Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device

Industry

CPC
H01L2224/11011

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11011Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and system for verifying integrated circuit stack having pho...
- Patent number 12,068,269
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,040,308
- Issue date Jul 16, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with sacrificial pillars and methods...
- Patent number 11,894,329
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corner guard for improved electroplated first level interconnect bu...
- Patent number 11,776,864
- Issue date Oct 3, 2023
- Intel Corporation
- Jacob Vehonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for verifying integrated circuit stack having pho...
- Patent number 11,670,610
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermally and electrically conductive interconnects
- Patent number 11,637,068
- Issue date Apr 25, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with sacrificial pillars and methods...
- Patent number 11,404,390
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnect structure and method for pre...
- Patent number 11,177,194
- Issue date Nov 16, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 11,094,656
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for a substrate associated with a backside reveal
- Patent number 10,957,661
- Issue date Mar 23, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with dummy bump and method for forming the same
- Patent number 10,872,871
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,692,827
- Issue date Jun 23, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for a substrate associated with a backside reveal
- Patent number 10,418,338
- Issue date Sep 17, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 10,262,965
- Issue date Apr 16, 2019
- Samsung Display Co., Ltd.
- Seung-Soo Ryu
- G02 - OPTICS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,163,826
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for a substrate associated with a backside reveal
- Patent number 9,853,004
- Issue date Dec 26, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,812,415
- Issue date Nov 7, 2017
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for creating environmentally protective coati...
- Patent number 9,601,451
- Issue date Mar 21, 2017
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Joseph Kuczynski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 9,397,060
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
TSV structures and methods for forming the same
- Patent number 9,373,575
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing misshaped solder balls
- Patent number 9,331,037
- Issue date May 3, 2016
- GLOBALFOUNDRIES, INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double solder bumps on substrates for low temperature flip chip bon...
- Patent number 9,295,166
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package structure
- Patent number 9,123,601
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double solder bumps on substrates for low temperature flip chip bon...
- Patent number 8,987,132
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structures and methods for forming the same
- Patent number 8,956,966
- Issue date Feb 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overcoming chip warping to enhance wetting of solder bumps and flip...
- Patent number 8,927,334
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double solder bumps on substrates for low temperature flip chip bon...
- Patent number 8,828,860
- Issue date Sep 9, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR VERIFYING INTEGRATED CIRCUIT STACK
- Publication number 20240355769
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
- Publication number 20240222301
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20240136315
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...
- Publication number 20240047400
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240047397
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...
- Publication number 20230386950
- Publication date Nov 30, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR VERIFYING INTEGRATED CIRCUIT STACK HAVING PHO...
- Publication number 20230268301
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...
- Publication number 20230268303
- Publication date Aug 24, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260936
- Publication date Aug 17, 2023
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230130929
- Publication date Apr 27, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20220328442
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20210407944
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20210375808
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...
- Publication number 20210193559
- Publication date Jun 24, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR VERIFYING INTEGRATED CIRCUIT STACK HAVING PHO...
- Publication number 20210057365
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...
- Publication number 20210020532
- Publication date Jan 21, 2021
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20200211990
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY BUMP AND METHOD FOR FORMING THE SAME
- Publication number 20200203299
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR A SUBSTRATE ASSOCIATED WITH A BACKSIDE REVEAL
- Publication number 20190355683
- Publication date Nov 21, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20190081015
- Publication date Mar 14, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnections for a Substrate Associated with a Backside Reveal
- Publication number 20180102331
- Publication date Apr 12, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180019220
- Publication date Jan 18, 2018
- SAMSUNG DISPLAY CO., LTD.
- Seung-Soo RYU
- G02 - OPTICS
Information Patent Application
APPARATUS AND METHODS FOR CREATING ENVIRONMENTALLY PROTECTIVE COATI...
- Publication number 20170047304
- Publication date Feb 16, 2017
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- JOSEPH KUCZYNSKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTIONS FOR A SUBSTRATE ASSOCIATED WITH A BACKSIDE REVEAL
- Publication number 20170040268
- Publication date Feb 9, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING RESIN-ENCAPSULATED ELECTRONIC COMPONENT, BUMP-...
- Publication number 20150311095
- Publication date Oct 29, 2015
- TOWA CORPORATION
- Hirokazu OKADA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor Devices and Methods of Forming Thereof
- Publication number 20150123264
- Publication date May 7, 2015
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20150021769
- Publication date Jan 22, 2015
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...
- Publication number 20140363965
- Publication date Dec 11, 2014
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TSV Structures and Methods for Forming the Same
- Publication number 20140342547
- Publication date Nov 20, 2014
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for verifying integrated circuit stack having pho...

Method of manufacturing a semiconductor device

Packaged semiconductor device with electroplated pillars

Semiconductor device assembly with sacrificial pillars and methods...

Corner guard for improved electroplated first level interconnect bu...

Method and system for verifying integrated circuit stack having pho...

Thermally and electrically conductive interconnects

Semiconductor device assembly with sacrificial pillars and methods...

Semiconductor device with interconnect structure and method for pre...

Packaged semiconductor device with electroplated pillars

Interconnections for a substrate associated with a backside reveal

Chip package structure with dummy bump and method for forming the same

Packaged microelectronic devices and methods for manufacturing pack...

Interconnections for a substrate associated with a backside reveal

Semiconductor devices and methods of forming thereof

Display device and manufacturing method thereof

Packaged microelectronic devices and methods for manufacturing pack...

Interconnections for a substrate associated with a backside reveal

Packaged microelectronic devices and methods for manufacturing pack...

Apparatus and methods for creating environmentally protective coati...

Semiconductor devices and methods of forming thereof

Package on package structure

TSV structures and methods for forming the same

Preventing misshaped solder balls

Double solder bumps on substrates for low temperature flip chip bon...

Package on package structure

Double solder bumps on substrates for low temperature flip chip bon...

TSV structures and methods for forming the same

Overcoming chip warping to enhance wetting of solder bumps and flip...

Double solder bumps on substrates for low temperature flip chip bon...

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR VERIFYING INTEGRATED CIRCUIT STACK

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...

BUMP STRUCTURE AND METHOD OF MAKING THE SAME

3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...

METHOD AND SYSTEM FOR VERIFYING INTEGRATED CIRCUIT STACK HAVING PHO...

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...

FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...

METHOD AND SYSTEM FOR VERIFYING INTEGRATED CIRCUIT STACK HAVING PHO...

CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...

PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS

CHIP PACKAGE STRUCTURE WITH DUMMY BUMP AND METHOD FOR FORMING THE SAME

INTERCONNECTIONS FOR A SUBSTRATE ASSOCIATED WITH A BACKSIDE REVEAL

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

Interconnections for a Substrate Associated with a Backside Reveal

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

APPARATUS AND METHODS FOR CREATING ENVIRONMENTALLY PROTECTIVE COATI...

INTERCONNECTIONS FOR A SUBSTRATE ASSOCIATED WITH A BACKSIDE REVEAL

METHOD FOR PRODUCING RESIN-ENCAPSULATED ELECTRONIC COMPONENT, BUMP-...

Semiconductor Devices and Methods of Forming Thereof

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...

TSV Structures and Methods for Forming the Same