Involving a temporary auxiliary member not forming part of the manufacturing apparatus

Industry

CPC
H01L2224/03001

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03001Involving a temporary auxiliary member not forming part of the manufacturing apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit features with obtuse angles and method of formin...
- Patent number 12,087,715
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure coupled to multiple interconnect conductive\ str...
- Patent number 11,990,433
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,798,905
- Issue date Oct 24, 2023
- Lapis Semiconductor Co., Ltd.
- Takashi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer printing method and transfer printing apparatus
- Patent number 11,538,786
- Issue date Dec 27, 2022
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Xinglong Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 11,532,524
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit features with obtuse angles and method of formin...
- Patent number 11,495,558
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Copper electroplating compositions and methods of electroplating co...
- Patent number 10,927,468
- Issue date Feb 23, 2021
- Rohm and Haas Electronic Materials LLC
- Ravi Pokhrel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit features with obtuse angles and method forming same
- Patent number 10,861,807
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of fabricating semiconductor structures including cavities...
- Patent number 10,703,627
- Issue date Jul 7, 2020
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Copper electroplating compositions and methods of electroplating co...
- Patent number 10,612,148
- Issue date Apr 7, 2020
- Rohm and Haas Electronic Materials LLC
- Ravi Pokhrel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating compositions and methods of electroplating co...
- Patent number 10,533,259
- Issue date Jan 14, 2020
- Rohm and Haas Electronic Materials LLC
- Ravi Pokhrel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package device
- Patent number 10,522,439
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly with enhanced interconnects and method for fa...
- Patent number 10,403,591
- Issue date Sep 3, 2019
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a bump contact on a TSV comprising a cavi...
- Patent number 10,217,715
- Issue date Feb 26, 2019
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,096,564
- Issue date Oct 9, 2018
- J-DEVICES CORPORATION
- Toshiyuki Inaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and manufacturing method thereof
- Patent number 9,978,657
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with under bump metallization a...
- Patent number 9,865,554
- Issue date Jan 9, 2018
- STATS ChipPAC Ptc. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assembly including a chip carrier, semiconduct...
- Patent number 9,768,120
- Issue date Sep 19, 2017
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating connection structure for a substrate
- Patent number 9,666,548
- Issue date May 30, 2017
- Siliconware Precision Industries Co., Ltd.
- Chih-Sheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor substrate and manufacturing method thereof
- Patent number 9,653,416
- Issue date May 16, 2017
- Olympus Corporation
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 9,583,451
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor wafer
- Patent number 9,059,273
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Petra Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device and method of formation thereof
- Patent number 9,034,677
- Issue date May 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive pads defined by embedded traces
- Patent number 8,772,908
- Issue date Jul 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device having recessed bondin...
- Patent number 8,580,594
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive pads defined by embedded traces
- Patent number 8,432,045
- Issue date Apr 30, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fused buss for plating features on a semiconductor die
- Patent number 8,349,666
- Issue date Jan 8, 2013
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having an array of resilient leads
- Patent number 6,891,255
- Issue date May 10, 2005
- Tessera, Inc.
- John W. Smith
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FEATURES WITH OBTUSE ANGLES AND METHOD OF FORMIN...
- Publication number 20240363561
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER
- Publication number 20240162175
- Publication date May 16, 2024
- STMicroelectronics S.r.l.
- Lucrezia GUARINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
- Publication number 20240120298
- Publication date Apr 11, 2024
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE COUPLED TO MULTIPLE INTERCONNECT CONDUCTIVE\ STR...
- Publication number 20230395540
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230299023
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Features with Obtuse Angles and Method of Formin...
- Publication number 20230116270
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device And Method Of Manufacturing The Same
- Publication number 20230026305
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF
- Publication number 20220367296
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE COUPLED TO MULTIPLE INTERCONNECT CONDUCTIVE\ STR...
- Publication number 20220344291
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CIRCUIT
- Publication number 20220173000
- Publication date Jun 2, 2022
- InnoLux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220102300
- Publication date Mar 31, 2022
- LAPIS SEMICONDUCTOR CO., LTD.
- Takashi SHIMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF
- Publication number 20220028748
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Features with Obtuse Angles and Method of Formin...
- Publication number 20210074656
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...
- Publication number 20200331750
- Publication date Oct 22, 2020
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Circuit Features With Obtuse Angles and Method Forming Same
- Publication number 20200161260
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER ELECTROPLATING COMPOSITIONS AND METHODS OF ELECTROPLATING CO...
- Publication number 20190136395
- Publication date May 9, 2019
- Rohm and Haas Electronic Materials L.L.C.
- Ravi POKHREL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING COMPOSITIONS AND METHODS OF ELECTROPLATING CO...
- Publication number 20190136396
- Publication date May 9, 2019
- Rohm and Haas Electronic Materials L.L.C.
- Ravi POKHREL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...
- Publication number 20190131265
- Publication date May 2, 2019
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE METHOD FOR GENERATING PACKAGE STRUCTURE WITH FAN-OUT INTERF...
- Publication number 20190057931
- Publication date Feb 21, 2019
- Powertech Technology Inc.
- Hung-Hsin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20180269124
- Publication date Sep 20, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- NAI-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170317045
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Toshiyuki INAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170011981
- Publication date Jan 12, 2017
- NAI-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20160372430
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION AND POLYM...
- Publication number 20150279794
- Publication date Oct 1, 2015
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING CONNECTION STRUCTURE FOR A SUBSTRATE
- Publication number 20150214169
- Publication date Jul 30, 2015
- Siliconware Precision Industries Co., Ltd.
- Chih-Sheng Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MEMS Device and Method of Formation Thereof
- Publication number 20140248730
- Publication date Sep 4, 2014
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...
- Publication number 20140138833
- Publication date May 22, 2014
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS

Involving a temporary auxiliary member not forming part of the manufacturing apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit features with obtuse angles and method of formin...

Semiconductor device with composite conductive features and method...

Bond pad structure coupled to multiple interconnect conductive\ str...

Semiconductor device and method for manufacturing semiconductor device

Transfer printing method and transfer printing apparatus

Integrated circuit test method and structure thereof

Integrated circuit features with obtuse angles and method of formin...

Copper electroplating compositions and methods of electroplating co...

Integrated circuit features with obtuse angles and method forming same

Methods of fabricating semiconductor structures including cavities...

Copper electroplating compositions and methods of electroplating co...

Copper electroplating compositions and methods of electroplating co...

Semiconductor package device

Chip package assembly with enhanced interconnects and method for fa...

Semiconductor device with a bump contact on a TSV comprising a cavi...

Manufacturing method of semiconductor package

Semiconductor package device and manufacturing method thereof

Integrated circuit packaging system with under bump metallization a...

Conductive connections, structures with such connections, and metho...

Semiconductor device assembly including a chip carrier, semiconduct...

Method of fabricating connection structure for a substrate

Semiconductor substrate and manufacturing method thereof

Conductive pillar shaped for solder confinement

Methods for processing a semiconductor wafer

MEMS device and method of formation thereof

Conductive pads defined by embedded traces

Method of fabricating a semiconductor device having recessed bondin...

Conductive pads defined by embedded traces

Fused buss for plating features on a semiconductor die

Microelectronic packages having an array of resilient leads

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

INTEGRATED CIRCUIT FEATURES WITH OBTUSE ANGLES AND METHOD OF FORMIN...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER

SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...

BOND PAD STRUCTURE COUPLED TO MULTIPLE INTERCONNECT CONDUCTIVE\ STR...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

Integrated Circuit Features with Obtuse Angles and Method of Formin...

Semiconductor Device And Method Of Manufacturing The Same

INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF

BOND PAD STRUCTURE COUPLED TO MULTIPLE INTERCONNECT CONDUCTIVE\ STR...

MANUFACTURING METHOD OF PACKAGE CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF

Integrated Circuit Features with Obtuse Angles and Method of Formin...

METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...

Integrated Circuit Features With Obtuse Angles and Method Forming Same

COPPER ELECTROPLATING COMPOSITIONS AND METHODS OF ELECTROPLATING CO...

COPPER ELECTROPLATING COMPOSITIONS AND METHODS OF ELECTROPLATING CO...

CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...

PACKAGE METHOD FOR GENERATING PACKAGE STRUCTURE WITH FAN-OUT INTERF...

SEMICONDUCTOR PACKAGE DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION AND POLYM...

METHOD OF FABRICATING CONNECTION STRUCTURE FOR A SUBSTRATE

MEMS Device and Method of Formation Thereof

Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...