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H01L2924/07812

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/07812Intrinsic

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Patents Grantslast 30 patents

Information Patent Grant
Modular electronics apparatuses and methods
- Patent number 10,573,835
- Issue date Feb 25, 2020
- Nokia Technologies Oy
- Mark Allen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Systems for adhesive bonding of electronic devices
- Patent number 10,319,890
- Issue date Jun 11, 2019
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for adhesive bonding of electronic devices
- Patent number 9,647,189
- Issue date May 9, 2017
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device contact, electric device package and method of manufacturing...
- Patent number 8,835,219
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
- Publication number 20240063165
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Ramesh NALLAVELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR ELECTRONICS APPARATUSES AND METHODS
- Publication number 20180013082
- Publication date Jan 11, 2018
- Nokia Technologies Oy
- Mark ALLEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Device Contact, Electric Device Package and Method of Manufacturing...
- Publication number 20130341778
- Publication date Dec 26, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS