involving forming a eutectic alloy at the bonding interface

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CPC
H01L2224/85805

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85805involving forming a eutectic alloy at the bonding interface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Lead-free soldering method and soldered article
- Patent number 10,002,845
- Issue date Jun 19, 2018
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a microelectronic chip element on a wire elem...
- Patent number 9,953,953
- Issue date Apr 24, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with lead extensions and related methods
- Patent number 8,674,487
- Issue date Mar 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Lin-Wang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection element for a semiconductor component and method for pro...
- Patent number 8,581,371
- Issue date Nov 12, 2013
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating conductive non-metallic self-passivating non-...
- Patent number 4,761,386
- Issue date Aug 2, 1988
- National Semiconductor Corporation
- Matthew S. Buynoski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE
- Publication number 20170012018
- Publication date Jan 12, 2017
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ASSEMBLING A MICROELECTRONIC CHIP ELEMENT ON A WIRE ELEM...
- Publication number 20150024589
- Publication date Jan 22, 2015
- COMMISSARIAT A L'ENERGIE ATOMIQUE AUX ENERGIES ALTERNATIVES
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...
- Publication number 20130285056
- Publication date Oct 31, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS
- Publication number 20130241041
- Publication date Sep 19, 2013
- Lin-Wang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection element for a semiconductor component and method for pro...
- Publication number 20070018338
- Publication date Jan 25, 2007
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS

involving forming a eutectic alloy at the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead-free soldering method and soldered article

Method for assembling a microelectronic chip element on a wire elem...

Semiconductor structure with low-melting-temperature conductive reg...

Chip package and method of forming the same

Semiconductor packages with lead extensions and related methods

Connection element for a semiconductor component and method for pro...

Method of fabricating conductive non-metallic self-passivating non-...

Patents Applicationslast 30 patents

LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE

METHOD FOR ASSEMBLING A MICROELECTRONIC CHIP ELEMENT ON A WIRE ELEM...

SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...

CHIP PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS

Connection element for a semiconductor component and method for pro...