involving monitoring

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H01L2224/117

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/117involving monitoring

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,021,050
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Ho Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for thermally treating conductive elements on semiconductor...
- Patent number 11,967,576
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball disposition system, method of disposing a ball on a substrate...
- Patent number 11,488,928
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Sukmin Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and associated semiconduc...
- Patent number 11,469,198
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Ho Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple module chip manufacturing arrangement
- Patent number 11,440,117
- Issue date Sep 13, 2022
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of measuring underfill profile of underfill cavity having so...
- Patent number 11,355,361
- Issue date Jun 7, 2022
- Coretech System Co., Ltd.
- Yu-En Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,121,106
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating system, a plating system control method, and a storage medi...
- Patent number 11,098,414
- Issue date Aug 24, 2021
- Ebara Corporation
- Takashi Mitsuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for reflowing conductive elements of semico...
- Patent number 11,081,458
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for inspecting a bump height surrounded by resist, device fo...
- Patent number 10,910,334
- Issue date Feb 2, 2021
- Ebara Corporation
- Takahisa Okuzono
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor fabrication apparatus and semiconductor fabrication m...
- Patent number 10,892,240
- Issue date Jan 12, 2021
- TOSHIBA MEMORY CORPORATION
- Keiichi Niwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Height measurements of conductive structural elements that are surr...
- Patent number 10,734,340
- Issue date Aug 4, 2020
- CAMTEK LTD.
- Eyal Segev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus, substrate holder, plating apparatus controlling...
- Patent number 10,533,262
- Issue date Jan 14, 2020
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating system, a plating system control method, and a storage medi...
- Patent number 10,501,862
- Issue date Dec 10, 2019
- Ebara Corporation
- Takashi Mitsuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Separation of alpha emitting species from plating baths
- Patent number 10,287,702
- Issue date May 14, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus, substrate holder, plating apparatus controlling...
- Patent number 10,273,594
- Issue date Apr 30, 2019
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Separation of alpha emitting species from plating baths
- Patent number 10,167,568
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Separation of alpha emitting species from plating baths
- Patent number 10,138,568
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods for fabricating interconnect st...
- Patent number 10,121,754
- Issue date Nov 6, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Separation of alpha emitting species from plating baths
- Patent number 10,030,315
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,978,655
- Issue date May 22, 2018
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias and thermocompression bonding using inkjet-pri...
- Patent number 9,717,145
- Issue date Jul 25, 2017
- The Regents of the University of California
- Vivek Subramanian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 9,401,313
- Issue date Jul 26, 2016
- Deca Technologies, Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,397,069
- Issue date Jul 19, 2016
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages including bump buffer spring pads and me...
- Patent number 8,836,118
- Issue date Sep 16, 2014
- SK Hynix Inc.
- Tae Min Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for measuring a bump on a substrate
- Patent number 6,522,719
- Issue date Feb 18, 2003
- Shinko Electric Industries, Co., Ltd.
- Kei Murayama
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE
- Publication number 20240321801
- Publication date Sep 26, 2024
- Beijing Youzhuju Network Technology Co., Ltd.
- Haiying CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312939
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HO TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS GANG DIE BONDING ARRANGEMENT
- Publication number 20240304485
- Publication date Sep 12, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240071840
- Publication date Feb 29, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20230142370
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Kwang Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Same
- Publication number 20230040030
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220367396
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HO TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRINTING SOLDER ONTO A WAFER AND SYSTEM THEREOF
- Publication number 20220216170
- Publication date Jul 7, 2022
- Inari Technology Sdn Bhd
- BOON SENG TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluxless gang die bonding arrangement
- Publication number 20220005720
- Publication date Jan 6, 2022
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR THERMALLY TREATING CONDUCTIVE ELEMENTS ON SEMICONDUCTOR...
- Publication number 20210335741
- Publication date Oct 28, 2021
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...
- Publication number 20210249378
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- SUKMIN OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210134749
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple module chip manufacturing arrangement
- Publication number 20210098401
- Publication date Apr 1, 2021
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDI...
- Publication number 20200056301
- Publication date Feb 20, 2020
- EBARA CORPORATION
- Takashi MITSUYA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ASSOCIATED SEMICONDUC...
- Publication number 20200020655
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HO TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEIGHT MEASUREMENTS OF CONDUCTIVE STRUCTURAL ELEMENTS THAT ARE SURR...
- Publication number 20190355688
- Publication date Nov 21, 2019
- CAMTEK LTD.
- EYAL SEGEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR INSPECTING A BUMP HEIGHT, DEVICE FOR PROCESSING A SUBSTR...
- Publication number 20190348384
- Publication date Nov 14, 2019
- EBARA CORPORATION
- Takahisa OKUZONO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR FABRICATION APPARATUS AND SEMICONDUCTOR FABRICATION M...
- Publication number 20190295976
- Publication date Sep 26, 2019
- Toshiba Memory Corporation
- Keiichi NIWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUSES FOR REFLOWING CONDUCTIVE ELEMENTS OF SEMICO...
- Publication number 20190252337
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS
- Publication number 20180355504
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180315722
- Publication date Nov 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- G11 - INFORMATION STORAGE
Information Patent Application
SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS
- Publication number 20180223445
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS
- Publication number 20180148856
- Publication date May 31, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDI...
- Publication number 20180038008
- Publication date Feb 8, 2018
- EBARA CORPORATION
- Takashi MITSUYA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, SUBSTRATE HOLDER, PLATING APPARATUS CONTROLLING...
- Publication number 20170350033
- Publication date Dec 7, 2017
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS
- Publication number 20170145583
- Publication date May 25, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...
- Publication number 20170133336
- Publication date May 11, 2017
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Application
THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...
- Publication number 20160148840
- Publication date May 26, 2016
- The Regents of the University of California
- Vivek Subramanian
- H01 - BASIC ELECTRIC ELEMENTS

involving monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Fluxless gang die bonding arrangement

Systems for thermally treating conductive elements on semiconductor...

Ball disposition system, method of disposing a ball on a substrate...

Semiconductor device manufacturing method and associated semiconduc...

Multiple module chip manufacturing arrangement

Method of measuring underfill profile of underfill cavity having so...

Integrated circuit package and method

Plating system, a plating system control method, and a storage medi...

Methods and apparatuses for reflowing conductive elements of semico...

Device for inspecting a bump height surrounded by resist, device fo...

Semiconductor fabrication apparatus and semiconductor fabrication m...

Height measurements of conductive structural elements that are surr...

Plating apparatus, substrate holder, plating apparatus controlling...

Plating system, a plating system control method, and a storage medi...

Interconnect structures for assembly of semiconductor structures in...

Separation of alpha emitting species from plating baths

Plating apparatus, substrate holder, plating apparatus controlling...

Interconnect structure and semiconductor structures for assembly of...

Separation of alpha emitting species from plating baths

Separation of alpha emitting species from plating baths

Interconnect structures and methods for fabricating interconnect st...

Separation of alpha emitting species from plating baths

Semiconductor device and method of adaptive patterning for panelize...

Through silicon vias and thermocompression bonding using inkjet-pri...

Automated optical inspection of unit specific patterning

Semiconductor device and method of adaptive patterning for panelize...

Electronic device packages including bump buffer spring pads and me...

Method and apparatus for measuring a bump on a substrate

Patents Applicationslast 30 patents

CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

FLUXLESS GANG DIE BONDING ARRANGEMENT

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

Semiconductor Package and Method of Forming Same

SEMICONDUCTOR DEVICE

METHOD FOR PRINTING SOLDER ONTO A WAFER AND SYSTEM THEREOF

Fluxless gang die bonding arrangement

SYSTEMS FOR THERMALLY TREATING CONDUCTIVE ELEMENTS ON SEMICONDUCTOR...

BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...

Integrated Circuit Package and Method

Multiple module chip manufacturing arrangement

PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDI...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ASSOCIATED SEMICONDUC...

HEIGHT MEASUREMENTS OF CONDUCTIVE STRUCTURAL ELEMENTS THAT ARE SURR...

DEVICE FOR INSPECTING A BUMP HEIGHT, DEVICE FOR PROCESSING A SUBSTR...

SEMICONDUCTOR FABRICATION APPARATUS AND SEMICONDUCTOR FABRICATION M...

METHODS AND APPARATUSES FOR REFLOWING CONDUCTIVE ELEMENTS OF SEMICO...

SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS

SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS

PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDI...

PLATING APPARATUS, SUBSTRATE HOLDER, PLATING APPARATUS CONTROLLING...

SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS

INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...

THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...