involving forming a eutectic alloy at the bonding interface

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H01L2224/82805

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82805involving forming a eutectic alloy at the bonding interface

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing an electrically conductive connection on a sub...
- Patent number 11,855,037
- Issue date Dec 26, 2023
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...
- Publication number 20210358880
- Publication date Nov 18, 2021
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS