involving guiding structures

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H01L2224/83136

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83136involving guiding structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
System and method for integration of biological chips
- Patent number 12,128,377
- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guide apparatus for transferring light-emitting devices onto a subs...
- Patent number 12,040,208
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer device and mass transfer method
- Patent number 11,784,159
- Issue date Oct 10, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Jan-hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical wafer alignment detection for bonding process
- Patent number 11,688,717
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,342,301
- Issue date May 24, 2022
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and soldering support jig
- Patent number 11,164,846
- Issue date Nov 2, 2021
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning device
- Patent number 11,075,102
- Issue date Jul 27, 2021
- Suss MicroTec Lithography GmbH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,049,839
- Issue date Jun 29, 2021
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 11,004,808
- Issue date May 11, 2021
- Cree, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for aligning electronic components
- Patent number 10,604,358
- Issue date Mar 31, 2020
- Muehlbauer GmbH & Co. KG
- Franz Brandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and soldering support jig
- Patent number 10,566,308
- Issue date Feb 18, 2020
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) die attached between an offset lead frame d...
- Patent number 10,553,524
- Issue date Feb 4, 2020
- Microchip Technology Incorporated
- Man Kit Lam
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multi-die package having different types of semiconductor dies atta...
- Patent number 9,997,476
- Issue date Jun 12, 2018
- Infineon Technologies AG
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to achieve ultra-high chip-to-chip alignment accuracy for wa...
- Patent number 9,466,538
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Spyridon Skordas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,468,136
- Issue date Oct 11, 2016
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,324,676
- Issue date Apr 26, 2016
- Micron Technology, Inc.
- See Hiong Leow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an IPD beneath a semicon...
- Patent number 9,257,356
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for controlling positions of stacked dies
- Patent number 9,209,165
- Issue date Dec 8, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,010,616
- Issue date Apr 21, 2015
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing semiconductor die in dry and pressure supported assembly pro...
- Patent number 8,999,758
- Issue date Apr 7, 2015
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 8,900,923
- Issue date Dec 2, 2014
- Micron Technology, Inc.
- See Hiong Leow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel interconnection system
- Patent number 8,888,504
- Issue date Nov 18, 2014
- NXP B.V.
- Erich Pischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die fixing method and apparatus
- Patent number 8,691,624
- Issue date Apr 8, 2014
- Infineon Technologies AG
- Alexander Ciliox
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic element unit and reinforcing adhesive agent
- Patent number 8,686,299
- Issue date Apr 1, 2014
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic circuit constituting member and relev...
- Patent number 8,646,173
- Issue date Feb 11, 2014
- Panasonic Corporation
- Tohru Nakagawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,633,582
- Issue date Jan 21, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,564,133
- Issue date Oct 22, 2013
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
- Publication number 20230282612
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
- Publication number 20230066893
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...
- Publication number 20220384231
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS
- Publication number 20220040662
- Publication date Feb 10, 2022
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...
- Publication number 20210233877
- Publication date Jul 29, 2021
- Cree, Inc.
- Xikun ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING SUPPORT JIG
- Publication number 20200135691
- Publication date Apr 30, 2020
- Fuji Electric Co., Ltd.
- Rikihiro MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200035588
- Publication date Jan 30, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takanori KAWASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SE...
- Publication number 20190229084
- Publication date Jul 25, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR ALIGNING ELECTRONIC COMPONENTS
- Publication number 20190127155
- Publication date May 2, 2019
- Muehlbauer GmbH & Co. KG
- Franz Brandl
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180286702
- Publication date Oct 4, 2018
- Toyota Jidosha Kabushiki Kaisha
- Takanori KAWASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Different Types of Semiconductor Dies Attached to a Fl...
- Publication number 20180254253
- Publication date Sep 6, 2018
- INFINEON TECHNOLOGIES AG
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING DEVICE
- Publication number 20180138070
- Publication date May 17, 2018
- SUSS MICROTEC LITHOGRAPHY GMBH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Having Different Types of Semiconductor Dies Atta...
- Publication number 20170125362
- Publication date May 4, 2017
- INFINEON TECHNOLOGIES AG
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Integral Join and Automatic Placement Machine
- Publication number 20160351533
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20140193658
- Publication date Jul 10, 2014
- Indium Corporation
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED AREA SOLDER BONDING FOR DIES
- Publication number 20130241051
- Publication date Sep 19, 2013
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20130217182
- Publication date Aug 22, 2013
- Micron Technology, Inc.
- See Hiong Leow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Fixing Method and Apparatus
- Publication number 20130137215
- Publication date May 30, 2013
- Alexander Ciliox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fixing Semiconductor Die in Dry and Pressure Supported Assembly Pro...
- Publication number 20130040424
- Publication date Feb 14, 2013
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20120305632
- Publication date Dec 6, 2012
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILEVEL INTERCONNECTION SYSTEM
- Publication number 20120045909
- Publication date Feb 23, 2012
- NXP B.V.
- Erich Pischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked Semiconductor Package Having Discrete Components
- Publication number 20110215438
- Publication date Sep 8, 2011
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME
- Publication number 20110049702
- Publication date Mar 3, 2011
- Shinko Electric Industries Co., Ltd.
- Syuji NEGORO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110042796
- Publication date Feb 24, 2011
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20110042819
- Publication date Feb 24, 2011
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having Discrete Components And System Contain...
- Publication number 20110012253
- Publication date Jan 20, 2011
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ALIGNING AND BONDING ELEMENTS AND A DEVICE COMPRISING AL...
- Publication number 20110006431
- Publication date Jan 13, 2011
- IMEC
- Philippe Soussan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Attachment Method Using Non-Conductive Screen Pri...
- Publication number 20100304532
- Publication date Dec 2, 2010
- MICROCHIP TECHNOLOGY INCORPORATED
- Ekgachai Kenganantanon
- H01 - BASIC ELECTRIC ELEMENTS

involving guiding structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for integration of biological chips

Package with different types of semiconductor dies attached to a fl...

Guide apparatus for transferring light-emitting devices onto a subs...

Mass transfer device and mass transfer method

Mechanical wafer alignment detection for bonding process

Bonding tools for bonding machines, bonding machines for bonding se...

Semiconductor device manufacturing method and soldering support jig

Positioning device

Bonding tools for bonding machines, bonding machines for bonding se...

Package with different types of semiconductor dies attached to a fl...

Device, system and method for aligning electronic components

Semiconductor device manufacturing method and soldering support jig

Integrated circuit (IC) die attached between an offset lead frame d...

Multi-die package having different types of semiconductor dies atta...

Semiconductor module package and method of manufacturing the same

Method to achieve ultra-high chip-to-chip alignment accuracy for wa...

Low void solder joint for multiple reflow applications

Packaged microelectronic devices and methods for manufacturing pack...

Semiconductor device and method of forming an IPD beneath a semicon...

Technique for controlling positions of stacked dies

Chip-on-wafer bonding method and bonding device, and structure comp...

Low void solder joint for multiple reflow applications

Fixing semiconductor die in dry and pressure supported assembly pro...

Packaged microelectronic devices and methods for manufacturing pack...

Multilevel interconnection system

Die fixing method and apparatus

Electronic element unit and reinforcing adhesive agent

Method of mounting electronic circuit constituting member and relev...

Chip package and fabrication method thereof

Chip package and method for forming the same

Patents Applicationslast 30 patents

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...

SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS

PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING SUPPORT JIG

SEMICONDUCTOR DEVICE

BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SE...

DEVICE, SYSTEM AND METHOD FOR ALIGNING ELECTRONIC COMPONENTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Package with Different Types of Semiconductor Dies Attached to a Fl...

POSITIONING DEVICE

Multi-Die Package Having Different Types of Semiconductor Dies Atta...

Method for Producing an Integral Join and Automatic Placement Machine

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

CONTROLLED AREA SOLDER BONDING FOR DIES

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

Die Fixing Method and Apparatus

Fixing Semiconductor Die in Dry and Pressure Supported Assembly Pro...

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT

MULTILEVEL INTERCONNECTION SYSTEM

Stacked Semiconductor Package Having Discrete Components

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Semiconductor Package Having Discrete Components And System Contain...

METHOD FOR ALIGNING AND BONDING ELEMENTS AND A DEVICE COMPRISING AL...

Semiconductor Die Attachment Method Using Non-Conductive Screen Pri...