performing the same
- Patent number 9,331,032
- Issue date May 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding of chips on wafers
- Patent number 8,927,335
- Issue date Jan 6, 2015
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240030179
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20230207611
- Publication date Jun 29, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, EQUIPMENT, AND MANUFACTURING METHOD OF SEMICO...
- Publication number 20230008401
- Publication date Jan 12, 2023
- Canon Kabushiki Kaisha
- Takuya Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210398939
- Publication date Dec 23, 2021
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20200343224
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20200328249
- Publication date Oct 15, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20190267354
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Structures and the Methods of Forming the Same
- Publication number 20190252335
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20180358405
- Publication date Dec 13, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20180358404
- Publication date Dec 13, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE
- Publication number 20180226374
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Structures and the Methods of Forming the Same
- Publication number 20180166408
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
Hybrid Bonding and Apparatus for Performing the Same
- Publication number 20140256087
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20140209908
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20130105981
- Publication date May 2, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING OF CHIPS ON WAFERS
- Publication number 20120184069
- Publication date Jul 19, 2012
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS

Intermediate bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method for manufacturing the same

Micro device integration into system substrate

Apparatus, system, and method for handling aligned wafer pairs

Semiconductor packages and methods of forming same

System and related techniques for handling aligned substrate pairs

Micro device integration into system substrate

Apparatus, system, and method for handling aligned wafer pairs

Semiconductor packages and methods of forming same

Micro device integration into system substrate

Semiconductor device including built-in crack-arresting film structure

Method for bonding substrates together, and substrate bonding device

Bond structures and the methods of forming the same

Semiconductor packages and methods of forming same

Bond structures and the methods of forming the same

Semiconductor device including built-in crack-arresting film structure

Micro device integration into system substrate

Method for permanent bonding of wafers

Semiconductor device including built-in crack-arresting film structure

Method for bonding substrates

Chip arranging method

Semiconductor devices having stacked structures and methods for fab...

Method for aligning micro-electronic components

Flattened substrate surface for substrate bonding

Hybrid bonding and apparatus for performing the same

Chip-on-wafer bonding method and bonding device, and structure comp...

Method for bonding of chips on wafers

Patents Applicationslast 30 patents

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

BONDING TOOL AND BONDING METHOD THEREOF

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE

SEMICONDUCTOR DEVICE, EQUIPMENT, AND MANUFACTURING METHOD OF SEMICO...

Semiconductor Packages and Methods of Forming Same

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

Semiconductor Packages and Methods of Forming Same

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

Semiconductor Packages and Methods of Forming Same

Bond Structures and the Methods of Forming the Same

METHOD FOR PERMANENT BONDING OF WAFERS

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

Bond Structures and the Methods of Forming the Same

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

Hybrid Bonding and Apparatus for Performing the Same

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

METHOD FOR BONDING OF CHIPS ON WAFERS