Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device

Industry

CPC
H01L2224/27011

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27011Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 11,955,402
- Issue date Apr 9, 2024
- Vitesco Technologies GbmH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,456,270
- Issue date Sep 27, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mingxing Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC package comprising perforated foil sheet
- Patent number 11,257,690
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC package comprising perforated foil sheet
- Patent number 10,685,854
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding methods and wafer-bonded structures
- Patent number 10,446,519
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside spacer structures for improved thermal performance
- Patent number 10,153,224
- Issue date Dec 11, 2018
- GLOBALFOUNDRIES Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finish on trace for a thermal compression flip chip (TCFC)
- Patent number 9,269,681
- Issue date Feb 23, 2016
- QUALCOMM Incorporated
- Houssam W. Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor chip assembly with metal pillar an...
- Patent number 7,811,863
- Issue date Oct 12, 2010
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220271000
- Publication date Aug 25, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Mingxing ZUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES
- Publication number 20180269178
- Publication date Sep 20, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SPACER STRUCTURES FOR IMPROVED THERMAL PERFORMANCE
- Publication number 20180076110
- Publication date Mar 15, 2018
- GLOBALFOUNDRIES INC.
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Package Comprising Perforated Foil Sheet
- Publication number 20170250092
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH RAISED FEATURE
- Publication number 20160343684
- Publication date Nov 24, 2016
- Innovative Micro Technology
- Christopher S. GUDEMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC)
- Publication number 20140138831
- Publication date May 22, 2014
- QUALCOMM Incorporated
- Houssam W. Jomaa
- H01 - BASIC ELECTRIC ELEMENTS

Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor component and method for producing a power semi...

Semiconductor structure and manufacturing method thereof

3DIC package comprising perforated foil sheet

3DIC package comprising perforated foil sheet

Wafer bonding methods and wafer-bonded structures

Backside spacer structures for improved thermal performance

Surface finish on trace for a thermal compression flip chip (TCFC)

Method of making a semiconductor chip assembly with metal pillar an...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES

BACKSIDE SPACER STRUCTURES FOR IMPROVED THERMAL PERFORMANCE

3DIC Package Comprising Perforated Foil Sheet

THERMOCOMPRESSION BONDING WITH RAISED FEATURE

SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC)