Embodiments of the present disclosure generally relate to apparatus for semiconductor processing. More specifically, embodiments of the disclosure relate to a high pressure gas delivery module.
The field of semiconductor manufacturing utilizes various processes to fabricate devices which are incorporated into integrated circuits. As device complexity increases, integrated circuit manufacturers look for improved methodologies to fabricate advanced node devices. For example, advanced processing characteristics may include the utilization of more extreme process variables to enable advanced device fabrication.
One example of a process variable which is increasingly being investigated for utilization in semiconductor manufacturing is high pressure processing. High pressure processing at pressures elevated above atmospheric pressure has shown promising material modulation characteristics. However, apparatus suitable for safely and efficiently performing high pressure processing is often lacking when considering the requisite degree of control desired to perform advanced node device fabrication processes.
Accordingly, what is needed in the art are improved high pressure processing apparatus and methods for performing high pressure processing.
In one embodiment, a high pressure processing apparatus is provided. The apparatus includes a first chamber body defining a first volume therein. A second chamber body is disposed within the first volume and the second chamber body defines a second volume therein. A fluid delivery module is in fluid communication with the second volume. The fluid delivery module includes a first reservoir, a first conduit extending between the first reservoir and the second volume, a flow regulator disposed on the first conduit, a second reservoir in fluid communication with a plurality of gas pumps, and a second conduit extending between the second reservoir and the second volume.
In another embodiment, a high pressure processing apparatus is provided. The apparatus includes an enclosure defining a volume therein and a first reservoir disposed within the volume. The first reservoir includes a fluid inlet port, a first fluid outlet port, and a second fluid outlet port. A second reservoir is disposed within the volume and the second reservoir includes a fluid inlet port and a fluid outlet port. The apparatus further includes a first gas pump, a second gas pump disposed between the first gas pump and the second reservoir, and a conduit extending between the second gas pump and the second reservoir.
In yet another embodiment, a high pressure processing apparatus is provided. The apparatus includes a first chamber body defining a first volume therein, a first slit valve door coupled to an external surface of the first chamber body, a second chamber body disposed within the first volume, the second chamber body defining a second volume therein, and a second slit valve door coupled to an interior surface of the second chamber body. A fluid delivery module is in fluid communication with the second volume via a plurality of conduits. The fluid delivery module includes a first reservoir in fluid communication with the second volume via a first conduit of the plurality, a second reservoir fabricated from a nickel containing steel alloy in fluid communication with the second volume via a second conduit, a first gas pump fabricated from the nickel containing steel alloy, and a second gas pump fabricated from the nickel containing steel alloy. The second gas pump is in fluid communication with each of the first gas pump and the second reservoir.
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, may admit to other equally effective embodiments.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
Embodiments of the present disclosure relate to high pressure processing apparatus for semiconductor processing. The apparatus described herein include a high pressure process chamber and a containment chamber surrounding the process chamber. A high pressure fluid delivery module is in fluid communication with the high pressure process chamber and is configured to deliver a high pressure fluid to the process chamber.
The first chamber 116 has an exhaust port 128 formed therein. An exhaust conduit 103 is coupled to the first chamber 116 at the exhaust port 128 such that the exhaust conduit 103 is in fluid communication with the first volume 118. An isolation valve 105 and a throttle valve 107 are disposed on the exhaust conduit 103. The isolation valve 105 is disposed on the exhaust conduit 103 between the throttle valve 107 and the exhaust port 128. The isolation valve 105 is operable to initiate and extinguish fluid communication between the first volume 118 and an exhaust 113. The throttle valve 107 controls a flow rate of effluent flowing through the exhaust conduit 103 from the first volume 118.
A pump 109 is also coupled to the exhaust conduit 103 and the pump 109 operates to pull fluid from the first volume 118 to the exhaust 113. The pump 109 is disposed on exhaust conduit 103 between the throttle valve 107 and the exhaust 113. In one embodiment, the pump 109 generates a sub-atmospheric pressure in the first volume 118, such as a pressure less than about 700 Torr. A scrubber 111 is also disposed on the exhaust conduit 103 between the pump 109 and the exhaust 113. The scrubber 111 is in fluid communication with the first volume 118 via the exhaust conduit 103 and the scrubber 111 is configured to treat effluent from the first volume 118 prior to the effluent exiting the exhaust conduit 103 to the exhaust 113.
The first chamber 116 has an external surface 124 which is not exposed to the first volume 118. A first slit valve 120 is formed in the chamber 116 to enable ingress and egress of a substrate therethrough. A first slit valve door 122 is coupled to the external surface 124 adjacent to the first slit valve 120. In operation, the first slit valve door 122 is opened to enable passage of the substrate therethrough and closes prior to processing of the substrate.
A second chamber 102 is disposed within the first volume 118 defined by the first chamber 116. The second chamber 102 defines a second volume 104 therein. Similar to the first chamber 116, the second chamber 102 is fabricated from a process compatible material, such as aluminum, stainless steel, alloys thereof, and combinations thereof. In one embodiment, the second chamber 102 is fabricated from a nickel containing steel alloy, for example, a nickel molybdenum containing steel alloy or a nickel chromium molybdenum containing steel alloy. The material selected for fabrication of the second chamber 102 is suitable for operation of the second volume 104 at high pressures, such as greater than about 30 bar, for example, about 50 bar or greater.
A pedestal 106 is disposed in the second chamber 102 and the pedestal 106 has a substrate support surface 108 for supporting a substrate thereon during processing. In one embodiment, the pedestal 106 includes a resistive heater operable of maintaining a temperature of a substrate disposed on the substrate support surface 108 at a temperature of up to about 550° C. Although not illustrated, a stem of the pedestal 106 extends through the second chamber 102 and the first chamber 116. The stem of the pedestal 106 may be isolated from the first volume 118 by a bellows assembly which is operable isolate the pedestal 106 from the first volume 118.
A second slit valve 110 is formed through the second chamber 102 to enable ingress and egress of the substrate therethrough. The second slit valve 110 is substantially aligned in approximately the same plane as the first slit valve 120. A second slit valve door 112 is coupled to an internal surface 114 of the second chamber 102 adjacent to the second slit valve 110. The positioning of the second slit valve door 112 on the internal surface 114 enables more secure sealing of the second volume 104 during high pressure processing because the high pressure maintained within the second volume 104 urges the second slit valve door 112 against the internal surface 114 to create a substantially air tight seal. In operation, the second slit valve door 112 is opened to enable passage of the substrate from the first slit valve 120. After the substrate is positioned on the substrate support surface 108 of the pedestal 106, the second slit valve door 112 closes prior to processing of the substrate.
A fluid management apparatus 140 is configured to deliver one or more fluids to the second volume 104 of the second chamber 102. The fluid management apparatus 140 includes a first fluid delivery module 144, a second fluid delivery module 142, and a third fluid delivery module 146. The first fluid delivery module 144 is operable to generate steam and deliver steam to the second volume 104. The first fluid delivery module 144 is in fluid communication with a first fluid source 150. In one embodiment, the first fluid source 150 is a water source, and more specifically, a deionized water source. The second fluid delivery module 142 is in fluid communication with a second fluid source 152. In one embodiment, the second fluid source 152 is a hydrogen source, and more specifically, an H2 source. The third fluid delivery module 146 is in fluid communication with a third fluid source 148. In one embodiment, the third fluid source 148 is a nitrogen gas source, for example, an ammonia source.
The first fluid delivery module 144 is in fluid communication with the second volume 104 via a first conduit 156. A valve 164 is disposed between the first fluid delivery module 144 and the first conduit 156. The valve 164 is operable to enable fluid flow from the first fluid delivery module 144 through the first conduit 156. A containment enclosure 166 surrounds the valve 164 and the connections of the valve 164 between the first fluid delivery module 144 and the first conduit 156. The first conduit 156 extends from the first valve 164 through the first chamber 116, the first volume 118, and the second chamber 102 to a port 132 formed on the internal surface 114 of the second chamber 102. In one embodiment, a heater jacket 157 surrounds the first conduit 156 and extends along a length of the first conduit 156 between the valve 164 and the first chamber 116.
The second fluid delivery module 142 is in fluid communication with the second volume 104 via a second conduit 154. A valve 160 is disposed between the second fluid delivery module 142 and the second conduit 154. The valve 160 is operable to enable fluid flow from the second fluid delivery module 142 through the second conduit 154. A containment enclosure 162 surrounds the valve 160 and the connections of the valve 160 between the second fluid delivery module 142 and the second conduit 154. The second conduit 154 extends from the second valve 160 through the first chamber 116, the first volume 118, and the second chamber 102 to a port 130 formed on the internal surface 114 of the second chamber 102. In one embodiment, a heater jacket 155 surrounds the second conduit 154 and extends along a length of the second conduit 154 between the valve 160 and the first chamber 116.
The third fluid delivery module 146 is in fluid communication with the second volume 104 via a third conduit 158. A valve 168 is disposed between the third fluid delivery module 146 and the third conduit 158. The valve 168 is operable to enable fluid flow from the third fluid delivery module 146 through the third conduit 158. A containment enclosure 170 surrounds the valve 168 and the connections of the valve 168 between the third fluid delivery module 146 and the third conduit 158. The third conduit 158 extends from the third valve 168 through the first chamber 116, the first volume 118, and the second chamber 102 to a port 134 formed on the internal surface 114 of the second chamber 102. In one embodiment, a heater jacket 159 surrounds the third conduit 158 and extends along a length of the third conduit 158 between the valve 168 and the first chamber 116.
Each of the heater jackets 155, 157, 159 are operable to maintain a temperature of a respective conduit 154, 156, 158 at about 300° C. or greater, for example. 350° C. or greater. In one embodiment the heater jackets 155, 157, 159 comprise resistive heaters. In another embodiment, the heater jackets 155, 157, 159 comprise fluid channels though which a heated fluid is flowed. By maintaining the conduits 154, 156, 158 at elevated temperatures, steam and other high pressure fluids maintain desirable property characteristics during transfer from the respective fluid delivery modules 142, 144, 146 to the second volume 104. In one example, steam generated in the fluid delivery module 144 is maintained in the conduit 156 at elevated temperatures by the heater jacket 157 to prevent or substantially reduce the probability of condensation during steam transfer.
The apparatus 100 also includes a purge gas source 172. In one embodiment, the purge gas source 172 is an inert gas source, such as a nitrogen source or a noble gas source. The purge gas source 172 is in fluid communication with the first volume 118. A conduit 174 extends from the purge gas source 172 to a port 126 formed in the first chamber 116. The fluid communication between the purge gas source 172 and the first volume 118 enables the first volume 118 to be purged with an inert gas. It is contemplated that the first volume 118 is a containment volume that functions as a failsafe should the second volume 104 experience an unplanned depressurization event. By having a sufficiently large volume to function as an expansion volume and by having purge gas capability, the first volume 118 enables improved safety of operation of the second chamber 102 at elevated pressures.
The purge gas source 172 is also in fluid communication with each of the conduits 156, 154, 158. A conduit 176 extends from the purge gas source 172 to each of the valves 160, 164, 168. When the valves 160, 164, 168 are opened to receive purge gas from the purge gas source 172 flowing through the conduit 176, the conduits 154, 156, 158 are purged to eliminate fluids in the conduits 154, 156, 158 that were previously delivered from the fluid delivery modules 142, 144, 146. The fluid communication between the purge gas source 172 and the conduits 154, 156, 158 also enables purging of the second volume 104.
To remove fluids from the second volume 104, an exhaust port 136 is formed in the second chamber 102. A conduit 180 extends from the exhaust port 136 to a regulator valve 184 which is configured to enable a pressure drop across the regulator valve 184. In one embodiment, pressurized fluid exhausted from the second volume 104 travels through the exhaust port 136, through the conduit 180, and through a valve 182 to the regulator valve 184 where a pressure of the fluid is reduced from greater than about 30 bar, such as about 50 bar, to between about 0.5 bar to about 3 bar. The valve 182 is disposed inline with the regulator valve 184 and enables transfer of the reduced pressure fluid from the conduit 180 to a conduit 188.
A pressure relief port 138 is also formed in the second chamber 102. A conduit 186 extends from the pressure relief port 138 to the conduit 188 and the conduit 186 is coupled to the conduit 188 downstream of the regulator valve 184 and the valve 182. The pressure relief port 138 and conduit 186 are configured to bypass the regulator valve 184 and function as a secondary pressure reduction for the second volume 104. A valve 196 is disposed on the conduit 188 downstream from the conduit 186, the regulator valve 184, and the valve 182. The valve 196 functions to enable fluid flow from the second volume 104 via the pressure relief port 138 without passing through the regulator valve 184. Accordingly, the second volume 104 has a bifurcated pressure relief architecture, first through the exhaust port 136, the conduit 180, and the regulator valve 184, and second, through the pressure relief port 138 and the conduit 186. It is believed that the bifurcated pressure relief architecture enables improved control of the pressures generated in the second volume 104.
A conduit 190 is coupled to and extends from the conduit 188 between the valve 184 and the valve 196. More specifically, the conduit 190 is coupled to the conduit 188 downstream of a location where the conduit 186 is coupled to the conduit 188. A valve 192 is disposed on the conduit 190 and is operable to enable selective fluid communication between the second volume 104 and a steam trap 194. The steam trap 194 is configured to condense steam released from the second volume 104 when high pressure steam processes are performed in the second volume 104. In one embodiment, the steam trap 194 is in fluid communication with the second volume 104 via the conduits 190, 188, and 186 when the valve 192 is opened and the valve 182 is closed. The steam trap 194 may also function as a secondary pressure reduction apparatus for high pressure steam released from the second volume 104.
A containment enclosure 198 is coupled to the first chamber 116 and each of the regulator valve 184, the valve 182, the valve 196, and the valve 192 are disposed within the containment enclosure 198. The conduits 188, 190 are disposed within the containment enclosure 198 and at least a portion of each of the conduits 180, 186 is disposed within the containment enclosure 198. In one embodiment, the steam trap 194 is disposed within the containment enclosure 198. In another embodiment, the steam trap 194 is disposed outside of the containment enclosure 198. The containment enclosure 198 is configured to isolate and contain any leakage of effluent exhausted from the second volume 104. Although not illustrated, the containment enclosure 198 volume is in fluid communication with the scrubber 111 to enable treatment of effluent constrained within the containment enclosure 198.
When the valve 196 is opened, fluid from the conduit 188 travels to a conduit 101 which is in fluid communication with the exhaust conduit 103. The conduit 101 extends form the valve 196 to the exhaust conduit 103 and couples to the exhaust conduit 103 between the throttle valve 107 and the pump 109. Thus, fluid from the second volume 104 which travels through the conduit 101 enters the exhaust conduit 103 upstream from the pump 109 and is subsequently treated by the scrubber 111 prior to exiting to the exhaust 113.
In one embodiment, the first reservoir 204 and the second reservoir 206 are fabricated from similar materials. For example, the first reservoir 204 and the second reservoir 206 are fabricated from a nickel containing steel alloy. In one embodiment, the first reservoir 204 and the second reservoir 206 are fabricated from a nickel containing steel alloy comprising molybdenum. In another embodiment, the first reservoir 204 and the second reservoir 206 are fabricate from a nickel containing steel alloy comprising chromium. In another embodiment, both of the first reservoir 204 and the second reservoir 206 are fabricated from a stainless steel containing material. In another embodiment, the materials selected for the first reservoir 204 and the second reservoir 206 are different. For example, the first reservoir 204 is fabricated from an aluminum material, a stainless steel material, or alloys thereof and the second reservoir 206 is fabricated from one of the aforementioned nickel containing steel alloys.
The material selected for the second reservoir 206 is highly corrosion resistant to the precursors which are maintained therein at an elevated pressure. One example of precursors which are maintained at elevated (supra-atmospheric) pressure is ammonia. It is also contemplated that various other precursor materials may be utilized in accordance with the embodiments described herein. The materials selected for the first reservoir 204 and the second reservoir 206 are also contemplated to provide sufficient mechanical integrity to enable generation and maintenance of elevated or reduced pressures therein. The first reservoir 204 is operable at temperatures less than about 300° C., for example, less than about 200° C. The second reservoir 206 is operable at temperatures greater than about 250° C., such as temperatures up to about 450° C.
The fluid delivery module 142/146 includes a containment structure 202. In one embodiment, the first reservoir 204 and the second reservoir 206 are disposed within the containment structure 202 in a single volume. In another embodiment, the containment structure 202 is divided to form separate regions therein, for example, a first region 224 and a second region 226. In one embodiment, the first reservoir 204 is disposed in the first region 224 and the second reservoir 206 is disposed in the second region 226. It is contemplated that the regions 224, 226 may either be in fluid communication with one another or may be fluidly isolated from one another, depending upon the containment characteristics desired.
A purge gas source 211 is coupled to a conduit 212 which extends between the purge gas source 211 to a port 242 formed in the containment structure 202. The port 242 is formed in the containment structure 202 adjacent to the first region 224. In one embodiment, the purge gas source 211 is operable to deliver a purge gas, such an N2 or a noble gas, to the first region 224. In one embodiment, the first region 224 and the second region 226 are in fluid communication with one another and the purge gas source 211 is operable to deliver a purge gas to both the first region 224 and the second region 226. In another embodiment, the purge gas source 211 is in fluid communication with the first reservoir 204. The conduit 212 may be coupled directly or indirectly to the port 242 to enable fluid communication between the purge gas source 211 and the first reservoir 204. In this embodiment, the purge gas source 211 is operable to deliver an inert gas to the first reservoir 204 to purge the first reservoir 204 and remove effluent therefrom. Purge gas from the first reservoir 204 may also be utilized to flush conduit 220 which are coupled to and in fluid communication with the first reservoir 204.
The exhaust 113 is in fluid communication with the second region 226 of the containment structure 202. In one embodiment, fluids existing in the second region 226 outside of the second reservoir 206 are exhausted from the second region 226 to the exhaust 113. In embodiments where the first region 224 and the second region 226 are in fluid communication with one another, fluids from both the first region 224 and the second region 226 are capable of being removed from the regions 224, 226 by the exhaust 113.
The fluid sources 148, 152 are coupled to and in fluid communication with a port 238 formed in the first reservoir 204. In one embodiment, the fluid sources 148, 152 are operable to deliver one or more fluids to the first reservoir 204. In one embodiment, the fluid sources 148, 152 are operable to deliver a liquid precursor to the first reservoir 204. In another embodiment, the fluid sources 148, 152, are operable to deliver a gaseous precursor to the first reservoir 204. In one embodiment, the fluid sources 148, 152 deliver a hafnium containing material, a titanium containing material, or a combination thereof to the first reservoir 204. In one embodiment, the materials delivered from the first reservoir 204 to the second volume 104 are configured to coat surfaces of the second chamber 102.
The first reservoir 204 has a port 240 formed therein which is coupled to a conduit 228. The conduit 228 extends to the second volume 104 and a flow rate controller 236 is disposed inline with the conduit 228. The flow rate controller 236 is operable to control a flow rate of fluid exiting the port 240 and flowing through the conduit 228 to the second volume 104. A port 246 is also formed in the first reservoir 204. A conduit 220 is coupled to the port 246. The conduit 220 extends from the port 246 to the second volume 104. A valve 222 is disposed on the conduit 220 which is operable to enable fluid communication between the first reservoir 204 and the second volume 104.
In one embodiment, both of the conduits 220, 228 are in fluid communication between the first reservoir 204 and the second volume 104. In one embodiment, the conduits 220, 228 enter the second volume 104 opposite one another. In another embodiment, one or both of the conduits 220, 228 are coupled to a showerhead (not illustrated) disposed in the second volume 104 and the showerhead distributes fluid delivered from the first reservoir 204 throughout the second volume 104.
A first gas pump 208 and a second gas pump 210 are disposed in the second region 226. The first gas pump 208 and the second gas pump 210 are operable to generate a staged pressure increase of a gas to be maintained in the second reservoir 206. In one embodiment, the first gas pump 208 and the second gas pump 210 are positioned in series to decrease a ramp time associated with pressurization of a fluid (i.e. gas) to be delivered to the second reservoir 206. Alternatively, the first gas pump 208 and the second gas pump 210 are positioned in parallel and each deliver a pressurized fluid to the conduit 218 which is in fluid communication with the second reservoir 206. In one embodiment, the first gas pump 208 and the second gas pump 210 are pneumatic pumps. In another embodiment, the first gas pump 208 and the second gas pump 210 are hydraulic pumps.
A gas source 214 is in fluid communication with the first gas pump 208 via a conduit 216. In one embodiment, the gas source 214 is a hydrogen source. In another embodiment, the gas source 214 is an ammonia source. In operation, gas is delivered at approximately atmospheric pressure from the gas source 214 to the first gas pump 208. The first gas pump 208 increases a pressure of the gas and delivers the pressurized gas through a conduit 234 which is in fluid communication with the second gas pump 210. The second gas pump 210 further increases the pressure of the gas and delivers the further pressurized gas to the second reservoir through the conduit 218 which is in fluid communication with the second reservoir 206 via a port 248 formed in the second reservoir 206. In one embodiment, the first gas pump 208 and the second gas pump 210 are operable to generate gas pressures of up to about 40,000 psi.
In one embodiment, the gas pumps 208, 210 and the second reservoir 206 are formed from the same material. In one embodiment, the material selected for the gas pumps 208, 210 and the second reservoir 206 is a stainless steel material, a nickel containing stainless steel material, a nickel molybdenum containing stainless steel material, a nickel chromium stainless steel material, and combinations and mixtures thereof. The materials selected for the gas pumps 208, 210 and the second reservoir 206 are selected to be substantially inert to the pressurized gases flowing therethrough. As such, corrosion of the gas pumps 208, 210 and the second reservoir 206 is reduced which lengthens the useful life of the apparatus and improved the operation thereof by reducing the probability of a catastrophic failure under the elevated pressures generated therein.
A port 250 is also formed in the second reservoir 206. The port 250 is in fluid communication with the conduit 154, 158. A valve 232 is disposed on the conduit 154, 158 which selectively enables fluid communication between the second reservoir 206 and the second volume 104.
In operation, a pressurized fluid is generated by the pumps 208, 210 and delivered to the second reservoir 206. The second reservoir 206 functions as a pressure vessel to hold the fluid in a pressurized state until the fluid is delivered to the second volume 104. A controller 254 is in fluid communication between the second reservoir 206 and the second volume 104 via a conduit 230. The controller 254 measures a pressure within the second volume 104 and determines whether more or less fluid is needed in the second volume 104 to maintain a set pressure point or range of pressure. The controller 254 is also in communication with one or both of the valves 160, 168 and the valve 232 to facilitate fluid delivery to the second volume 104. Thus, the controller 254 provides for closed loop control to enable maintenance of a desired process pressure within the second volume 104.
In summation, apparatus for high pressure processing are described herein. Fluid delivery modules enable generation of fluids at high pressure and facilitate delivery of such fluids to a volume of a process chamber. In one embodiment, the fluid delivery module for generation and delivery of a pressurized fluid includes a second reservoir fabricated from corrosion resistant materials. A first reservoir receives a fluid precursor and delivers the fluid precursor to the second volume. The first reservoir and the second reservoir are in fluid communication with the second volume to coat the chamber and perform high pressure processing in the process chamber, respectively. Various containment apparatus and pressure relief architectures are also described herein to enable safe and efficient operation of apparatus during high pressure processing.
While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
This application claims benefit of U.S. Provisional Patent Application No. 62/703,251, filed Jul. 25, 2018, the entirety of which is hereby incorporated by reference.
Number | Name | Date | Kind |
---|---|---|---|
4524587 | Kantor | Jun 1985 | A |
4879259 | Reynolds et al. | Nov 1989 | A |
5050540 | Lindberg | Sep 1991 | A |
5114513 | Hosokawa et al. | May 1992 | A |
5126117 | Schumacher et al. | Jun 1992 | A |
5149378 | Ohmi et al. | Sep 1992 | A |
5175123 | Vasquez et al. | Dec 1992 | A |
5319212 | Tokoro | Jun 1994 | A |
5366905 | Mukai | Nov 1994 | A |
5578132 | Yamaga et al. | Nov 1996 | A |
5590695 | Siegele et al. | Jan 1997 | A |
5620524 | Fan et al. | Apr 1997 | A |
5808245 | Wiese et al. | Sep 1998 | A |
5858051 | Komiyama et al. | Jan 1999 | A |
5879756 | Fathi et al. | Mar 1999 | A |
5880041 | Ong | Mar 1999 | A |
5940985 | Kamikawa et al. | Aug 1999 | A |
6082950 | Altwood et al. | Jul 2000 | A |
6136664 | Economikos et al. | Oct 2000 | A |
6150286 | Sun et al. | Nov 2000 | A |
6164412 | Allman | Dec 2000 | A |
6242368 | Holmer et al. | Jun 2001 | B1 |
6251751 | Chu et al. | Jun 2001 | B1 |
6299753 | Chao et al. | Oct 2001 | B1 |
6319766 | Bakli et al. | Nov 2001 | B1 |
6334266 | Moritz et al. | Jan 2002 | B1 |
6368412 | Gomi | Apr 2002 | B1 |
6442980 | Preston et al. | Sep 2002 | B2 |
6468490 | Shamouilian et al. | Oct 2002 | B1 |
6500603 | Shioda | Dec 2002 | B1 |
6583497 | Xia et al. | Jun 2003 | B2 |
6619304 | Worm | Sep 2003 | B2 |
6797336 | Garvey et al. | Sep 2004 | B2 |
7055333 | Leitch et al. | Jun 2006 | B2 |
7084079 | Conti et al. | Aug 2006 | B2 |
7111630 | Mizobata et al. | Sep 2006 | B2 |
7114517 | Sund et al. | Oct 2006 | B2 |
7211525 | Shanker et al. | May 2007 | B1 |
7282458 | Gates et al. | Oct 2007 | B2 |
7361231 | Fury et al. | Apr 2008 | B2 |
7460760 | Cho et al. | Dec 2008 | B2 |
7491658 | Nguyen et al. | Feb 2009 | B2 |
7503334 | Shrinivasan et al. | Mar 2009 | B1 |
7521089 | Hillman et al. | Apr 2009 | B2 |
7521378 | Fucsko et al. | Apr 2009 | B2 |
7541297 | Mallick et al. | Jun 2009 | B2 |
7576441 | Yin et al. | Aug 2009 | B2 |
7650965 | Thayer et al. | Jan 2010 | B2 |
7651959 | Fukazawa et al. | Jan 2010 | B2 |
7655532 | Chen et al. | Feb 2010 | B1 |
7825038 | Ingle et al. | Nov 2010 | B2 |
7825042 | Mandal | Nov 2010 | B2 |
7867923 | Mallick et al. | Jan 2011 | B2 |
7891228 | Ding et al. | Feb 2011 | B2 |
8027089 | Hayashi | Sep 2011 | B2 |
8306026 | Anjum et al. | Nov 2012 | B2 |
8318584 | Li et al. | Nov 2012 | B2 |
8349085 | Tahara et al. | Jan 2013 | B2 |
8449942 | Li et al. | May 2013 | B2 |
8455368 | Chandler et al. | Jun 2013 | B2 |
8466073 | Wang et al. | Jun 2013 | B2 |
8481123 | Kim et al. | Jul 2013 | B2 |
8536065 | Seamons et al. | Sep 2013 | B2 |
8557712 | Antonelli et al. | Oct 2013 | B1 |
8563445 | Liang et al. | Oct 2013 | B2 |
8647992 | Liang et al. | Feb 2014 | B2 |
8741788 | Liang et al. | Jun 2014 | B2 |
8871656 | Mallick et al. | Oct 2014 | B2 |
8906761 | Kim et al. | Dec 2014 | B2 |
8936834 | Kim et al. | Jan 2015 | B2 |
9121515 | Yamamoto et al. | Sep 2015 | B2 |
9153442 | Wang et al. | Oct 2015 | B2 |
9157730 | Rajagopalan et al. | Oct 2015 | B2 |
9257314 | Rivera et al. | Feb 2016 | B1 |
9306026 | Toriumi et al. | Apr 2016 | B2 |
9362107 | Thadani et al. | Jun 2016 | B2 |
9382621 | Choi | Jul 2016 | B2 |
9484406 | Sun et al. | Nov 2016 | B1 |
9570551 | Balakrishnan et al. | Feb 2017 | B1 |
10083834 | Thompson et al. | Sep 2018 | B2 |
10096516 | Leschkies et al. | Oct 2018 | B1 |
10276411 | Delmas et al. | Apr 2019 | B2 |
20010029108 | Tometsuka | Oct 2001 | A1 |
20010041122 | Kroeker | Nov 2001 | A1 |
20010050096 | Costantini et al. | Dec 2001 | A1 |
20020066535 | Brown et al. | Jun 2002 | A1 |
20020073922 | Frankel et al. | Jun 2002 | A1 |
20020122885 | Ahn | Sep 2002 | A1 |
20020134439 | Kawasaki et al. | Sep 2002 | A1 |
20020148492 | Yamagata et al. | Oct 2002 | A1 |
20020151128 | Lane et al. | Oct 2002 | A1 |
20020155714 | Suzuki | Oct 2002 | A1 |
20030030945 | Heinonen et al. | Feb 2003 | A1 |
20030049372 | Cook et al. | Mar 2003 | A1 |
20030101938 | Ronsse et al. | Jun 2003 | A1 |
20030148035 | Lingampalli | Aug 2003 | A1 |
20030148631 | Kuo et al. | Aug 2003 | A1 |
20030207593 | Derderian et al. | Nov 2003 | A1 |
20040025908 | Douglas et al. | Feb 2004 | A1 |
20040060519 | Beauchaine et al. | Apr 2004 | A1 |
20040074869 | Wang et al. | Apr 2004 | A1 |
20040112409 | Schilling | Jun 2004 | A1 |
20040219800 | Tognetti | Nov 2004 | A1 |
20040248392 | Narwankar et al. | Dec 2004 | A1 |
20050003655 | Cathey et al. | Jan 2005 | A1 |
20050051194 | Sakashita et al. | Mar 2005 | A1 |
20050136684 | Mukai et al. | Jun 2005 | A1 |
20050191828 | Ai-Bayati et al. | Sep 2005 | A1 |
20050198971 | Leitch et al. | Sep 2005 | A1 |
20050250347 | Bailey et al. | Nov 2005 | A1 |
20050269291 | Kent | Dec 2005 | A1 |
20060003596 | Fucsko et al. | Jan 2006 | A1 |
20060105107 | Lindeboom et al. | May 2006 | A1 |
20060124613 | Kumar et al. | Jun 2006 | A1 |
20060175012 | Lee | Aug 2006 | A1 |
20060207633 | Kim et al. | Sep 2006 | A1 |
20060226117 | Bertram et al. | Oct 2006 | A1 |
20060279025 | Heidari et al. | Dec 2006 | A1 |
20060290017 | Yanagisawa | Dec 2006 | A1 |
20070012402 | Sneh | Jan 2007 | A1 |
20070045753 | Pae et al. | Mar 2007 | A1 |
20070187386 | Kim et al. | Aug 2007 | A1 |
20070204797 | Fischer | Sep 2007 | A1 |
20070212850 | Ingle et al. | Sep 2007 | A1 |
20070243317 | Du Bois et al. | Oct 2007 | A1 |
20070256559 | Chen et al. | Nov 2007 | A1 |
20080074658 | Davis et al. | Mar 2008 | A1 |
20080083109 | Shibata et al. | Apr 2008 | A1 |
20080115726 | Ingle et al. | May 2008 | A1 |
20080121882 | Hwang et al. | May 2008 | A1 |
20080210273 | Joe | Sep 2008 | A1 |
20080251904 | Theuss et al. | Oct 2008 | A1 |
20090018688 | Chandler et al. | Jan 2009 | A1 |
20090081884 | Yokota et al. | Mar 2009 | A1 |
20090110622 | Chiu et al. | Apr 2009 | A1 |
20090148965 | Kim et al. | Jun 2009 | A1 |
20090180847 | Guo et al. | Jul 2009 | A1 |
20090186481 | Suzuki et al. | Jul 2009 | A1 |
20090233449 | Lebouitz et al. | Sep 2009 | A1 |
20090243126 | Washiya et al. | Oct 2009 | A1 |
20100006211 | Wolk et al. | Jan 2010 | A1 |
20100012292 | Yamazaki | Jan 2010 | A1 |
20100022068 | Chen et al. | Jan 2010 | A1 |
20100173495 | Thakur et al. | Jul 2010 | A1 |
20100196626 | Choi | Aug 2010 | A1 |
20100304027 | Lee et al. | Dec 2010 | A1 |
20100320459 | Umeda et al. | Dec 2010 | A1 |
20100327422 | Lee et al. | Dec 2010 | A1 |
20110151677 | Wang et al. | Jun 2011 | A1 |
20110165781 | Liang et al. | Jul 2011 | A1 |
20110198736 | Shero et al. | Aug 2011 | A1 |
20120048304 | Kitajima et al. | Mar 2012 | A1 |
20120056173 | Pieralisi | Mar 2012 | A1 |
20120060868 | Gray | Mar 2012 | A1 |
20120142192 | Li et al. | Jun 2012 | A1 |
20120175822 | Inamiya et al. | Jul 2012 | A1 |
20120252210 | Tohnoe | Oct 2012 | A1 |
20120285492 | Lee et al. | Nov 2012 | A1 |
20120304485 | Hayashi et al. | Dec 2012 | A1 |
20130194350 | Watanabe et al. | Aug 2013 | A1 |
20130233170 | Spiegelman et al. | Sep 2013 | A1 |
20130288485 | Liang et al. | Oct 2013 | A1 |
20130302916 | Kim et al. | Nov 2013 | A1 |
20130330042 | Nara et al. | Dec 2013 | A1 |
20130337171 | Sasagawa | Dec 2013 | A1 |
20140023320 | Lee et al. | Jan 2014 | A1 |
20140045300 | Chen et al. | Feb 2014 | A1 |
20140076494 | Miyashita et al. | Mar 2014 | A1 |
20140134827 | Swaminathan et al. | May 2014 | A1 |
20140138802 | Starostine et al. | May 2014 | A1 |
20140183743 | Matsumoto et al. | Jul 2014 | A1 |
20140231384 | Underwood et al. | Aug 2014 | A1 |
20140235068 | Ashihara et al. | Aug 2014 | A1 |
20140239291 | Son et al. | Aug 2014 | A1 |
20140264237 | Chen et al. | Sep 2014 | A1 |
20140268080 | Beasley et al. | Sep 2014 | A1 |
20140284821 | Hubbard | Sep 2014 | A1 |
20140322921 | Ahmad et al. | Oct 2014 | A1 |
20150000870 | Hosotani et al. | Jan 2015 | A1 |
20150050807 | Wu et al. | Feb 2015 | A1 |
20150056819 | Wong et al. | Feb 2015 | A1 |
20150091009 | Yamazaki et al. | Apr 2015 | A1 |
20150099342 | Tsai et al. | Apr 2015 | A1 |
20150159272 | Yoon et al. | Jun 2015 | A1 |
20150179501 | Jhaveri et al. | Jun 2015 | A1 |
20150255581 | Lin et al. | Sep 2015 | A1 |
20150292736 | Hirson et al. | Oct 2015 | A1 |
20150309073 | Mirkin et al. | Oct 2015 | A1 |
20150322286 | Cabrini et al. | Nov 2015 | A1 |
20150364348 | Park et al. | Dec 2015 | A1 |
20160027887 | Yuan et al. | Jan 2016 | A1 |
20160035600 | Rivera et al. | Feb 2016 | A1 |
20160064209 | Lee et al. | Mar 2016 | A1 |
20160064482 | Hashemi et al. | Mar 2016 | A1 |
20160076149 | Yamazaki et al. | Mar 2016 | A1 |
20160086831 | Rivera et al. | Mar 2016 | A1 |
20160111272 | Girard et al. | Apr 2016 | A1 |
20160118391 | Zhao et al. | Apr 2016 | A1 |
20160163540 | Liao et al. | Jun 2016 | A1 |
20160208414 | Odawara et al. | Jul 2016 | A1 |
20160260526 | Otto | Sep 2016 | A1 |
20160273758 | Fujimura | Sep 2016 | A1 |
20160274454 | Beasley et al. | Sep 2016 | A1 |
20160314964 | Tang et al. | Oct 2016 | A1 |
20160334162 | Kim et al. | Nov 2016 | A1 |
20160336405 | Sun et al. | Nov 2016 | A1 |
20160353522 | Rathi et al. | Dec 2016 | A1 |
20170005204 | Hosoba et al. | Jan 2017 | A1 |
20170011932 | Pethe et al. | Jan 2017 | A1 |
20170084487 | Chebiam et al. | Mar 2017 | A1 |
20170104062 | Bi et al. | Apr 2017 | A1 |
20170140996 | Lin et al. | May 2017 | A1 |
20170160012 | Kobayashi et al. | Jun 2017 | A1 |
20170162413 | Rebstock | Jun 2017 | A1 |
20170194430 | Wood et al. | Jul 2017 | A1 |
20170253968 | Yahata | Sep 2017 | A1 |
20170263702 | Chan et al. | Sep 2017 | A1 |
20170314125 | Fenwick et al. | Nov 2017 | A1 |
20170358483 | Roy et al. | Dec 2017 | A1 |
20180019249 | Zhang et al. | Jan 2018 | A1 |
20180023192 | Chandra et al. | Jan 2018 | A1 |
20180087418 | Cadigan | Mar 2018 | A1 |
20180261480 | Liang et al. | Sep 2018 | A1 |
20180286674 | Manna et al. | Oct 2018 | A1 |
20180315626 | Franklin | Nov 2018 | A1 |
20180337027 | L'Heureux et al. | Nov 2018 | A1 |
20180342384 | Wong et al. | Nov 2018 | A1 |
20180350563 | Manna et al. | Dec 2018 | A1 |
20190057879 | Delmas et al. | Feb 2019 | A1 |
20190119769 | Khan et al. | Apr 2019 | A1 |
20190139793 | Delmas et al. | May 2019 | A1 |
20190148178 | Liang et al. | May 2019 | A1 |
20190148186 | Schaller et al. | May 2019 | A1 |
20190157074 | Delmas | May 2019 | A1 |
20190228982 | Chen et al. | Jul 2019 | A1 |
20190237345 | Delmas et al. | Aug 2019 | A1 |
20190258153 | Nemani et al. | Aug 2019 | A1 |
20190259625 | Nemani et al. | Aug 2019 | A1 |
20190279879 | Singh et al. | Sep 2019 | A1 |
20190311896 | Balseanu et al. | Oct 2019 | A1 |
20190368035 | Malik et al. | Dec 2019 | A1 |
20200035513 | Khan et al. | Jan 2020 | A1 |
20200098574 | Wong et al. | Mar 2020 | A1 |
Number | Date | Country |
---|---|---|
101871043 | Oct 2010 | CN |
104047676 | Sep 2014 | CN |
104089491 | Oct 2014 | CN |
63-004616 | Jan 1988 | JP |
06-283496 | Oct 1994 | JP |
H07048489 | May 1995 | JP |
2001110729 | Apr 2001 | JP |
2003-51474 | Feb 2003 | JP |
2004127958 | Apr 2004 | JP |
2005064269 | Mar 2005 | JP |
2005-333015 | Dec 2005 | JP |
2007242791 | Sep 2007 | JP |
2008073611 | Apr 2008 | JP |
2009-129927 | Jun 2009 | JP |
2010-205854 | Sep 2010 | JP |
2012-503883 | Feb 2012 | JP |
2012-204656 | Oct 2012 | JP |
2013-105777 | May 2013 | JP |
2013516788 | May 2013 | JP |
2013-179244 | Sep 2013 | JP |
2014019912 | Feb 2014 | JP |
20030052162 | Jun 2003 | KR |
20070075383 | Jul 2007 | KR |
20090011463 | Feb 2009 | KR |
1020090040867 | Apr 2009 | KR |
10-2009-0064279 | Jun 2009 | KR |
10-2010-0035000 | Apr 2010 | KR |
20110136532 | Dec 2011 | KR |
101287035 | Jul 2013 | KR |
101305904 | Sep 2013 | KR |
20140003776 | Jan 2014 | KR |
20140135744 | Nov 2014 | KR |
20150006587 | Jan 2015 | KR |
20150122432 | Nov 2015 | KR |
200529284 | Sep 2005 | TW |
200721316 | Jun 2007 | TW |
201507174 | Feb 2015 | TW |
2005057663 | Jun 2005 | WO |
2008089178 | Jul 2008 | WO |
2011103062 | Aug 2011 | WO |
2012133583 | Oct 2012 | WO |
2016018593 | Feb 2016 | WO |
2016065219 | Apr 2016 | WO |
Entry |
---|
International Search Report and Written Opinion for PCT/US2018/050464 dated Jan. 4, 2019. |
International Search Report and Written Opinion for PCT/US2019/056447 dated Feb. 7, 2020. |
KR Office Action dated Feb. 4, 2020 for Application No. 10-2018-0133399. |
Taiwan Office Action dated Feb. 21, 2020 for Application No. 108138212. |
International Search Report and Written Opinion for International Application No. PCT/US2019/059659 dated Feb. 26, 2020. |
Office Action from Taiwan Patent Application No. 108104585 dated Jan. 30, 2020, with concise statement of relevance. |
Pedestal definition from Dictionary.com, printed on Feb. 10, 2020 (year 2020). |
International Search Report and Written Opinion for International Application No. PCT/US2019/040195 dated Oct. 25, 2019. |
Taiwan Office Action dated Nov. 19, 2019 for Application No. 108103415. |
Office Action for Japanese Application No. 2018-517285 dated Oct. 23, 2019. |
Office Action for Taiwan Patent Application No. 108111501 dated Nov. 14, 2019. |
Taiwan Office Action dated Jun. 11, 2019 for Application No. 107138905. |
International Search Report and Written Opinion for International Application No. PCT/US2019/029602 dated Aug. 14, 2019. |
Haskel Pressure on Demand, Pneumatic and Hydraulic Driven Gas Boosters, Apr. 30, 2016, 36 pp. |
International Search Report and Written Opinion for PCT/US2018/021715 dated Jun. 22, 2018. |
International Search Report and Written Opinion from PCT/US2018/034036 dated Aug. 24, 2018. |
International Search Report and Written Opinion dated Aug. 24, 2018 for Application No. PCT/US2018/034284. |
International Search Report, Application No. PCT/US2018/028258 dated Aug. 9, 2018. |
International Search Report and Written Opinion for PCT/US2018/035210 dated Aug. 24, 2018. |
International Search Report and Written Opinion for PCT/US2018/037539 dated Oct. 5, 2018. |
International Search Report and Written Opinion for PCT/US2018/038822 dated Oct. 26, 2018. |
Chen, Yang et al., “Analysis of Supercritical Carbon Dioxide Heat Exchangers in Cooling Process”, International Refrigeration and Air Conditioning Conference at Purdue, Jul. 17-20, 2006, pp. 1-8. |
Shimoyama, Takehiro et al., “Porous Aluminum for Heat Exchanger”, Hitachi Chemical, pp. 19-20. |
Kato, T. et al., “Heat Transfer Characteristics of a Plate-Fin Type Supercritical/Liquid Helium Heat Exchanger”, ICEC 14 Proceedings Supplement, 1992, pp. 260-263. |
Lee, Ho-Saeng et al., “The cooling heat transfer characteristics of the supercritical CO2 in mico-fin tube”, Springer, Oct. 2, 2012, pp. 173-184. |
International Search Report and Written Opinion dated Nov. 30, 2018 for Application No. PCT/US2018/041688. |
International Search Report and Written Opinion for PCT/US2018/043160 dated Jan. 31, 2019. |
International Search Report and Written Opinion dated Jan. 31, 2019 for Application No. PCT/US2018/042760. |
International Search Report and Written Opinion for PCT/US2018/059643 dated Feb. 26, 2019. |
International Search Report and Written Opinion from PCT/US2019/012161 dated Apr. 30, 2019. |
International Search Report and Written Opinion for PCT/US2019/014759 dated May 14, 2019. |
International Search Report and Written Opinion for PCT/US2019/015332 dated May 15, 2019. |
International Search Report and Written Opinion for PCT/US2018/059676 dated May 23, 2019. |
International Search Report and Written Opinion for PCT/US2019/023431 dated Jul. 5, 2019. |
Taiwan Office Action dated Jul. 3, 2019 for Application No. 107136181. |
Office Action for Japanese Application No. 2018-546484 dated Oct. 8, 2019. |
Number | Date | Country | |
---|---|---|---|
20200035509 A1 | Jan 2020 | US |
Number | Date | Country | |
---|---|---|---|
62703251 | Jul 2018 | US |