Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device

Industry

CPC
H01L2224/03011

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03011Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package having different metal densities in different regions and m...
- Patent number 12,165,971
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split RDL connection between die and UBM
- Patent number 12,107,058
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with conductive p...
- Patent number 11,955,446
- Issue date Apr 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Yu-Han Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having different metal densities in different regions and m...
- Patent number 11,769,724
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,616,028
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive polymer liner and me...
- Patent number 11,569,189
- Issue date Jan 31, 2023
- NANYA TECHNOLOGY CORPORATION
- Yu-Han Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip packaging structure
- Patent number 11,552,028
- Issue date Jan 10, 2023
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite semiconductor component having projecting elements projec...
- Patent number 11,527,521
- Issue date Dec 13, 2022
- OSRAM OLED GmbH
- Lutz Hoeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,476,210
- Issue date Oct 18, 2022
- Kabushiki Kaisha Toshiba
- Keiichiro Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure for semiconductor dies
- Patent number 11,373,968
- Issue date Jun 28, 2022
- Cirrus Logic, Inc.
- Yaoyu Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,309,258
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having different metal densities in different regions and m...
- Patent number 11,309,243
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,978,414
- Issue date Apr 13, 2021
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,896,886
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 10,811,365
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a metal barrier
- Patent number 10,797,010
- Issue date Oct 6, 2020
- Texas Instruments Incorporated
- Joel Tomas Medina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 10,707,179
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,607,954
- Issue date Mar 31, 2020
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,586,776
- Issue date Mar 10, 2020
- ABLIC INC.
- Yoichi Mimuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,388,618
- Issue date Aug 20, 2019
- ABLIC INC.
- Takeshi Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,297,562
- Issue date May 21, 2019
- ABLIC INC.
- Kaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,249,584
- Issue date Apr 2, 2019
- ABLIC INC.
- Takeshi Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die bond pad with insulating separator
- Patent number 10,249,583
- Issue date Apr 2, 2019
- Infineon Technologies AG
- Christian Bretthauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bond structure in stacked semiconductor structure
- Patent number 10,062,656
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,984,986
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 9,947,632
- Issue date Apr 17, 2018
- Nexperia B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...
- Publication number 20240387429
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
- Publication number 20240339422
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME
- Publication number 20240162174
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP
- Publication number 20240162177
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Step Seal Ring and Methods Forming...
- Publication number 20230386908
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND M...
- Publication number 20230361025
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230299023
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED LIGHT-EMITTING SUBSTRATE
- Publication number 20230275102
- Publication date Aug 31, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Zhenhai YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND POWER CONVERTER
- Publication number 20230253349
- Publication date Aug 10, 2023
- Mitsubishi Electric Corporation
- Yuji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Bonding Layers In Semiconductor Packages and Methods of Fo...
- Publication number 20230139919
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED PARASITIC CAPACITANCE IN BONDED STRUCTURES
- Publication number 20230122531
- Publication date Apr 20, 2023
- Invensas LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE P...
- Publication number 20230078105
- Publication date Mar 16, 2023
- NANYA TECHNOLOGY CORPORATION
- YU-HAN HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD...
- Publication number 20230065429
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20230061418
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- YONGBUM KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Split RDL Connection Between Die and UBM
- Publication number 20230056780
- Publication date Feb 23, 2023
- STATS ChipPAC Pte Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220406739
- Publication date Dec 22, 2022
- KIOXIA Corporation
- Mizuki TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...
- Publication number 20220392869
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE FOR SEMICONDUCTOR DIES
- Publication number 20220285299
- Publication date Sep 8, 2022
- Cirrus Logic International Semiconductor Ltd.
- Yaoyu PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND M...
- Publication number 20220246524
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20220181269
- Publication date Jun 9, 2022
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220181279
- Publication date Jun 9, 2022
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE POLYMER LINER AND ME...
- Publication number 20220068855
- Publication date Mar 3, 2022
- NANYA TECHNOLOGY CORPORATION
- YU-HAN HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210288006
- Publication date Sep 16, 2021
- Kabushiki Kaisha Toshiba
- Keiichiro Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210066192
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20210020585
- Publication date Jan 21, 2021
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Semiconductor Component and Method for Producing a Compos...
- Publication number 20200411493
- Publication date Dec 31, 2020
- OSRAM OLED GmbH
- Lutz Hoeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200402924
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE FOR SEMICONDUCTOR DIES
- Publication number 20200343206
- Publication date Oct 29, 2020
- Cirrus Logic International Semiconductor Ltd.
- Yaoyu PANG
- H01 - BASIC ELECTRIC ELEMENTS

Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package having different metal densities in different regions and m...

Split RDL connection between die and UBM

Semiconductor device with metal film on surface between passivation...

Semiconductor device with composite conductive features and method...

Method for forming semiconductor device structure with conductive p...

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device having a bond wire o...

Package having different metal densities in different regions and m...

Semiconductor devices having crack-inhibiting structures

Semiconductor device structure with conductive polymer liner and me...

Chip packaging method and chip packaging structure

Composite semiconductor component having projecting elements projec...

Semiconductor device and semiconductor package

Via structure for semiconductor dies

Semiconductor structure

Package having different metal densities in different regions and m...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor devices having discretely located passivation materia...

Semiconductor devices having crack-inhibiting structures

Semiconductor package having a metal barrier

Semiconductor structure and method for forming the same

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor die bond pad with insulating separator

Composite bond structure in stacked semiconductor structure

Semiconductor device and method of manufacturing the same

Semiconductor device and method of making a semiconductor device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...

SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR DEVICE WITH AIR GAP

Semiconductor Package Including Step Seal Ring and Methods Forming...

PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND M...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

CURVED LIGHT-EMITTING SUBSTRATE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND POWER CONVERTER

Seamless Bonding Layers In Semiconductor Packages and Methods of Fo...

REDUCED PARASITIC CAPACITANCE IN BONDED STRUCTURES

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE P...

INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Split RDL Connection Between Die and UBM

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...

VIA STRUCTURE FOR SEMICONDUCTOR DIES

PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND M...

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE POLYMER LINER AND ME...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

Composite Semiconductor Component and Method for Producing a Compos...

SEMICONDUCTOR STRUCTURE

VIA STRUCTURE FOR SEMICONDUCTOR DIES