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CPC
H05K2201/10477

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10477Inverted

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lighting fixture with reflector and template PCB
- Patent number 11,441,747
- Issue date Sep 13, 2022
- Ideal Industries Lighting LLC
- Nelson Man Hoi Lui
- F21 - LIGHTING
Information Patent Grant
Methods and devices associated with bonding of solid-state lithium...
- Patent number 10,873,102
- Issue date Dec 22, 2020
- VERILY LIFE SCIENCES LLC
- Brian Marc Pepin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting fixture with reflector and template PCB
- Patent number 10,788,177
- Issue date Sep 29, 2020
- IDEAL Industries Lighting LLC
- Nelson Man Hoi Lui
- F21 - LIGHTING
Information Patent Grant
Methods and devices associated with bonding of solid-state lithium...
- Patent number 9,991,550
- Issue date Jun 5, 2018
- VERILY LIFE SCIENCES LLC
- Brian Marc Pepin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded die and its methods of fabrication
- Patent number 9,780,054
- Issue date Oct 3, 2017
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module substrate and method for manufacturing module substrate
- Patent number 9,781,828
- Issue date Oct 3, 2017
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-up substrate integration with solder ball connection in semico...
- Patent number 9,468,098
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module
- Patent number 9,414,513
- Issue date Aug 9, 2016
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging reader with plug-in imaging modules for electro-optically r...
- Patent number 9,275,263
- Issue date Mar 1, 2016
- Symbol Technologies, LLC
- Mark Drzymala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module and method for manufacturing the same
- Patent number 9,113,571
- Issue date Aug 18, 2015
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 9,027,238
- Issue date May 12, 2015
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a multilayered circuit board
- Patent number 8,973,259
- Issue date Mar 10, 2015
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,912,451
- Issue date Dec 16, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mount board and electronic device
- Patent number 8,913,398
- Issue date Dec 16, 2014
- NEC Corporation
- Shinji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with embedded die and its methods of fabrication
- Patent number 8,901,724
- Issue date Dec 2, 2014
- Intel Corporation
- John Stephen Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded printed circuit board and manufacturing method thereof
- Patent number 8,802,999
- Issue date Aug 12, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong In Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Downward-facing optical component module
- Patent number 8,804,368
- Issue date Aug 12, 2014
- Sony Corporation
- Yoshinari Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,692,132
- Issue date Apr 8, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mount board and electronic device
- Patent number 8,625,296
- Issue date Jan 7, 2014
- NEC Corporation
- Shinji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector assembly
- Patent number 8,570,745
- Issue date Oct 29, 2013
- Lotes Co., Ltd.
- Ted Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making a radio frequency identification (RFID) tags
- Patent number 8,516,683
- Issue date Aug 27, 2013
- Alien Technology Corporation
- Thomas Lloyd Credelle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material application for integrated circuit cooling
- Patent number 8,411,444
- Issue date Apr 2, 2013
- International Business Machines Corporation
- Michael Anthony Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grid array packages and assemblies including the same
- Patent number 8,299,598
- Issue date Oct 30, 2012
- Round Rock Research, LLC
- Walter L. Moden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect board, printed circuit board unit, and method
- Patent number 8,289,728
- Issue date Oct 16, 2012
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device provided with wire that electrically connects...
- Patent number 8,217,517
- Issue date Jul 10, 2012
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for providing and using grid array packages
- Patent number 8,198,138
- Issue date Jun 12, 2012
- Round Rock Research, LLC
- Walter L. Moden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable semiconductor device assemblies
- Patent number 8,164,175
- Issue date Apr 24, 2012
- Round Rock Research, LLC
- Walter L. Moden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,101,868
- Issue date Jan 24, 2012
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of printing electronic circuits
- Patent number 8,074,350
- Issue date Dec 13, 2011
- Palo Also Research Center Incorporated
- Jurgen H. Daniel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser-based technique for the transfer and embedding of electronic...
- Patent number 8,056,222
- Issue date Nov 15, 2011
- The United States of America, as represented by the Secretary of the Navy
- Alberto Pique
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES
- Publication number 20240090131
- Publication date Mar 14, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Alexander Trotman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING FIXTURE WITH REFLECTOR AND TEMPLATE PCB
- Publication number 20200400279
- Publication date Dec 24, 2020
- IDEAL INDUSTRIES LIGHTING LLC
- Nelson Man Hoi Lui
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Methods and Devices Associated with Bonding of Solid-State Lithium...
- Publication number 20180254507
- Publication date Sep 6, 2018
- Verily Life Sciences LLC
- Brian Marc Pepin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING FIXTURE WITH REFLECTOR AND TEMPLATE PCB
- Publication number 20140268750
- Publication date Sep 18, 2014
- Cree, Inc.
- Nelson Man Hoi Lui
- F21 - LIGHTING
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20140003015
- Publication date Jan 2, 2014
- NEC CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130343023
- Publication date Dec 26, 2013
- Hideo NAKAGOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE SUBSTRATE AND METHOD FOR MANUFACTURING MODULE SUBSTRATE
- Publication number 20130223038
- Publication date Aug 29, 2013
- Murata Manufacturing Co., Ltd.
- Issei YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MODULE, INTEGRATED SYSTEM BOARD, AND ELECTRONIC DEVICE
- Publication number 20130182395
- Publication date Jul 18, 2013
- HUAWEI DEVICE CO., LTD.
- Haixing Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING
- Publication number 20130118008
- Publication date May 16, 2013
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20130098667
- Publication date Apr 25, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jong In RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY
- Publication number 20130077252
- Publication date Mar 28, 2013
- LOTES CO., LTD
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SUBSTRATE MODULE
- Publication number 20130062111
- Publication date Mar 14, 2013
- UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
- HSUN-FA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AT LEAST PARTIALLY REDUNDANT INTERCONNECTS BETWEEN COMPONENT AND PR...
- Publication number 20120282787
- Publication date Nov 8, 2012
- Honeywell International Inc.
- Jay Stanke
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120106108
- Publication date May 3, 2012
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120077317
- Publication date Mar 29, 2012
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING
- Publication number 20120063094
- Publication date Mar 15, 2012
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component and Method of Manufacturing the Same
- Publication number 20120051017
- Publication date Mar 1, 2012
- Samsung Mobile Display Co., Ltd.
- Gyeong-Im Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120006587
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20110314668
- Publication date Dec 29, 2011
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, CIRCUIT MODULE, AND ELECTRONIC DEVICE PROVIDED WITH...
- Publication number 20110273851
- Publication date Nov 10, 2011
- PANASONIC CORPORATION
- Seiji Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY MODULE WITH REVERSE MOUNTED CHIP RESISTOR
- Publication number 20110256671
- Publication date Oct 20, 2011
- Hyun-Seok CHOI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20110242780
- Publication date Oct 6, 2011
- NEC Corporation
- Shinji Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package with embedded die and its methods of fabrication
- Publication number 20110215464
- Publication date Sep 8, 2011
- Intel Corporation
- John Stephen Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bumping Electronic Components Using Transfer Substrates
- Publication number 20110092066
- Publication date Apr 21, 2011
- John Mackay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE STRUCTURE OF ELECTRONIC COMPONENT
- Publication number 20110080715
- Publication date Apr 7, 2011
- CASTLES TECHNOLOGY CO., LTD.
- Lin Chiao-Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD
- Publication number 20110080717
- Publication date Apr 7, 2011
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD
- Publication number 20110080718
- Publication date Apr 7, 2011
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20110026887
- Publication date Feb 3, 2011
- Kabushiki Kaisha Toshiba
- Hiroshi Uemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PROVIDED WITH WIRE THAT ELECTRICALLY CONNECTS...
- Publication number 20110006418
- Publication date Jan 13, 2011
- ELPIDA MEMORY, INC.
- Mitsuhisa Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED ILLUMINATION DEVICE
- Publication number 20100327723
- Publication date Dec 30, 2010
- Pei-Choa WANG
- F21 - LIGHTING

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lighting fixture with reflector and template PCB

Methods and devices associated with bonding of solid-state lithium...

Lighting fixture with reflector and template PCB

Methods and devices associated with bonding of solid-state lithium...

Semiconductor package with embedded die and its methods of fabrication

Module substrate and method for manufacturing module substrate

Face-up substrate integration with solder ball connection in semico...

Electronic component module

Imaging reader with plug-in imaging modules for electro-optically r...

Electronic component module and method for manufacturing the same

Multilayered printed circuit board and method for manufacturing the...

Method for manufacturing a multilayered circuit board

Multilayered printed circuit board and method for manufacturing the...

Mount board and electronic device

Semiconductor package with embedded die and its methods of fabrication

Embedded printed circuit board and manufacturing method thereof

Downward-facing optical component module

Multilayered printed circuit board and method for manufacturing the...

Mount board and electronic device

Electrical connector assembly

Methods of making a radio frequency identification (RFID) tags

Thermal interface material application for integrated circuit cooling

Grid array packages and assemblies including the same

Interconnect board, printed circuit board unit, and method

Semiconductor device provided with wire that electrically connects...

Methods for providing and using grid array packages

Stackable semiconductor device assemblies

Multilayered printed circuit board and method for manufacturing the...

Method of printing electronic circuits

Laser-based technique for the transfer and embedding of electronic...

Patents Applicationslast 30 patents

THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES

LIGHTING FIXTURE WITH REFLECTOR AND TEMPLATE PCB

Methods and Devices Associated with Bonding of Solid-State Lithium...

LIGHTING FIXTURE WITH REFLECTOR AND TEMPLATE PCB

MOUNT BOARD AND ELECTRONIC DEVICE

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME

MODULE SUBSTRATE AND METHOD FOR MANUFACTURING MODULE SUBSTRATE

INTEGRATED MODULE, INTEGRATED SYSTEM BOARD, AND ELECTRONIC DEVICE

THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING

EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRICAL CONNECTOR ASSEMBLY

STACKED SUBSTRATE MODULE

AT LEAST PARTIALLY REDUNDANT INTERCONNECTS BETWEEN COMPONENT AND PR...

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING

Electronic Component and Method of Manufacturing the Same

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

CIRCUIT BOARD, CIRCUIT MODULE, AND ELECTRONIC DEVICE PROVIDED WITH...

SEMICONDUCTOR MEMORY MODULE WITH REVERSE MOUNTED CHIP RESISTOR

MOUNT BOARD AND ELECTRONIC DEVICE

Semiconductor package with embedded die and its methods of fabrication

Bumping Electronic Components Using Transfer Substrates

PROTECTIVE STRUCTURE OF ELECTRONIC COMPONENT

INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD

INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD

MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE PROVIDED WITH WIRE THAT ELECTRICALLY CONNECTS...

LED ILLUMINATION DEVICE