Involving a self-assembly process

Industry

CPC
H01L2224/83886

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83886Involving a self-assembly process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 11,710,812
- Issue date Jul 25, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 11,024,782
- Issue date Jun 1, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 10,643,980
- Issue date May 5, 2020
- Epistar Corporation
- Min-Hsun Hsieh
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,622,325
- Issue date Apr 14, 2020
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,170,440
- Issue date Jan 1, 2019
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow film, solder bump formation method, solder joint formation m...
- Patent number 9,656,353
- Issue date May 23, 2017
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 9,462,736
- Issue date Oct 4, 2016
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for producing component mounting board
- Patent number 9,237,686
- Issue date Jan 12, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridging arrangement and method for manufacturing a bridging arrang...
- Patent number 9,230,830
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridging arrangement and method for manufacturing a bridging arrang...
- Patent number 8,951,445
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor electronic component and semiconductor device using t...
- Patent number 8,629,564
- Issue date Jan 14, 2014
- Sumitomo Bakelite Co., Ltd.
- Satoru Katsurayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 8,420,722
- Issue date Apr 16, 2013
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive tape and semiconductor device using the same
- Patent number 8,319,350
- Issue date Nov 27, 2012
- Sumitomo Bakelite Co., Ltd.
- Satoru Katsurayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of joining electronic component and the electronic component
- Patent number 8,304,338
- Issue date Nov 6, 2012
- Panasonic Corporation
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 8,283,246
- Issue date Oct 9, 2012
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 8,217,403
- Issue date Jul 10, 2012
- Napra Co., Ltd
- Shigenobu Sekine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip connection structure having powder-like conductive substa...
- Patent number 8,097,958
- Issue date Jan 17, 2012
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted body and method for manufacturing the same
- Patent number 8,039,307
- Issue date Oct 18, 2011
- Panasonic Corporation
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 8,039,757
- Issue date Oct 18, 2011
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 8,012,801
- Issue date Sep 6, 2011
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting electronic components, method for forming bum...
- Patent number 7,963,310
- Issue date Jun 21, 2011
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,951,700
- Issue date May 31, 2011
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting method and bump formation method
- Patent number 7,927,997
- Issue date Apr 19, 2011
- Panasonic Corporation
- Koichi Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 7,921,551
- Issue date Apr 12, 2011
- Panasonic Corporation
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mutually connecting substrates, flip chip mounting body,...
- Patent number 7,919,357
- Issue date Apr 5, 2011
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal particles-dispersed composition and flip chip mounting proces...
- Patent number 7,910,403
- Issue date Mar 22, 2011
- Panasonic Corporation
- Koichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20230017939
- Publication date Jan 19, 2023
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...
- Publication number 20210288232
- Publication date Sep 16, 2021
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20210151405
- Publication date May 20, 2021
- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...
- Publication number 20200266177
- Publication date Aug 20, 2020
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20200227371
- Publication date Jul 16, 2020
- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317915
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317918
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...
- Publication number 20140252607
- Publication date Sep 11, 2014
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD
- Publication number 20140158751
- Publication date Jun 12, 2014
- PANASONIC CORPORATION
- Koji Motomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF
- Publication number 20130277092
- Publication date Oct 24, 2013
- Nitto Denko Corporation
- Hirofumi EBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20130200135
- Publication date Aug 8, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...
- Publication number 20120319268
- Publication date Dec 20, 2012
- Tomohiro Kagimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...
- Publication number 20120261174
- Publication date Oct 18, 2012
- Toshiaki Chuma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BRIDGING ARRANGEMENT AND METHOD FOR MANUFACTURING A BRIDGING ARRANG...
- Publication number 20120261819
- Publication date Oct 18, 2012
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS...
- Publication number 20120214010
- Publication date Aug 23, 2012
- Tomohiro Kagimoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND...
- Publication number 20120183781
- Publication date Jul 19, 2012
- SUMITOMO BAKELITE CO., LTD.
- Toshiaki Chuma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD
- Publication number 20110162578
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Koichi Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCES...
- Publication number 20110133137
- Publication date Jun 9, 2011
- Koichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONNECTING ELECTRONIC COMPONENTS, METHOD FOR FORMING BUM...
- Publication number 20110049218
- Publication date Mar 3, 2011
- PANASONIC CORPORATION
- Tsukasa SHIRAISHI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD OF JOINING ELECTRONIC COMPONENT AND THE ELECTRONIC COMPONENT
- Publication number 20100244283
- Publication date Sep 30, 2010
- PANASONIC CORPORATION
- Norihito Tsukahara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100224986
- Publication date Sep 9, 2010
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive Tape, Semiconductor Package and Electronics
- Publication number 20100155964
- Publication date Jun 24, 2010
- SUMITOMO BAKELITE CO., LTD.
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY
- Publication number 20100148376
- Publication date Jun 17, 2010
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING T...
- Publication number 20100102446
- Publication date Apr 29, 2010
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20100078830
- Publication date Apr 1, 2010
- SUMITOMO BAKELITE CO., LTD.
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20100006625
- Publication date Jan 14, 2010
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...
- Publication number 20100001411
- Publication date Jan 7, 2010
- Susumu SAWADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
- Publication number 20090229120
- Publication date Sep 17, 2009
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Involving a self-assembly process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Light-emitting device, manufacturing method thereof and display mod...

Semiconductor device and a method of manufacturing thereof

Light-emitting device, manufacturing method thereof and display mod...

Semiconductor device and a method of manufacturing thereof

Light-emitting device, manufacturing method thereof and display mod...

Semiconductor device and a method of manufacturing thereof

Semiconductor device and a method of manufacturing thereof

Reflow film, solder bump formation method, solder joint formation m...

Composition and methods of forming solder bump and flip chip using...

Method and system for producing component mounting board

Bridging arrangement and method for manufacturing a bridging arrang...

Bridging arrangement and method for manufacturing a bridging arrang...

Flip-chip mounting resin composition and bump forming resin composi...

Semiconductor electronic component and semiconductor device using t...

Composition and methods of forming solder bump and flip chip using...

Adhesive tape and semiconductor device using the same

Method of joining electronic component and the electronic component

Flip chip mounting method and bump forming method

Electronic device

Flip chip connection structure having powder-like conductive substa...

Mounted body and method for manufacturing the same

Electronic part mounting substrate and method for producing same

Flip chip mounting process and flip chip assembly

Method for connecting electronic components, method for forming bum...

Flip chip mounting method and bump forming method

Flip-chip mounting method and bump formation method

Electronic component mounting method

Method for mutually connecting substrates, flip chip mounting body,...

Metal particles-dispersed composition and flip chip mounting proces...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...

METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD

JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...

BRIDGING ARRANGEMENT AND METHOD FOR MANUFACTURING A BRIDGING ARRANG...

CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS...

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD

METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCES...

METHOD FOR CONNECTING ELECTRONIC COMPONENTS, METHOD FOR FORMING BUM...

METHOD OF JOINING ELECTRONIC COMPONENT AND THE ELECTRONIC COMPONENT

MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME

Adhesive Tape, Semiconductor Package and Electronics

FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY

SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING T...

ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...

BUMP FORMING METHOD AND BUMP FORMING APPARATUS