involving a temporary auxiliary member not forming part of the bonding apparatus

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H01L2224/83001

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83001involving a temporary auxiliary member not forming part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
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- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
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- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,901,342
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package containing device dies and interconnect die and redistribut...
- Patent number 11,532,585
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
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- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for die and clip attachment
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- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,222,874
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect chips
- Patent number 10,867,954
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
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- Issue date Oct 6, 2020
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor packages including reinforceme...
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- Issue date Sep 8, 2020
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- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect chips
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- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
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- Issue date Oct 29, 2019
- Mitsubishi Electric Corporation
- Takuya Hamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
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- Issue date Aug 27, 2019
- Denso Corporation
- Yuuki Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for expanding spacings in light-emitting element array
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- Issue date May 14, 2019
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- Yu-Chu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
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- Issue date Apr 23, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 10,252,514
- Issue date Apr 9, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 10,242,970
- Issue date Mar 26, 2019
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 9,935,030
- Issue date Apr 3, 2018
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for arranging electronic switching elements, electronic swit...
- Patent number 9,917,070
- Issue date Mar 13, 2018
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Occam process for components having variations in part dimensions
- Patent number 9,894,771
- Issue date Feb 13, 2018
- Joseph Charles Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,793,180
- Issue date Oct 17, 2017
- Amkor Technology, Inc.
- Seo Yeon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulatd semiconductor device and method of manufacturing...
- Patent number 9,728,478
- Issue date Aug 8, 2017
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,673,167
- Issue date Jun 6, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Packaged semiconductor devices having ribbon wires
- Patent number 9,570,325
- Issue date Feb 14, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Liqiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,550,353
- Issue date Jan 24, 2017
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,468,136
- Issue date Oct 11, 2016
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum thermal bonding apparatus
- Patent number 9,451,708
- Issue date Sep 20, 2016
- MIKADO TECHNOS CO., LTD.
- Takashi Ito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,434,150
- Issue date Sep 6, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 9,362,259
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,358,775
- Issue date Jun 7, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...
- Publication number 20240421116
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274571
- Publication date Aug 15, 2024
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...
- Publication number 20240258261
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20240186298
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- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Chips
- Publication number 20230124804
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...
- Publication number 20220157773
- Publication date May 19, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20220130807
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Chips
- Publication number 20210098408
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20200126815
- Publication date Apr 23, 2020
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Chips
- Publication number 20200027851
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20190189597
- Publication date Jun 20, 2019
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EXPANDING SPACINGS IN LIGHT-EMITTING ELEMENT ARRAY
- Publication number 20180240941
- Publication date Aug 23, 2018
- PlayNitride Inc.
- YU-CHU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20180001614
- Publication date Jan 4, 2018
- X-Celeprint Limited
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SELECTIVE LASER-ASSISTED TRANSFER OF DISCRETE COMPONENTS
- Publication number 20170313044
- Publication date Nov 2, 2017
- NDSU Research Foundation
- Val R. Marinov
- B32 - LAYERED PRODUCTS
Information Patent Application
3D MICROMOLD AND PATTERN TRANSFER
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- Publication date Aug 24, 2017
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20170207193
- Publication date Jul 20, 2017
- X-Celeprint Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR ARRANGING ELECTRONIC SWITCHING ELEMENTS, ELECTRONIC SWIT...
- Publication number 20170170141
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- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20170103964
- Publication date Apr 13, 2017
- X-Celeprint Limited
- Christopher Andrew Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
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COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL
- Publication number 20140374925
- Publication date Dec 25, 2014
- Elizabeth A. LOGAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Producing a Semiconductor Module by Using an Adhesion Ca...
- Publication number 20140363925
- Publication date Dec 11, 2014
- Michael Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140346643
- Publication date Nov 27, 2014
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
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- Publication number 20140295594
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- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC COMPONENT BONDING METHOD
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- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
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SELECTIVE LASER-ASSISTED TRANSFER OF DISCRETE COMPONENTS
- Publication number 20140238592
- Publication date Aug 28, 2014
- NDSU Research Foundation
- Val R. Marinov
- B32 - LAYERED PRODUCTS
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- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
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- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED BALL GRID ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140170815
- Publication date Jun 19, 2014
- Tae Sung JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And System For A Semiconductor Device Package With A Die-To-...
- Publication number 20140134803
- Publication date May 15, 2014
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140124899
- Publication date May 8, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY

involving a temporary auxiliary member not forming part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure sintering device and method for manufacturing an electroni...

Encapsulated package including device dies connected via interconne...

Discontinuous patterned bonds for semiconductor devices and associa...

Package containing device dies and interconnect die and redistribut...

Apparatus and methods for micro-transfer-printing

Method for die and clip attachment

Discontinuous patterned bonds for semiconductor devices and associa...

Interconnect chips

Manufacturing method of package structure

Methods of fabricating semiconductor packages including reinforceme...

Interconnect chips

Semiconductor device and manufacturing method therefor

Semiconductor device and manufacturing method for the same

Method for expanding spacings in light-emitting element array

Semiconductor device and manufacturing method of semiconductor device

Apparatus and methods for micro-transfer-printing

Discontinuous patterned bonds for semiconductor devices and associa...

Resin-encapsulated semiconductor device

Method for arranging electronic switching elements, electronic swit...

Occam process for components having variations in part dimensions

Semiconductor device and manufacturing method thereof

Resin-encapsulatd semiconductor device and method of manufacturing...

Method for bonding substrates

Packaged semiconductor devices having ribbon wires

Apparatus and methods for micro-transfer-printing

Low void solder joint for multiple reflow applications

Vacuum thermal bonding apparatus

Apparatus and methods for micro-transfer-printing

Discontinuous patterned bonds for semiconductor devices and associa...

Apparatus and methods for micro-transfer-printing

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...

SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

Interconnect Chips

PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

Interconnect Chips

MANUFACTURING METHOD OF PACKAGE STRUCTURE

Interconnect Chips

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

METHOD FOR EXPANDING SPACINGS IN LIGHT-EMITTING ELEMENT ARRAY

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

SELECTIVE LASER-ASSISTED TRANSFER OF DISCRETE COMPONENTS

3D MICROMOLD AND PATTERN TRANSFER

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

METHOD FOR ARRANGING ELECTRONIC SWITCHING ELEMENTS, ELECTRONIC SWIT...

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL

Method for Producing a Semiconductor Module by Using an Adhesion Ca...

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

ELECTRONIC COMPONENT BONDING METHOD

SELECTIVE LASER-ASSISTED TRANSFER OF DISCRETE COMPONENTS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

EMBEDDED BALL GRID ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF

Method And System For A Semiconductor Device Package With A Die-To-...

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES