involving a permanent auxiliary member being left in the finished device

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H01L2224/83007

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83007involving a permanent auxiliary member being left in the finished device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having high yield strength intermediate plate
- Patent number 12,009,332
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,955,346
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a semiconductor wafer and a surfa...
- Patent number 11,848,300
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,444,070
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a first surface mount component a...
- Patent number 11,424,213
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof and manufacturin...
- Patent number 11,342,300
- Issue date May 24, 2022
- Japan Display Inc.
- Youhei Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a film during fabrication for a dual-si...
- Patent number 11,244,835
- Issue date Feb 8, 2022
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a dam on a packaging substrate for a du...
- Patent number 11,201,066
- Issue date Dec 14, 2021
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and power...
- Patent number 11,183,479
- Issue date Nov 23, 2021
- Mitsubishi Electric Corporation
- Shohei Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,004,697
- Issue date May 11, 2021
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on film and display device including the same
- Patent number 10,971,438
- Issue date Apr 6, 2021
- LG Display Co., Ltd.
- Jihun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus and system to interconnect packaged integrated ci...
- Patent number 10,910,347
- Issue date Feb 2, 2021
- Intel Corporation
- Yong She
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad reliability of semiconductor devices
- Patent number 10,892,239
- Issue date Jan 12, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,811,382
- Issue date Oct 20, 2020
- NANYA TECHNOLOGY CORPORATION
- Pei-Jhen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-fill deflash for a dual-sided ball grid array package
- Patent number 10,770,312
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 10,763,131
- Issue date Sep 1, 2020
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device package with recessed substrate for underfill con...
- Patent number 10,672,625
- Issue date Jun 2, 2020
- Intel Corporation
- Sergio A. Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 10,658,238
- Issue date May 19, 2020
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 10,622,223
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display panel and preparation method thereof, flexible dis...
- Patent number 10,622,330
- Issue date Apr 14, 2020
- BOE Technology Group Co., Ltd.
- Tao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill with a packaging substrate having an integrat...
- Patent number 10,593,565
- Issue date Mar 17, 2020
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...
- Publication number 20240395760
- Publication date Nov 28, 2024
- Samsung Electronics Co., LTD
- Daeyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240387438
- Publication date Nov 21, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240371820
- Publication date Nov 7, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20240339336
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20240222145
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SOLDER MASK
- Publication number 20240170438
- Publication date May 23, 2024
- NXP USA, Inc.
- Aznita Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20240136324
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih CHIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240071981
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240023346
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Younghun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20230420403
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Hyeonjun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...
- Publication number 20230343803
- Publication date Oct 26, 2023
- Sony Semiconductor Solutions Corporation
- Toshiaki IWAFUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIERS TO MODULATE UNDERFILL FLOW
- Publication number 20230317668
- Publication date Oct 5, 2023
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE BOARD COMPRISING SAME
- Publication number 20230307342
- Publication date Sep 28, 2023
- LG Innotek Co., Ltd.
- Il Sik NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230299247
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230154906
- Publication date May 18, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device
- Publication number 20230121603
- Publication date Apr 20, 2023
- LG Display Co., Ltd.
- Hoiyong KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230009495
- Publication date Jan 12, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20220375894
- Publication date Nov 24, 2022
- LG ELECTRONICS INC.
- Taesu OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INHIBITING VISCOUS MATERIAL SPREAD
- Publication number 20220344297
- Publication date Oct 27, 2022
- INPHI CORPORATION
- Choong Kooi CHEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220336404
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220293553
- Publication date Sep 15, 2022
- Mitsubishi Electric Corporation
- Mana NISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20220216172
- Publication date Jul 7, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A STRUCTURE
- Publication number 20220189910
- Publication date Jun 16, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth CAICEDO PANQUEVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220077102
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210343689
- Publication date Nov 4, 2021
- Samsung Electronics Co., Ltd.
- YONGJIN PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20210257226
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS

involving a permanent auxiliary member being left in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a structure

Semiconductor device having high yield strength intermediate plate

Semiconductor device with a multi-layered encapsulant and associate...

Adhesive member, display device, and manufacturing method of displa...

Semiconductor structure including a semiconductor wafer and a surfa...

Chip assembly

Semiconductor packages

Semiconductor structure including a first surface mount component a...

Electronic device and manufacturing method thereof and manufacturin...

Control of under-fill using a film during fabrication for a dual-si...

Control of under-fill using a dam on a packaging substrate for a du...

Semiconductor device, method for manufacturing the same, and power...

Method for electrically contacting a component by galvanic connecti...

Semiconductor device with a multi-layered encapsulant and associate...

Chip-on film and display device including the same

Method and apparatus for creating a bond between objects based on f...

Method, apparatus and system to interconnect packaged integrated ci...

Bond pad reliability of semiconductor devices

Dam for three-dimensional integrated circuit

Method of manufacturing semiconductor device

Under-fill deflash for a dual-sided ball grid array package

Semiconductor device with a multi-layered encapsulant and associate...

Micro-selective sintering laser systems and methods thereof

Curing a heat-curable material in an embedded curing zone

Electronic device package with recessed substrate for underfill con...

Semiconductor packages having an electric device with a recess

Chip assembly

Semiconductor device with a multi-layered encapsulant and associate...

Flexible display panel and preparation method thereof, flexible dis...

Control of under-fill with a packaging substrate having an integrat...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

PACKAGE WITH SOLDER MASK

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

SEMICONDUCTOR MANUFACTURING METHOD

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

Integrated Circuit Package and Method

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...

BARRIERS TO MODULATE UNDERFILL FLOW

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE BOARD COMPRISING SAME

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Display Device

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

DISPLAY APPARATUS

SEMICONDUCTOR PACKAGE INHIBITING VISCOUS MATERIAL SPREAD

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

METHOD FOR MANUFACTURING A STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...