involving intermediate connecting steps before cutting the wire connector

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H01L2224/85196

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85196involving intermediate connecting steps before cutting the wire connector

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Patents Grantslast 30 patents

Information Patent Grant
Electrical interconnections for semiconductor devices and methods f...
- Patent number 10,643,966
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Hyosung Koo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...
- Publication number 20180331064
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Hyosung KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCOTOR PACKAG...
- Publication number 20110169173
- Publication date Jul 14, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Sung-Ho MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100311234
- Publication date Dec 9, 2010
- NEC Electronics Corporation
- Yukinori Tabira
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR