involving a dielectric removal step

Industry

CPC
H01L21/31053

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/31053involving a dielectric removal step

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing gate structure and method of manufacturing...
- Patent number 12,170,280
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with air gap and method sealing the air gap
- Patent number 12,165,912
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Training a machine learning system to detect an excursion of a CMP...
- Patent number 12,148,149
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Sidney P. Huey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Etching composition, method for etching insulating film of semicond...
- Patent number 12,146,092
- Issue date Nov 19, 2024
- SK Innovation Co., Ltd.
- Cheol Woo Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming source/drain contacts
- Patent number 12,142,663
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structures having conductive structures along pillars of...
- Patent number 12,142,680
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad, preparation method thereof and method for preparing...
- Patent number 12,138,738
- Issue date Nov 12, 2024
- SK ENPULSE CO., LTD.
- Jae In Ahn
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative-capacitance and ferroelectric field-effect transistor (NCF...
- Patent number 12,136,659
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Yang Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,136,662
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,132,050
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced trap defect and method of forming...
- Patent number 12,119,389
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin-type field effect transistor and me...
- Patent number 12,119,351
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Dong-Il Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-stopping polishing composition and method for high topological...
- Patent number 12,116,502
- Issue date Oct 15, 2024
- CMC MATERIALS LLC
- Juyeon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for semiconductor processing and method of fabricating...
- Patent number 12,110,421
- Issue date Oct 8, 2024
- SK ENPULSE CO., LTD.
- Seung Chul Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing slurry, method for manufacturing a display device using t...
- Patent number 12,113,077
- Issue date Oct 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Joon-Hwa Bae
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry, screening method, and polishing method
- Patent number 12,104,112
- Issue date Oct 1, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Polishing liquid and polishing method
- Patent number 12,098,300
- Issue date Sep 24, 2024
- Resonac Corporation
- Ai Fujimatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Face-up wafer electrochemical planarization apparatus
- Patent number 12,090,600
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Grant
Techniques and configurations to reduce transistor gate short defects
- Patent number 12,094,780
- Issue date Sep 17, 2024
- Intel Corporation
- Sridhar Govindaraju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High oxide film removal rate shallow trench (STI) chemical mechanic...
- Patent number 12,091,581
- Issue date Sep 17, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Eight-transistor static random access memory, layout thereof, and m...
- Patent number 12,082,388
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shau-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming dielectric layer in forming semiconductor device
- Patent number 12,080,560
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yonggang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of semiconductor structure
- Patent number 12,080,589
- Issue date Sep 3, 2024
- Shanghai IC R&D Center Co., Ltd.
- Weijun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting an excursion of a CMP component using time-based sequence...
- Patent number 12,079,984
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Sidney P. Huey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method
- Patent number 12,068,162
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical structure
- Patent number 12,062,705
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR CARBON PLUG FORMATION
- Publication number 20240420927
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Daniela ANJOS RIGSBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240420961
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Planarization Polishing Composition For Silicon...
- Publication number 20240417594
- Publication date Dec 19, 2024
- VERSUM MATERIALS US, LLC
- Maitland Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...
- Publication number 20240400861
- Publication date Dec 5, 2024
- VERSUM MATERIALS US, LLC
- Gregor Larbig
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
- Publication number 20240392214
- Publication date Nov 28, 2024
- FUJIFILM CORPORATION
- Naotsugu MURO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Chemical Mechanical Planarization Polishing For Shallow Trench Isol...
- Publication number 20240395558
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Device and Method
- Publication number 20240395598
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES
- Publication number 20240387699
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GAP FILLING FOR SEMICONDUCTOR DEVICE
- Publication number 20240387704
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Yang Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...
- Publication number 20240387187
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP SAFE ALIGNMENT MARK
- Publication number 20240387398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Jen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOURCE/DRAIN CONTACTS
- Publication number 20240379814
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME
- Publication number 20240379430
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Fins With Different Dielectric Constants and Sizes in Di...
- Publication number 20240379452
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Yann Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE...
- Publication number 20240378718
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Sidney P. Huey
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING...
- Publication number 20240371974
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN HSIUNG TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID AND POLISHING METHOD
- Publication number 20240368428
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Tetsuya KAMIMURA
- B24 - GRINDING POLISHING
Information Patent Application
EIGHT-TRANSISTOR STATIC RANDOM ACCESS MEMORY, LAYOUT THEREOF, AND M...
- Publication number 20240373615
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shau-Wei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240371869
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming of Slope Liners in Trench Based Semiconductor Devices
- Publication number 20240363728
- Publication date Oct 31, 2024
- NEXPERIA B.V.
- Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING TH...
- Publication number 20240359287
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240355627
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240355782
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES
- Publication number 20240352279
- Publication date Oct 24, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION, POLISHING COMPOSITION PRODUCTION METHOD, POL...
- Publication number 20240343943
- Publication date Oct 17, 2024
- Fujimi Incorporated
- Ryota Mae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHIN...
- Publication number 20240336810
- Publication date Oct 10, 2024
- Resonac Corporation
- Yasushi KURATA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHI...
- Publication number 20240336809
- Publication date Oct 10, 2024
- Resonac Corporation
- Yasushi KURATA
- B24 - GRINDING POLISHING
Information Patent Application
VIA STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240334847
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR SURFACE TREATMENT, SURFACE TREATMENT METHOD, AND ME...
- Publication number 20240327758
- Publication date Oct 3, 2024
- FUJIMI INCORPORATED
- Takahito NAGANO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

involving a dielectric removal step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing gate structure and method of manufacturing...

Semiconductor structure with air gap and method sealing the air gap

Chemical direct pattern plating method

Training a machine learning system to detect an excursion of a CMP...

Etching composition, method for etching insulating film of semicond...

Multi-chip integrated fan-out package

Method for forming source/drain contacts

Transistor structures having conductive structures along pillars of...

Polishing pad, preparation method thereof and method for preparing...

Integrated fan-out package and the methods of manufacturing

Negative-capacitance and ferroelectric field-effect transistor (NCF...

Methods of forming semiconductor devices

Semiconductor structure cutting process and structures formed thereby

Semiconductor device with reduced trap defect and method of forming...

Semiconductor device having fin-type field effect transistor and me...

Self-stopping polishing composition and method for high topological...

Composition for semiconductor processing and method of fabricating...

Polishing slurry, method for manufacturing a display device using t...

Slurry, screening method, and polishing method

Polishing liquid and polishing method

Face-up wafer electrochemical planarization apparatus

Techniques and configurations to reduce transistor gate short defects

High oxide film removal rate shallow trench (STI) chemical mechanic...

Eight-transistor static random access memory, layout thereof, and m...

Methods for forming dielectric layer in forming semiconductor device

Formation method of semiconductor structure

Detecting an excursion of a CMP component using time-based sequence...

Semiconductor device and method

Semiconductor device and method of forming vertical structure

Integrated fan-out package structures with recesses in molding comp...

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR CARBON PLUG FORMATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Chemical Mechanical Planarization Polishing Composition For Silicon...

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...

COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT

Chemical Mechanical Planarization Polishing For Shallow Trench Isol...

Semiconductor Device and Method

METHODS OF FORMING SEMICONDUCTOR DEVICES

METHOD OF GAP FILLING FOR SEMICONDUCTOR DEVICE

METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...

CMP SAFE ALIGNMENT MARK

METHOD FOR FORMING SOURCE/DRAIN CONTACTS

INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME

Dielectric Fins With Different Dielectric Constants and Sizes in Di...

DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE...

SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING...

POLISHING LIQUID AND POLISHING METHOD

EIGHT-TRANSISTOR STATIC RANDOM ACCESS MEMORY, LAYOUT THEREOF, AND M...

Semiconductor Structure Cutting Process and Structures Formed Thereby

Forming of Slope Liners in Trench Based Semiconductor Devices

SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING TH...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

INTEGRATED CIRCUIT PACKAGES

PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES

POLISHING COMPOSITION, POLISHING COMPOSITION PRODUCTION METHOD, POL...

POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHIN...

POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHI...

VIA STRUCTURE AND METHODS OF FORMING THE SAME

COMPOSITION FOR SURFACE TREATMENT, SURFACE TREATMENT METHOD, AND ME...