involving monitoring

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H01L2224/869

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/869involving monitoring

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Patents Grantslast 30 patents

Information Patent Grant
Image pickup apparatus, endoscope, and method for manufacturing ima...
- Patent number 11,134,829
- Issue date Oct 5, 2021
- Olympus Corporation
- Takuro Suyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding wires to passivated chip microcircuit conductors
- Patent number 4,341,942
- Issue date Jul 27, 1982
- International Business Machines Corporation
- Praveen Chaudhari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR