Involving a temporary auxiliary member not forming part of the manufacturing apparatus

Follow

Industry

CPC
H01L2224/43001

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/43001Involving a temporary auxiliary member not forming part of the manufacturing apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked semiconductor chips and met...
- Patent number 11,133,287
- Issue date Sep 28, 2021
- SK hynix Inc.
- Jae-Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 10,600,754
- Issue date Mar 24, 2020
- Kaijo Corporation
- Hideki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection pads for low cross-talk vertical wirebonds
- Patent number 10,580,756
- Issue date Mar 3, 2020
- Intel Corporation
- Hungying L. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device by laser-induced forming and transfer of shaped m...
- Patent number 10,297,565
- Issue date May 21, 2019
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced forming and transfer of shaped metallic interconnects
- Patent number 9,685,349
- Issue date Jun 20, 2017
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20210057379
- Publication date Feb 25, 2021
- SK HYNIX INC.
- Jae-Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20190164928
- Publication date May 30, 2019
- KAIJO CORPORATION
- Hideki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION PADS FOR LOW CROSS-TALK VERTICAL WIREBONDS
- Publication number 20180323173
- Publication date Nov 8, 2018
- Intel Corporation
- Hungying L. LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
- Publication number 20170103902
- Publication date Apr 13, 2017
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING RIBBON WIRES
- Publication number 20160190086
- Publication date Jun 30, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LIQIANG XU
- H01 - BASIC ELECTRIC ELEMENTS