involving the use of mechanical auxiliary parts without the use of an alloying of soldering process

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H01L2021/60285

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2021/60285involving the use of mechanical auxiliary parts without the use of an alloying of soldering process

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Patents Grantslast 30 patents

Information Patent Grant
Integrated structures with antenna elements and IC chips employing...
- Patent number 12,080,661
- Issue date Sep 3, 2024
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and method for mounting an electronic component to a subst...
- Patent number 11,211,304
- Issue date Dec 28, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures with antenna elements and IC chips employing...
- Patent number 11,088,098
- Issue date Aug 10, 2021
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical structure having a copper circuit trace
- Patent number 10,549,983
- Issue date Feb 4, 2020
- Robert Bosch GmbH
- Christoph Kaiser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,319,659
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED STRUCTURES WITH ANTENNA ELEMENTS AND IC CHIPS EMPLOYING...
- Publication number 20220005770
- Publication date Jan 6, 2022
- ViaSat, Inc.
- STEVEN J. FRANSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly and Method for Mounting an Electronic Component to a Subst...
- Publication number 20190057923
- Publication date Feb 21, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER