involving measurement of the workpiece at the place of grinding during grinding operation

Industry

CPC
B24B49/04

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work Arrangements of indicating or measuring equipment

Current Industry

B24B49/04involving measurement of the workpiece at the place of grinding during grinding operation

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Temperature control of chemical mechanical polishing
- Patent number 12,214,468
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Modular clamping device
- Patent number 12,202,095
- Issue date Jan 21, 2025
- AGATHON AG, MASCHINENFABRIK
- Thomas Ackermann
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for autonomously grinding a workpiece
- Patent number 12,134,166
- Issue date Nov 5, 2024
- GrayMatter Robotics Inc.
- Avadhoot L. Ahire
- B24 - GRINDING POLISHING
Information Patent Grant
Channel cut polishing machine
- Patent number 12,134,164
- Issue date Nov 5, 2024
- UChicago Argonne, LLC
- Elina Kasman
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding method of workpiece
- Patent number 12,134,165
- Issue date Nov 5, 2024
- Disco Corporation
- Satoru Fujimura
- B24 - GRINDING POLISHING
Information Patent Grant
Core configuration for in-situ electromagnetic induction monitoring...
- Patent number 12,103,135
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Hassan G. Iravani
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for processing one or more integrated circuit p...
- Patent number 12,076,833
- Issue date Sep 3, 2024
- Nidec SV Probe Pte. Ltd.
- Son N. Dang
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing rotationally symmetrical, non-cylindrical bore...
- Patent number 12,053,853
- Issue date Aug 6, 2024
- Gehring Technologies GmbH
- Klaus Litty
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing control system, substrate processing control m...
- Patent number 12,036,634
- Issue date Jul 16, 2024
- Ebara Corporation
- Koichi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar grinder
- Patent number 12,000,764
- Issue date Jun 4, 2024
- Illinois Tool Works Inc.
- Kurt G. Adair
- G01 - MEASURING TESTING
Information Patent Grant
Fine adjustment thread assembly and processing apparatus
- Patent number 11,992,916
- Issue date May 28, 2024
- Disco Corporation
- Toshiyasu Rikiishi
- B24 - GRINDING POLISHING
Information Patent Grant
Motor torque endpoint during polishing with spatial resolution
- Patent number 11,980,995
- Issue date May 14, 2024
- Applied Materials, Inc.
- Thomas Li
- B24 - GRINDING POLISHING
Information Patent Grant
Processing apparatus
- Patent number 11,945,074
- Issue date Apr 2, 2024
- Disco Corporation
- Nobuyuki Fukushi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,911,872
- Issue date Feb 27, 2024
- Ebara Corporation
- Nobuyuki Takada
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 11,904,432
- Issue date Feb 20, 2024
- Disco Corporation
- Satoru Fujimura
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for insitu adjustment of wafer slip detection...
- Patent number 11,904,431
- Issue date Feb 20, 2024
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Grant
Screw rotor processing method and screw rotor lead correction calcu...
- Patent number 11,890,721
- Issue date Feb 6, 2024
- HITACHI-JOHNSON CONTROLS AIR CONDITIONING, INC.
- Toshio Yamanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Thickness measuring apparatus
- Patent number 11,845,158
- Issue date Dec 19, 2023
- Disco Corporation
- Nobuyuki Kimura
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece processing apparatus including a resin coater and a resin...
- Patent number 11,819,975
- Issue date Nov 21, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Polishing apparatus and calibration method
- Patent number 11,806,828
- Issue date Nov 7, 2023
- Ebara Corporation
- Akira Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Method for grinding a surface of a workpiece and device therefore
- Patent number 11,787,010
- Issue date Oct 17, 2023
- Karl Heesemann Maschinenfabrik GmbH & Co. KG
- Christoph Giese
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,772,226
- Issue date Oct 3, 2023
- Disco Corporation
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus and method of controlling inclination of statio...
- Patent number 11,745,306
- Issue date Sep 5, 2023
- Ebara Corporation
- Tomoko Owada
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for correcting machining error during a precision...
- Patent number 11,745,305
- Issue date Sep 5, 2023
- Moore Nanotechnology Systems, LLC
- Sinan J. Badrawy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer thinning apparatus having feedback control
- Patent number 11,728,172
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Hsuan Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for a web-based CMP system
- Patent number 11,717,936
- Issue date Aug 8, 2023
- Applied Materials, Inc.
- Dmitry Sklyar
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-toothed, magnetically controlled retaining ring
- Patent number 11,691,244
- Issue date Jul 4, 2023
- Applied Materials, Inc.
- Boguslaw A. Swedek
- B24 - GRINDING POLISHING
Information Patent Grant
Method for operating a grinding device
- Patent number 11,679,471
- Issue date Jun 20, 2023
- Karl Heesemann Maschinenfabrik GmbH & Co. KG
- Christoph Giese
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head system and polishing apparatus
- Patent number 11,673,222
- Issue date Jun 13, 2023
- Ebara Corporation
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 11,654,525
- Issue date May 23, 2023
- Disco Corporation
- Jiro Genozono
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING APPARATUS
- Publication number 20250041989
- Publication date Feb 6, 2025
- EBARA CORPORATION
- Masaki KINOSHITA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING DEVICE, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE...
- Publication number 20250018532
- Publication date Jan 16, 2025
- EBARA CORPORATION
- Keisuke NAMIKI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR PROCESSING DIAMOND SURFACE
- Publication number 20250010427
- Publication date Jan 9, 2025
- ELEMENT SIX TECHNOLOGIES LIMITED
- Christopher John KELLY
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...
- Publication number 20240399535
- Publication date Dec 5, 2024
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240391054
- Publication date Nov 28, 2024
- EBARA CORPORATION
- Osamu NABEYA
- B24 - GRINDING POLISHING
Information Patent Application
FINISHING METHOD AND FINISHING MACHINE FOR MEASUREMENT-ASSISTED FIN...
- Publication number 20240367288
- Publication date Nov 7, 2024
- KADIA Produktion GmbH +Co.
- Uwe Moos
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, COMPUTER-READABLE STORAGE MEDIUM STORING PROGRAM...
- Publication number 20240359290
- Publication date Oct 31, 2024
- EBARA CORPORATION
- Keita YAGI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, POLISHING APPARATUS, AND COMPUTER-READABLE STORAG...
- Publication number 20240351163
- Publication date Oct 24, 2024
- EBARA CORPORATION
- Masayoshi ITO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING END POINT DETECTION METHOD IN POL...
- Publication number 20240342854
- Publication date Oct 17, 2024
- EBARA CORPORATION
- Hiroki NAKAMURA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF DETECTING POLISHING ENDPOINT, AND PROGRAM FOR DETECTING P...
- Publication number 20240326196
- Publication date Oct 3, 2024
- EBARA CORPORATION
- Yuko SHIMIZU
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL M...
- Publication number 20240316720
- Publication date Sep 26, 2024
- EBARA CORPORATION
- Koichi TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240300068
- Publication date Sep 12, 2024
- EBARA CORPORATION
- Hiroto YAMADA
- B24 - GRINDING POLISHING
Information Patent Application
Sharpening Parameter And Determination System For A Lawn Mower Blad...
- Publication number 20240293913
- Publication date Sep 5, 2024
- Brian F. Smith
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING DEVICE, SUBSTRATE PROCESSING APPARATUS, METHOD,...
- Publication number 20240217060
- Publication date Jul 4, 2024
- EBARA CORPORATION
- Masashi KABASAWA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240208002
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Masaki KINOSHITA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE TREATING APPARATUS INCLUDING ECCENTRICITY CORRECTION UNIT...
- Publication number 20240208001
- Publication date Jun 27, 2024
- SEMES CO., LTD.
- In Ki JUNG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, AND POLISHING APPARATUS
- Publication number 20240181594
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Masashi KABASAWA
- B24 - GRINDING POLISHING
Information Patent Application
HOLDING SURFACE MAINTAINING METHOD
- Publication number 20240157510
- Publication date May 16, 2024
- DISCO COROPORATION
- Takenobu MORI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR GRINDING THE TOOTHING OR THE PROFILE OF A WORKPIECE
- Publication number 20240123570
- Publication date Apr 18, 2024
- KAPP NILES GmbH & Co. KG
- Sergiy GRINKO
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE PROPERTY MEASURING SYSTEM, SURFACE PROPERTY MEASURING METHO...
- Publication number 20240075580
- Publication date Mar 7, 2024
- EBARA CORPORATION
- Toshifumi KIMBA
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER
- Publication number 20240017376
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240017370
- Publication date Jan 18, 2024
- EBARA CORPORATION
- Akihiro YAZAWA
- B24 - GRINDING POLISHING
Information Patent Application
WINDOW LOGIC FOR CONTROL OF POLISHING PROCESS
- Publication number 20230415302
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Volker Geissler
- B24 - GRINDING POLISHING
Information Patent Application
ADVANCED GRIND LINE CLOSED LOOP FEEDBACK
- Publication number 20230390892
- Publication date Dec 7, 2023
- Raytheon Technologies Corporation
- Tyler Stangle
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR DETECTING CONTACT DURING A PROCESS
- Publication number 20230381908
- Publication date Nov 30, 2023
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Joseph Gerard Lovasz
- B24 - GRINDING POLISHING
Information Patent Application
WAFER THINNING METHOD HAVING FEEDBACK CONTROL
- Publication number 20230360919
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hsuan Chen
- B24 - GRINDING POLISHING
Information Patent Application
HIGH-PRECISION SUBSTRATE POLISHING SYSTEM
- Publication number 20230339070
- Publication date Oct 26, 2023
- KCTECH CO., LTD.
- Ki Hyuk YANG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS FOR WORKPIECE
- Publication number 20230311267
- Publication date Oct 5, 2023
- EBARA CORPORATION
- Toshifumi KIMBA
- B24 - GRINDING POLISHING
Information Patent Application
PRODUCTION APPARATUS AND PRODUCTION METHOD
- Publication number 20230311270
- Publication date Oct 5, 2023
- KIOXIA Corporation
- Kazufumi NOMURA
- B24 - GRINDING POLISHING
Information Patent Application
BLADE EDGE TIP MEASUREMENT
- Publication number 20230314470
- Publication date Oct 5, 2023
- The Gillette Company LLC
- Jason Scott Slattery
- B24 - GRINDING POLISHING

involving measurement of the workpiece at the place of grinding during grinding operation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temperature control of chemical mechanical polishing

Modular clamping device

System and method for autonomously grinding a workpiece

Channel cut polishing machine

Grinding method of workpiece

Core configuration for in-situ electromagnetic induction monitoring...

Methods and systems for processing one or more integrated circuit p...

Method for producing rotationally symmetrical, non-cylindrical bore...

Substrate processing control system, substrate processing control m...

Planar grinder

Fine adjustment thread assembly and processing apparatus

Motor torque endpoint during polishing with spatial resolution

Processing apparatus

Substrate processing apparatus and substrate processing method

Grinding apparatus

Method and apparatus for insitu adjustment of wafer slip detection...

Screw rotor processing method and screw rotor lead correction calcu...

Thickness measuring apparatus

Workpiece processing apparatus including a resin coater and a resin...

Polishing apparatus and calibration method

Method for grinding a surface of a workpiece and device therefore

Polishing apparatus

Polishing apparatus and method of controlling inclination of statio...

System and method for correcting machining error during a precision...

Wafer thinning apparatus having feedback control

Methods for a web-based CMP system

Multi-toothed, magnetically controlled retaining ring

Method for operating a grinding device

Polishing head system and polishing apparatus

Grinding apparatus

Patents Applicationslast 30 patents

POLISHING APPARATUS

SUBSTRATE HOLDING DEVICE, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE...

METHOD AND APPARATUS FOR PROCESSING DIAMOND SURFACE

METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...

POLISHING APPARATUS AND POLISHING METHOD

FINISHING METHOD AND FINISHING MACHINE FOR MEASUREMENT-ASSISTED FIN...

POLISHING METHOD, COMPUTER-READABLE STORAGE MEDIUM STORING PROGRAM...

POLISHING METHOD, POLISHING APPARATUS, AND COMPUTER-READABLE STORAG...

POLISHING APPARATUS AND POLISHING END POINT DETECTION METHOD IN POL...

METHOD OF DETECTING POLISHING ENDPOINT, AND PROGRAM FOR DETECTING P...

SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL M...

POLISHING APPARATUS AND POLISHING METHOD

Sharpening Parameter And Determination System For A Lawn Mower Blad...

SUBSTRATE POLISHING DEVICE, SUBSTRATE PROCESSING APPARATUS, METHOD,...

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE TREATING APPARATUS INCLUDING ECCENTRICITY CORRECTION UNIT...

POLISHING METHOD, AND POLISHING APPARATUS

HOLDING SURFACE MAINTAINING METHOD

METHOD FOR GRINDING THE TOOTHING OR THE PROFILE OF A WORKPIECE

SURFACE PROPERTY MEASURING SYSTEM, SURFACE PROPERTY MEASURING METHO...

MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER

POLISHING APPARATUS AND POLISHING METHOD

WINDOW LOGIC FOR CONTROL OF POLISHING PROCESS

ADVANCED GRIND LINE CLOSED LOOP FEEDBACK

SYSTEMS AND METHODS FOR DETECTING CONTACT DURING A PROCESS

WAFER THINNING METHOD HAVING FEEDBACK CONTROL

HIGH-PRECISION SUBSTRATE POLISHING SYSTEM

POLISHING METHOD AND POLISHING APPARATUS FOR WORKPIECE

PRODUCTION APPARATUS AND PRODUCTION METHOD

BLADE EDGE TIP MEASUREMENT