involving forming an intermetallic compound at the bonding interface

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H01L2224/8681

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8681involving forming an intermetallic compound at the bonding interface

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,842,832
- Issue date Dec 12, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with chip for the high-frequency range
- Patent number 9,669,480
- Issue date Jun 6, 2017
- Rohde & Schwarz GmbH & Co. KG
- Daniel Hageneder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,397,071
- Issue date Jul 19, 2016
- Intel Corporation
- Omkar G. Karhade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20210327843
- Publication date Oct 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20160300824
- Publication date Oct 13, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
- Publication number 20150187731
- Publication date Jul 2, 2015
- QUALCOMM Incorporated
- Dong Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with chip for the high-frequency range
- Publication number 20150181712
- Publication date Jun 25, 2015
- ROHDE & SCHWARZ GMBH & CO. KG
- Daniel Hageneder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR