Involving a temporary auxiliary member not forming part of the manufacturing apparatus

Industry

CPC
H01L2224/11001

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11001Involving a temporary auxiliary member not forming part of the manufacturing apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding method, display backplane and system for manufacturing disp...
- Patent number 12,015,113
- Issue date Jun 18, 2024
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Shoujun Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk acoustic wave resonator and method of manufacturing the same
- Patent number 11,838,001
- Issue date Dec 5, 2023
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer carrier for micro light-emitting element
- Patent number 11,450,785
- Issue date Sep 20, 2022
- PlayNitride Inc.
- Tzu-Yu Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 11,270,964
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bump planarity control
- Patent number 11,145,612
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive micro pin
- Patent number 11,101,232
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Jui Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Component tethers with spacers
- Patent number 11,088,007
- Issue date Aug 10, 2021
- X-CELEPRINT LIMITED
- Alin Mihai Fecioru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,081,459
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with vertical interc...
- Patent number 11,056,453
- Issue date Jul 6, 2021
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing micro light-emitting element array, transfe...
- Patent number 10,991,846
- Issue date Apr 27, 2021
- PLAYNITRIDE INC.
- Tzu-Yu Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indium bump liftoff process on micro-machined silicon substrates
- Patent number 10,923,446
- Issue date Feb 16, 2021
- UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA.
- Ari Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process of element chip
- Patent number 10,923,362
- Issue date Feb 16, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,818,623
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,790,250
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,790,253
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process of element chip
- Patent number 10,763,124
- Issue date Sep 1, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid discharge device, fluid discharge method, and fluid applicati...
- Patent number 10,632,492
- Issue date Apr 28, 2020
- Senju Metal Industry Co., Ltd.
- Takashi Nauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,600,751
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages including the same...
- Patent number 10,580,726
- Issue date Mar 3, 2020
- Samsung Electronics Co., Ltd.
- Jin-Ho Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,483,226
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor detector, methods for manufa...
- Patent number 10,468,365
- Issue date Nov 5, 2019
- SHIMADZU CORPORATION
- Hiroyuki Kishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ball and electronic device
- Patent number 10,446,512
- Issue date Oct 15, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package assembly with enhanced interconnects and method for fa...
- Patent number 10,403,591
- Issue date Sep 3, 2019
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,290,599
- Issue date May 14, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,249,586
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Robust pillar structure for semicondcutor device contacts
- Patent number 10,236,268
- Issue date Mar 19, 2019
- Amkor Technology, Inc.
- Karthikeyan Dhandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,192,839
- Issue date Jan 29, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND A PACKAGING METHOD
- Publication number 20240371812
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240072752
- Publication date Feb 29, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...
- Publication number 20240047227
- Publication date Feb 8, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230105710
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hyekyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR REMOVING PHOTORESIST
- Publication number 20220285172
- Publication date Sep 8, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Yukihide NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERC...
- Publication number 20200402941
- Publication date Dec 24, 2020
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS OF ELEMENT CHIP
- Publication number 20200357654
- Publication date Nov 12, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Atsushi HARIKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20200083188
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200035634
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20190326239
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP PLANARITY CONTROL
- Publication number 20190206820
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20190164921
- Publication date May 30, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190148325
- Publication date May 16, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...
- Publication number 20190131265
- Publication date May 2, 2019
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIBATH PLATING OF A SINGLE METAL
- Publication number 20190122890
- Publication date Apr 25, 2019
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONDUCTIVE MICRO PIN
- Publication number 20190074259
- Publication date Mar 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Jui HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...
- Publication number 20180331061
- Publication date Nov 15, 2018
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED UBM AND MIXED PITCH ON A SINGLE DIE
- Publication number 20180331056
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DETECTOR, METHODS FOR MANUFA...
- Publication number 20180331060
- Publication date Nov 15, 2018
- Shimadzu Corporation
- Hiroyuki KISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID DISCHARGE DEVICE, FLUID DISCHARGE METHOD, AND FLUID APPLICATI...
- Publication number 20180021803
- Publication date Jan 25, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Takashi NAUCHI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...
- Publication number 20170133336
- Publication date May 11, 2017
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MICRO PINS AND ISOLATED CONDUCTIVE MICRO PIN
- Publication number 20160254239
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Jui HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLDER TRANSFER SHEET
- Publication number 20160250719
- Publication date Sep 1, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CONNECTION STRUCTURE FOR A SUBSTRATE
- Publication number 20150214169
- Publication date Jul 30, 2015
- Siliconware Precision Industries Co., Ltd.
- Chih-Sheng Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR HANDLING VERY THIN DEVICE WAFERS
- Publication number 20150162290
- Publication date Jun 11, 2015
- Intel Corporation
- KEVIN J. LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE INCLUDING NANO-WIRES AND A BODY CONNECTING ENDS OF T...
- Publication number 20140147974
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE FOR A SUBSTRATE AND A METHOD OF FABRICATING TH...
- Publication number 20140131072
- Publication date May 15, 2014
- Siliconware Precision Industries Co., Ltd.
- Chih-Sheng Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
OVERCOMING CHIP WARPING TO ENHANCE WETTING OF SOLDER BUMPS AND FLIP...
- Publication number 20140084453
- Publication date Mar 27, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON...
- Publication number 20140069817
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Bing Dang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Involving a temporary auxiliary member not forming part of the manufacturing apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding method, display backplane and system for manufacturing disp...

Bulk acoustic wave resonator and method of manufacturing the same

Transfer carrier for micro light-emitting element

Mixed UBM and mixed pitch on a single die

Methods for bump planarity control

Conductive micro pin

Component tethers with spacers

Semiconductor device

Stackable fully molded semiconductor structure with vertical interc...

Assembly comprising hybrid interconnecting means including intermed...

Method of manufacturing micro light-emitting element array, transfe...

Indium bump liftoff process on micro-machined silicon substrates

Manufacturing process of element chip

Mixed UBM and mixed pitch on a single die

Method for manufacturing semiconductor device

Conductive pillar shaped for solder confinement

Manufacturing process of element chip

Fluid discharge device, fluid discharge method, and fluid applicati...

Conductive pillar shaped for solder confinement

Semiconductor devices and semiconductor packages including the same...

Semiconductor device and method of forming the same

Semiconductor device and semiconductor detector, methods for manufa...

Conductive ball and electronic device

Chip package assembly with enhanced interconnects and method for fa...

Interconnect structures for assembly of semiconductor structures in...

Conductive pillar shaped for solder confinement

Mixed UBM and mixed pitch on a single die

Interconnect structure and semiconductor structures for assembly of...

Robust pillar structure for semicondcutor device contacts

Conductive pillar shaped for solder confinement

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND A PACKAGING METHOD

BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COMPOSITION FOR REMOVING PHOTORESIST

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERC...

MANUFACTURING PROCESS OF ELEMENT CHIP

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

BUMP PLANARITY CONTROL

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...

MULTIBATH PLATING OF A SINGLE METAL

CONDUCTIVE MICRO PIN

INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...

MIXED UBM AND MIXED PITCH ON A SINGLE DIE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DETECTOR, METHODS FOR MANUFA...

FLUID DISCHARGE DEVICE, FLUID DISCHARGE METHOD, AND FLUID APPLICATI...

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...

METHOD OF MANUFACTURING MICRO PINS AND ISOLATED CONDUCTIVE MICRO PIN

SOLDER TRANSFER SHEET

METHOD OF FABRICATING CONNECTION STRUCTURE FOR A SUBSTRATE

METHOD FOR HANDLING VERY THIN DEVICE WAFERS

BUMP STRUCTURE INCLUDING NANO-WIRES AND A BODY CONNECTING ENDS OF T...

CONNECTION STRUCTURE FOR A SUBSTRATE AND A METHOD OF FABRICATING TH...

OVERCOMING CHIP WARPING TO ENHANCE WETTING OF SOLDER BUMPS AND FLIP...

DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON...