involving a chemical process

Industry

CPC
H01L2224/27831

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27831involving a chemical process

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer on wafer bonding structure
- Patent number 11,715,723
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,502,057
- Issue date Nov 15, 2022
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laterally extended conductive bump buffer
- Patent number 10,276,530
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules with semiconductor dies bonded to a metal foil
- Patent number 10,192,849
- Issue date Jan 29, 2019
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical nanoribbon array (VERNA) thermal interface materials with...
- Patent number 10,170,338
- Issue date Jan 1, 2019
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Array substrate, its manufacturing method, and display device
- Patent number 10,127,855
- Issue date Nov 13, 2018
- BOE Technology Group Co., Ltd.
- Ming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for performing direct bonding between two structures
- Patent number 9,922,954
- Issue date Mar 20, 2018
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,673,176
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,666,563
- Issue date May 30, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,431
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,432
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,515,051
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of forming the same related...
- Patent number 9,388,040
- Issue date Jul 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,202,714
- Issue date Dec 1, 2015
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of forming the same related...
- Patent number 9,079,761
- Issue date Jul 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer dicing employing edge region underfill removal
- Patent number 8,652,941
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor chip, and method for th...
- Patent number 8,574,966
- Issue date Nov 5, 2013
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor circuit substrate
- Patent number 8,471,377
- Issue date Jun 25, 2013
- Mitsubishi Electric Corporation
- Naoki Kosaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for wafer to wafer bonding in semiconductor pa...
- Patent number 8,377,798
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacking method and stacking carrier
- Patent number 8,324,105
- Issue date Dec 4, 2012
- Victory Gain Group Corporation
- Jui-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor chip, and method for th...
- Patent number 8,168,472
- Issue date May 1, 2012
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor chip, and method for th...
- Patent number 8,062,928
- Issue date Nov 22, 2011
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor chip, and method for th...
- Patent number 7,795,742
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20230387051
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
- Publication number 20220238466
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210257332
- Publication date Aug 19, 2021
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
- Publication number 20200291538
- Publication date Sep 17, 2020
- INFINEON TECHNOLOGIES AG
- Norbert Pielmeier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...
- Publication number 20180342405
- Publication date Nov 29, 2018
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES
- Publication number 20170179073
- Publication date Jun 22, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Hubert MORICEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connecting Medium on an Assembly Partner, Me...
- Publication number 20160225735
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086925
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150014849
- Publication date Jan 15, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140374903
- Publication date Dec 25, 2014
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME RELATED...
- Publication number 20140264474
- Publication date Sep 18, 2014
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140191418
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20130280861
- Publication date Oct 24, 2013
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL
- Publication number 20130149841
- Publication date Jun 13, 2013
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING METHOD AND STACKING CARRIER
- Publication number 20130049230
- Publication date Feb 28, 2013
- VICTORY GAIN GROUP CORPORATION
- Jui-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...
- Publication number 20120178218
- Publication date Jul 12, 2012
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
- Publication number 20120115305
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Jung-Huei PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKING METHOD AND STACKING CARRIER
- Publication number 20120038060
- Publication date Feb 16, 2012
- MOS Art Pack Corporation
- Jui-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CIRCUIT SUBSTRATE, AND METHOD O...
- Publication number 20120032296
- Publication date Feb 9, 2012
- Mitsubishi Electric Corporation
- Naoki Kosaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...
- Publication number 20120028382
- Publication date Feb 2, 2012
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...
- Publication number 20100297792
- Publication date Nov 25, 2010
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...
- Publication number 20070085216
- Publication date Apr 19, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS

involving a chemical process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structures of integrated circuit devices and method forming...

Die on die bonding structure

Bonding structures of integrated circuit devices and method forming...

Wafer on wafer bonding structure

Semiconductor device and manufacturing method thereof

Porous Cu on Cu surface for semiconductor packages

Method for producing a connecting medium on an assembly partner, me...

Laterally extended conductive bump buffer

Semiconductor modules with semiconductor dies bonded to a metal foil

Vertical nanoribbon array (VERNA) thermal interface materials with...

Array substrate, its manufacturing method, and display device

Method for performing direct bonding between two structures

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Stacked semiconductor device and method of forming the same related...

Methods for forming semiconductor device packages

Stacked semiconductor device and method of forming the same related...

Wafer dicing employing edge region underfill removal

Semiconductor device having a semiconductor chip, and method for th...

Electronic component mounting structure

Semiconductor device and semiconductor circuit substrate

Method and structure for wafer to wafer bonding in semiconductor pa...

Stacking method and stacking carrier

Semiconductor device having a semiconductor chip, and method for th...

Semiconductor device having a semiconductor chip, and method for th...

Semiconductor device having a semiconductor chip, and method for th...

Semiconductor device, circuit board, electro-optic device, electron...

Patents Applicationslast 30 patents

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

DIE ON DIE BONDING STRUCTURE

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

Bonding Structures of Integrated Circuit Devices and Method Forming...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Porous Cu on Cu Surface for Semiconductor Packages

VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...

METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES

Method for Producing a Connecting Medium on an Assembly Partner, Me...

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

STACKED SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME RELATED...

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES

WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL

STACKING METHOD AND STACKING CARRIER

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...

STACKING METHOD AND STACKING CARRIER

SEMICONDUCTOR DEVICE, SEMICONDUCTOR CIRCUIT SUBSTRATE, AND METHOD O...

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...

ELECTRONIC COMPONENT MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...

Semiconductor device, circuit board, electro-optic device, electron...