involving monitoring

Industry

CPC
H01L2224/829

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/829involving monitoring

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,942,451
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package device
- Patent number 11,798,853
- Issue date Oct 24, 2023
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package with connection stru...
- Patent number 11,532,587
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,404,333
- Issue date Aug 2, 2022
- Advanced Semiconductor Engineering, Inc.
- Yuan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including glass substrate having improved reli...
- Patent number 11,355,465
- Issue date Jun 7, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shun Mitarai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,251,071
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation of compound semiconductor substrate for epitaxial growt...
- Patent number 11,087,974
- Issue date Aug 10, 2021
- The Regents of the University of Michigan
- Stephen R. Forrest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,031,371
- Issue date Jun 8, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package with connection stru...
- Patent number 10,916,519
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,861,773
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated lead frame
- Patent number 10,748,787
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 10,714,528
- Issue date Jul 14, 2020
- Xintec Inc.
- Hsin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 10,629,477
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 10,607,946
- Issue date Mar 31, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable fabrication techniques and circuit packaging devices
- Patent number 10,506,715
- Issue date Dec 10, 2019
- The Regents of the University of California
- Todd Prentice Coleman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor devices having conductive plu...
- Patent number 10,304,818
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Company
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 10,297,494
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with plated lead frame, and method for manufac...
- Patent number 9,847,235
- Issue date Dec 19, 2017
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 9,795,033
- Issue date Oct 17, 2017
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 9,679,863
- Issue date Jun 13, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic devices
- Patent number 9,640,506
- Issue date May 2, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component
- Patent number 9,559,078
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire loops, methods of forming wire loops, and related processes
- Patent number 9,455,544
- Issue date Sep 27, 2016
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting devices in substrate and device-mounting substra...
- Patent number 9,119,332
- Issue date Aug 25, 2015
- Sony Corporation
- Katsuhiro Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240203936
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240006249
- Publication date Jan 4, 2024
- InnoLux Corporation
- Yeong-E CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...
- Publication number 20230369292
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Shan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Package with Connection Stru...
- Publication number 20230122816
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
- Publication number 20230121991
- Publication date Apr 20, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20230066130
- Publication date Mar 2, 2023
- LG Display Co., Ltd.
- MinJae KANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230068263
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367768
- Publication date Nov 17, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sung Geun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Interconnect Thresholds using Dielectric Fluid Channels
- Publication number 20220238401
- Publication date Jul 28, 2022
- SCIPERIO, INC.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20220208749
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20220165628
- Publication date May 26, 2022
- InnoLux Corporation
- Yeong-E CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20220165611
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210202452
- Publication date Jul 1, 2021
- SAMSUNG DISPLAY CO., LTD.
- Tae Gyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Package with Connection Stru...
- Publication number 20210167032
- Publication date Jun 3, 2021
- Taiwan Semiconductor Maufacturing Co., Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210035890
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200321301
- Publication date Oct 8, 2020
- Sony Semiconductor Solutions Corporation
- SHUN MITARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20200251380
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200243406
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Yuan-Ting LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Method Forming Same
- Publication number 20190378809
- Publication date Dec 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190279974
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20190273018
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190140012
- Publication date May 9, 2019
- XINTEC INC.
- Hsin KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20180102351
- Publication date Apr 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Plated Lead Frame
- Publication number 20180061671
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20160260682
- Publication date Sep 8, 2016
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Associated Methods
- Publication number 20140345924
- Publication date Nov 27, 2014
- Nokia Corporation
- Mark Lee ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICES
- Publication number 20140291850
- Publication date Oct 2, 2014
- STMicroelectronics S.r. I.
- Federico Giovanni ZIGLIOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY

involving monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor structure and method of forming the same

Electrical interconnect structure using metal bridges to interconne...

Manufacturing method of package device

Raised via for terminal connections on different planes

Method for manufacturing semiconductor package with connection stru...

Semiconductor device and method for manufacturing the same

Semiconductor device including glass substrate having improved reli...

Raised via for terminal connections on different planes

Bare die integration with printed components on flexible substrate...

Preparation of compound semiconductor substrate for epitaxial growt...

Method for producing an electric circuit comprising a circuit carri...

Semiconductor package and method of fabricating semiconductor package

Method for manufacturing semiconductor package with connection stru...

Semiconductor package and manufacturing method thereof

Semiconductor device with plated lead frame

Chip package and manufacturing method thereof

Raised via for terminal connections on different planes

Semiconductor device and method of forming interconnect substrate f...

Scalable fabrication techniques and circuit packaging devices

Method of manufacturing semiconductor devices having conductive plu...

Raised via for terminal connections on different planes

Bare die integration with printed components on flexible substrate...

Semiconductor device with plated lead frame, and method for manufac...

Method of mounting semiconductor chips, semiconductor device obtain...

Semiconductor device and method of forming interconnect substrate f...

Method for manufacturing electronic devices

Electronic component

Wire loops, methods of forming wire loops, and related processes

Method of mounting devices in substrate and device-mounting substra...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...

Method for Manufacturing Semiconductor Package with Connection Stru...

ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Seamless Interconnect Thresholds using Dielectric Fluid Channels

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

MANUFACTURING METHOD OF PACKAGE DEVICE

Raised Via for Terminal Connections on Different Planes

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for Manufacturing Semiconductor Package with Connection Stru...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Raised Via for Terminal Connections on Different Planes

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT

Semiconductor Packages and Method Forming Same

Semiconductor Devices and Methods of Manufacture Thereof

Raised Via for Terminal Connections on Different Planes

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

Semiconductor Devices and Methods of Manufacture Thereof

Semiconductor Device with Plated Lead Frame

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

Apparatus and Associated Methods

METHOD FOR MANUFACTURING ELECTRONIC DEVICES