involving forming a eutectic alloy at the bonding interface

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CPC
H01L2224/81805

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81805involving forming a eutectic alloy at the bonding interface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display device and manufacturing method thereof
- Patent number 11,862,614
- Issue date Jan 2, 2024
- PlayNitride Display Co., Ltd.
- Yu-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 11,837,585
- Issue date Dec 5, 2023
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 11,776,942
- Issue date Oct 3, 2023
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using optoelectronic semiconductor stamp to manufacture o...
- Patent number 11,538,785
- Issue date Dec 27, 2022
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,527,502
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for temporarily fastening a semiconductor chip to a surface,...
- Patent number 11,521,946
- Issue date Dec 6, 2022
- OSRAM OLED GmbH
- Klaus Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 11,488,899
- Issue date Nov 1, 2022
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 11,393,967
- Issue date Jul 19, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin 3D fan-out embedded wafer level package (EWLB) for application...
- Patent number 11,251,154
- Issue date Feb 15, 2022
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,211,261
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,145,624
- Issue date Oct 12, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for packaging component
- Patent number 11,101,239
- Issue date Aug 24, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction structure
- Patent number 11,088,308
- Issue date Aug 10, 2021
- TDK Corporation
- Takasi Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,075,155
- Issue date Jul 27, 2021
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination device
- Patent number 10,989,396
- Issue date Apr 27, 2021
- Epistar Corporation
- Chih-Ping Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS devices and methods of forming the same
- Patent number 10,981,779
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Contact pad for semiconductor device
- Patent number 10,930,605
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 10,916,688
- Issue date Feb 9, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pillar in a film-type seconductor package
- Patent number 10,867,948
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 10,861,811
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 10,854,584
- Issue date Dec 1, 2020
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having individual wrapping of electronic package...
- Patent number 10,797,034
- Issue date Oct 6, 2020
- Gio Optoelectronics Corp.
- Chin-Tang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,790,221
- Issue date Sep 29, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230402442
- Publication date Dec 14, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS OF TRANSFERRING DIES AND DIE BONDED STRUCTURES
- Publication number 20230307268
- Publication date Sep 28, 2023
- Vanguard International Semiconductor Corporation
- Yung-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230117132
- Publication date Apr 20, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pad for Semiconductor Device
- Publication number 20230112750
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20230088776
- Publication date Mar 23, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220302095
- Publication date Sep 22, 2022
- Japan Display Inc.
- Kenichi TAKEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20220285596
- Publication date Sep 8, 2022
- XIAMEN SANAN OPTOELECTRONICS CO., LTD.
- Shiwei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package on Package Structure, Packaging Method Thereof, and El...
- Publication number 20220262751
- Publication date Aug 18, 2022
- Huawei Technologies Co., Ltd
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220157789
- Publication date May 19, 2022
- PlayNitride Display Co., Ltd.
- Yu-Hung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Temporarily Fastening a Semiconductor Chip to a Surface,...
- Publication number 20210183800
- Publication date Jun 17, 2021
- OSRAM OLED GmbH
- Klaus Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pad for Semiconductor Device
- Publication number 20210175191
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20210126176
- Publication date Apr 29, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20210118833
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING OPTOELECTRONIC SEMICONDUCTOR STAMP TO MANUFACTURE O...
- Publication number 20210111148
- Publication date Apr 15, 2021
- ULTRA DISPLAY TECHNOLOGY CORP.
- Hsien-Te CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS)
- Publication number 20210104503
- Publication date Apr 8, 2021
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210028150
- Publication date Jan 28, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUNCTION STRUCTURE
- Publication number 20200321499
- Publication date Oct 8, 2020
- TDK Corporation
- Takasi SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20200313059
- Publication date Oct 1, 2020
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application...
- Publication number 20200279827
- Publication date Sep 3, 2020
- STATS ChipPAC Pte Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PACKAGING COMPONENT
- Publication number 20200258861
- Publication date Aug 13, 2020
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Zhibai ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20200152564
- Publication date May 14, 2020
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200051902
- Publication date Feb 13, 2020
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pad for Semiconductor Device
- Publication number 20200051936
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190304941
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Jung-woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20190279953
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20190267528
- Publication date Aug 29, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Package Structures and Methods for Forming the Same
- Publication number 20180342404
- Publication date Nov 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20180337155
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS

involving forming a eutectic alloy at the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Through-hole electrode substrate

Contact pad for semiconductor device

Micro LED display device and manufacturing method thereof

Wafer level packaging of light emitting diodes (LEDs)

Connector structure and method of forming same

Method for manufacturing display panel, display panel, and display...

Method of using optoelectronic semiconductor stamp to manufacture o...

Contact pad for semiconductor device

Method for temporarily fastening a semiconductor chip to a surface,...

Package device

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Through-hole electrode substrate

System for processing semiconductor devices

Thin 3D fan-out embedded wafer level package (EWLB) for application...

Stacked modules

Package structures and methods for forming the same

Semiconductor device package and method for manufacturing the same

Process for packaging component

Junction structure

Package structure and manufacturing method thereof

Illumination device

MEMS devices and methods of forming the same

Contact pad for semiconductor device

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Metal pillar in a film-type seconductor package

Connector structure and method of forming same

Wafer level packaging of light emitting diodes (LEDs)

Electronic device having individual wrapping of electronic package...

Through-hole electrode substrate

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

STRUCTURES AND METHODS OF TRANSFERRING DIES AND DIE BONDED STRUCTURES

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

Contact Pad for Semiconductor Device

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

Tools and Systems for Processing Semiconductor Devices, and Methods...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHT-EMITTING DEVICE

Chip Package on Package Structure, Packaging Method Thereof, and El...

MICRO LED DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Method for Temporarily Fastening a Semiconductor Chip to a Surface,...

Contact Pad for Semiconductor Device

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

Connector Structure and Method of Forming Same

METHOD OF USING OPTOELECTRONIC SEMICONDUCTOR STAMP TO MANUFACTURE O...

WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS)

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

JUNCTION STRUCTURE

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application...

PROCESS FOR PACKAGING COMPONENT

THROUGH-HOLE ELECTRODE SUBSTRATE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Contact Pad for Semiconductor Device

FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Connector Structure and Method of Forming Same

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

Tools and Systems for Processing Semiconductor Devices, and Methods...

Package Structures and Methods for Forming the Same

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...