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H01L2224/82136

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82136involving guiding structures

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Patents Grantslast 30 patents

Information Patent Grant
Precision alignment of multi-chip high density interconnects
- Patent number 10,833,051
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer system in package
- Patent number 9,936,578
- Issue date Apr 3, 2018
- Qorvo US, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic module
- Patent number 8,959,757
- Issue date Feb 24, 2015
- RF Micro Devices, Inc.
- Thong Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS
- Publication number 20200243479
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RDL SYSTEM IN PACKAGE
- Publication number 20130170147
- Publication date Jul 4, 2013
- RF Micro Devices, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS