involving the use of mechanical auxiliary parts without the use of an alloying of soldering process

Follow

Industry

CPC
H01L2021/60285

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60285involving the use of mechanical auxiliary parts without the use of an alloying of soldering process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated structures with antenna elements and IC chips employing...
- Patent number 12,080,661
- Issue date Sep 3, 2024
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and method for mounting an electronic component to a subst...
- Patent number 11,211,304
- Issue date Dec 28, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures with antenna elements and IC chips employing...
- Patent number 11,088,098
- Issue date Aug 10, 2021
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical structure having a copper circuit trace
- Patent number 10,549,983
- Issue date Feb 4, 2020
- Robert Bosch GmbH
- Christoph Kaiser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,319,659
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED STRUCTURES WITH ANTENNA ELEMENTS AND IC CHIPS EMPLOYING...
- Publication number 20220005770
- Publication date Jan 6, 2022
- ViaSat, Inc.
- STEVEN J. FRANSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly and Method for Mounting an Electronic Component to a Subst...
- Publication number 20190057923
- Publication date Feb 21, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER