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H01L2224/437

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/437Involving monitoring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discharge examination device, wire-bonding apparatus, and discharge...
- Patent number 10,607,959
- Issue date Mar 31, 2020
- Shinkawa Ltd.
- Kazumasa Sasakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding device and method of eliminating defective bonding wire
- Patent number 9,355,989
- Issue date May 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...
- Publication number 20240250063
- Publication date Jul 25, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170365576
- Publication date Dec 21, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...
- Publication number 20170125311
- Publication date May 4, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Aashish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...
- Publication number 20160358879
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- KAZUMASA SASAKURA
- G01 - MEASURING TESTING
Information Patent Application
WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE
- Publication number 20160079198
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF
- Publication number 20100239455
- Publication date Sep 23, 2010
- Jun-Der LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Involving monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Bonding wire for semiconductor device

Discharge examination device, wire-bonding apparatus, and discharge...

Wire bonding device and method of eliminating defective bonding wire

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...

DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...

WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF