involving the application of pressure

Industry

CPC
H01L21/447

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/447involving the application of pressure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,148,828
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,916,144
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,901,342
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,712,747
- Issue date Aug 1, 2023
- Disco Corporation
- Ye Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method including uniting wafer, ring frame and pol...
- Patent number 11,545,393
- Issue date Jan 3, 2023
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for temperature modification and reduction of...
- Patent number 11,515,171
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Xiaopeng Qu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 11,393,721
- Issue date Jul 19, 2022
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method including uniting a wafer, a ring frame and...
- Patent number 11,380,588
- Issue date Jul 5, 2022
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method including uniting a wafer, a ring frame and...
- Patent number 11,380,587
- Issue date Jul 5, 2022
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas delivery module
- Patent number 11,361,978
- Issue date Jun 14, 2022
- Applied Materials, Inc.
- Adib M. Khan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer processing method including applying a polyester sheet to a w...
- Patent number 11,322,407
- Issue date May 3, 2022
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,222,874
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier film, element transfer method using same, and electronic pr...
- Patent number 11,152,256
- Issue date Oct 19, 2021
- Korea Institute of Machinery & Materials
- Yun Hwangbo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor manufacturing method and semiconductor manufacturing...
- Patent number 11,107,685
- Issue date Aug 31, 2021
- Mitsubishi Electric Corporation
- Keisuke Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED module and method for fabricating the same
- Patent number 11,069,664
- Issue date Jul 20, 2021
- LUMENS CO., LTD.
- Daewon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method using a ring frame and a polyester sheet
- Patent number 11,056,334
- Issue date Jul 6, 2021
- Disco Corporation
- Shigenori Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method including applying a polyolefin sheet to a...
- Patent number 11,031,234
- Issue date Jun 8, 2021
- Disco Corporation
- Shigenori Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method including applying a polyester sheet to a w...
- Patent number 10,991,587
- Issue date Apr 27, 2021
- Disco Corporation
- Shigenori Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device and manufacturing method and appara...
- Patent number 10,950,391
- Issue date Mar 16, 2021
- Kabushiki Kaisha Toshiba
- Shigehiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas delivery module
- Patent number 10,748,783
- Issue date Aug 18, 2020
- Applied Materials, Inc.
- Adib M. Khan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,741,413
- Issue date Aug 11, 2020
- Mitsubishi Electric Corporation
- Norihisa Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing low-permittivity spacers
- Patent number 10,658,197
- Issue date May 19, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nicolas Posseme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and structures
- Patent number 10,651,050
- Issue date May 12, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,643,880
- Issue date May 5, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring pattern, method for manufacturing t...
- Patent number 10,438,814
- Issue date Oct 8, 2019
- Nikon Corporation
- Makoto Nakazumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and related methods
- Patent number 10,418,255
- Issue date Sep 17, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device for chip on film and display panel and bonding metho...
- Patent number 10,395,945
- Issue date Aug 27, 2019
- BOE Technology Group Co., Ltd.
- Lili Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 10,242,970
- Issue date Mar 26, 2019
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of treating semiconductor substrate
- Patent number 10,229,828
- Issue date Mar 12, 2019
- SK Hynix Inc.
- Yong Soo Choi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SINTER BONDING SHEET
- Publication number 20240339335
- Publication date Oct 10, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20240186298
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240087900
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM
- Publication number 20230207331
- Publication date Jun 29, 2023
- TOKYO ELECTRON LIMITED
- Takuo Kawauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY
- Publication number 20230197637
- Publication date Jun 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220384658
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20220130807
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210399136
- Publication date Dec 23, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION AND REDUCTION OF...
- Publication number 20210384042
- Publication date Dec 9, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210143064
- Publication date May 13, 2021
- Disco Corporation
- Shigenori HARADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210129260
- Publication date May 6, 2021
- Disco Corporation
- Ye CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210118736
- Publication date Apr 22, 2021
- Disco Corporation
- Shigenori HARADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210111073
- Publication date Apr 15, 2021
- Disco Corporation
- Shigenori HARADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210074589
- Publication date Mar 11, 2021
- Disco Corporation
- Shigenori HARADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20200388537
- Publication date Dec 10, 2020
- Disco Corporation
- Shigenori HARADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS DELIVERY MODULE
- Publication number 20200343103
- Publication date Oct 29, 2020
- Applied Materials, Inc.
- Adib M. KHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD OF SOLAR CELL MODULE
- Publication number 20200313027
- Publication date Oct 1, 2020
- PANASONIC CORPORATION
- Naoya Sotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20200144049
- Publication date May 7, 2020
- Disco Corporation
- Shigenori HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20200144048
- Publication date May 7, 2020
- Disco Corporation
- Shigenori HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20200126799
- Publication date Apr 23, 2020
- Disco Corporation
- Shigenori HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200058517
- Publication date Feb 20, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Norihisa MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FILM, ELEMENT TRANSFER METHOD USING SAME, AND ELECTRONIC PR...
- Publication number 20200043780
- Publication date Feb 6, 2020
- Korea Institute of Machinery and Materials
- Yun HWANGBO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
GAS DELIVERY MODULE
- Publication number 20200035509
- Publication date Jan 30, 2020
- Applied Materials, Inc.
- Adib M. KHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...
- Publication number 20190362974
- Publication date Nov 28, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Keisuke NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND STRUCTURES
- Publication number 20190273000
- Publication date Sep 5, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING MICRO DEVICE
- Publication number 20190252232
- Publication date Aug 15, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20190189597
- Publication date Jun 20, 2019
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS
- Publication number 20190172724
- Publication date Jun 6, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING PATTERN, METHOD FOR MANUFACTURING T...
- Publication number 20180108539
- Publication date Apr 19, 2018
- Nikon Corporation
- Makoto NAKAZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TREATING SEMICONDUCTOR SUBSTRATE
- Publication number 20180076022
- Publication date Mar 15, 2018
- SK HYNIX INC.
- Yong Soo CHOI
- H01 - BASIC ELECTRIC ELEMENTS

involving the application of pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Discontinuous patterned bonds for semiconductor devices and associa...

Wafer processing method

Wafer processing method including uniting wafer, ring frame and pol...

Methods and apparatus for temperature modification and reduction of...

Wafer processing method

Wafer processing method including uniting a wafer, a ring frame and...

Wafer processing method including uniting a wafer, a ring frame and...

Gas delivery module

Wafer processing method including applying a polyester sheet to a w...

Discontinuous patterned bonds for semiconductor devices and associa...

Carrier film, element transfer method using same, and electronic pr...

Semiconductor manufacturing method and semiconductor manufacturing...

Micro-LED module and method for fabricating the same

Wafer processing method using a ring frame and a polyester sheet

Wafer processing method including applying a polyolefin sheet to a...

Wafer processing method including applying a polyester sheet to a w...

Photoelectric conversion device and manufacturing method and appara...

Method for transferring micro device

Gas delivery module

Semiconductor device and method for manufacturing semiconductor device

Method for producing low-permittivity spacers

Semiconductor device packages and structures

Method for transferring micro device

Method for manufacturing wiring pattern, method for manufacturing t...

Semiconductor device packages and related methods

Bonding device for chip on film and display panel and bonding metho...

Discontinuous patterned bonds for semiconductor devices and associa...

Method of treating semiconductor substrate

Patents Applicationslast 30 patents

SINTER BONDING SHEET

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

BONDING SYSTEM

MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION AND REDUCTION OF...

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

GAS DELIVERY MODULE

MANUFACTURING METHOD OF SOLAR CELL MODULE

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CARRIER FILM, ELEMENT TRANSFER METHOD USING SAME, AND ELECTRONIC PR...

GAS DELIVERY MODULE

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...

SEMICONDUCTOR DEVICE PACKAGES AND STRUCTURES

METHOD FOR TRANSFERRING MICRO DEVICE

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS

METHOD FOR MANUFACTURING WIRING PATTERN, METHOD FOR MANUFACTURING T...

METHOD OF TREATING SEMICONDUCTOR SUBSTRATE