involving forming an intermetallic compound at the bonding interface

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H01L2224/8581

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8581involving forming an intermetallic compound at the bonding interface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,948,911
- Issue date Apr 2, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for establishing a wire connection as well as a c...
- Patent number 11,217,558
- Issue date Jan 4, 2022
- PAC Tech-Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for joining a micorelectronic chip to a wire element
- Patent number 11,081,466
- Issue date Aug 3, 2021
- PRIMO1D
- Delphine Rolland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent power module and manufacturing method thereof
- Patent number 10,615,155
- Issue date Apr 7, 2020
- Yuxiang Feng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic circuit arrangement and method of manufacturing the same
- Patent number 10,327,333
- Issue date Jun 18, 2019
- Koninklijke Philips N.V.
- Ronald Dekker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package stack
- Patent number 9,859,253
- Issue date Jan 2, 2018
- Intel Corporation
- Saikumar Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with chip for the high-frequency range
- Patent number 9,669,480
- Issue date Jun 6, 2017
- Rohde & Schwarz GmbH & Co. KG
- Daniel Hageneder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing for forming bond pads and seal rings
- Patent number 9,601,354
- Issue date Mar 21, 2017
- NXP USA, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for forming same
- Patent number 9,437,574
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 9,312,234
- Issue date Apr 12, 2016
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-in-packages and methods of formation thereof
- Patent number 9,147,628
- Issue date Sep 29, 2015
- Infineon Technoloiges Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-formed conductive bumps on bonding pads
- Patent number 8,319,353
- Issue date Nov 27, 2012
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,156,643
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-formed conductive bumps on bonding pads
- Patent number 8,030,098
- Issue date Oct 4, 2011
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,911,061
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of reducing process steps in metal line protective structure...
- Patent number 7,495,335
- Issue date Feb 24, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Ling Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having pads with plural junctions for different...
- Patent number 7,344,968
- Issue date Mar 18, 2008
- Oki Electric Industry Co., Ltd.
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having pads with plural junctions for different...
- Patent number 7,309,915
- Issue date Dec 18, 2007
- Oki Electric Industry Co., Ltd.
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having pads with plural junctions for different...
- Patent number 7,288,846
- Issue date Oct 30, 2007
- Oki Electric Industry Co., Ltd.
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for wire bonding over active, brittle and lo...
- Patent number 7,176,580
- Issue date Feb 13, 2007
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure for semiconductor chips and a semiconductor pack...
- Patent number 6,982,485
- Issue date Jan 3, 2006
- Amkor Technology, Inc.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having pads with plural junctions for different...
- Patent number 6,590,297
- Issue date Jul 8, 2003
- Oki Electric Industry Co., Ltd.
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having pads with plural junctions for different...
- Patent number 6,555,923
- Issue date Apr 29, 2003
- Oki Electric Industry Co., Ltd.
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacture
- Patent number 6,164,523
- Issue date Dec 26, 2000
- Semiconductor Components Industries, LLC
- Joseph K. Fauty
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE
- Publication number 20240222349
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
- Publication number 20240014155
- Publication date Jan 11, 2024
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Wenjie HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
- Publication number 20220084979
- Publication date Mar 17, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20210327843
- Publication date Oct 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210257334
- Publication date Aug 19, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR JOINING A MICORELECTRONIC CHIP TO A WIRE ELEMENT
- Publication number 20200335475
- Publication date Oct 22, 2020
- PRIMO1D
- Delphine Rolland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...
- Publication number 20200161273
- Publication date May 21, 2020
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- ANDREJ KOLBASOW
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190067260
- Publication date Feb 28, 2019
- Sumitomo Electric Industries, Ltd.
- Koichi KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047714
- Publication date Feb 15, 2018
- GD MIDEA AIRCONDITIONING EQUIPMENT CO., LTD.
- Yuxiang Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACK
- Publication number 20180005989
- Publication date Jan 4, 2018
- Intel Corporation
- Saikumar Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with chip for the high-frequency range
- Publication number 20150181712
- Publication date Jun 25, 2015
- ROHDE & SCHWARZ GMBH & CO. KG
- Daniel Hageneder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Module and Method for Manufacturing the Same
- Publication number 20150076570
- Publication date Mar 19, 2015
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140371744
- Publication date Dec 18, 2014
- Koninklijke Philips N.V.
- Ronald Dekker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140191393
- Publication date Jul 10, 2014
- Siliconware Precision Industries Co., Ltd.
- Lung-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110107595
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CONTACT
- Publication number 20100001400
- Publication date Jan 7, 2010
- Hartmut Schmidt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080315423
- Publication date Dec 25, 2008
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing process steps in metal line protective structure...
- Publication number 20060258143
- Publication date Nov 16, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Ling Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having pads with plural junctions for different...
- Publication number 20050242432
- Publication date Nov 3, 2005
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having pads with plural junctions for different...
- Publication number 20050236720
- Publication date Oct 27, 2005
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having pads with plural junctions for different...
- Publication number 20020158346
- Publication date Oct 31, 2002
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having pads with plural junctions for different...
- Publication number 20020153619
- Publication date Oct 24, 2002
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having pads with plural junctions for different...
- Publication number 20020066965
- Publication date Jun 6, 2002
- Masao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING PADS WITH PLURAL DIFFERENT JUNCTION TYPE
- Publication number 20020003309
- Publication date Jan 10, 2002
- MASAO SASAKI
- H01 - BASIC ELECTRIC ELEMENTS

involving forming an intermetallic compound at the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packaging method and semiconductor package device

Method of manufacturing a semiconductor device having a bond wire o...

Straight wirebonding of silicon dies

Method and device for establishing a wire connection as well as a c...

Method for joining a micorelectronic chip to a wire element

Semiconductor packages with an intermetallic layer

Intelligent power module and manufacturing method thereof

Electronic circuit arrangement and method of manufacturing the same

Integrated circuit package stack

Apparatus, system, and method for wireless connection in integrated...

Semiconductor component with chip for the high-frequency range

Semiconductor manufacturing for forming bond pads and seal rings

Methods of forming semiconductor packages with an intermetallic lay...

Electronic component package and method for forming same

Semiconductor module and method for manufacturing the same

Package-in-packages and methods of formation thereof

Pre-formed conductive bumps on bonding pads

Semiconductor device

Wafer and semiconductor package

Pre-formed conductive bumps on bonding pads

Semiconductor device

Method of reducing process steps in metal line protective structure...

Semiconductor chip having pads with plural junctions for different...

Semiconductor chip having pads with plural junctions for different...

Semiconductor chip having pads with plural junctions for different...

Structures and methods for wire bonding over active, brittle and lo...

Stacking structure for semiconductor chips and a semiconductor pack...

Semiconductor chip having pads with plural junctions for different...

Semiconductor chip having pads with plural junctions for different...

Electronic component and method of manufacture

Patents Applicationslast 30 patents

POWER MODULE

CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD

LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

STRAIGHT WIREBONDING OF SILICON DIES

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE

METHOD FOR JOINING A MICORELECTRONIC CHIP TO A WIRE ELEMENT

METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTELLIGENT POWER MODULE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE STACK

Semiconductor component with chip for the high-frequency range

Semiconductor Module and Method for Manufacturing the Same

ELECTRONIC CIRCUIT ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Package-In-Packages and Methods of Formation Thereof

SEMICONDUCTOR DEVICE

WAFER AND SEMICONDUCTOR PACKAGE

SOLDER CONTACT

SEMICONDUCTOR DEVICE

Method of reducing process steps in metal line protective structure...

Semiconductor chip having pads with plural junctions for different...

Semiconductor chip having pads with plural junctions for different...

Semiconductor chip having pads with plural junctions for different...

Semiconductor chip having pads with plural junctions for different...

Semiconductor chip having pads with plural junctions for different...

SEMICONDUCTOR CHIP HAVING PADS WITH PLURAL DIFFERENT JUNCTION TYPE