Iridium (Ir) as principal constituent

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H01L2224/45178

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45178Iridium (Ir) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor device
- Patent number 11,373,934
- Issue date Jun 28, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 9,117,550
- Issue date Aug 25, 2015
- Bao Q. Tran
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic flame-off electrode with ball-shaped tip
- Patent number 7,795,557
- Issue date Sep 14, 2010
- Kulicke and Soffa Industries, Inc.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 7,671,398
- Issue date Mar 2, 2010
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic flame-off electrode with ball-shaped tip
- Patent number 7,411,157
- Issue date Aug 12, 2008
- Kulicke and Soffa Industries, Inc.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
NANO IC packaging
- Patent number 7,375,417
- Issue date May 20, 2008
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Iridium oxide nanowires and method for forming same
- Patent number 7,255,745
- Issue date Aug 14, 2007
- Sharp Laboratories of America, Inc.
- Fengyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
NANO IC packaging
- Patent number 7,019,391
- Issue date Mar 28, 2006
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for bonding and breaking leads to semiconductors
- Patent number 3,954,217
- Issue date May 4, 1976
- Orthodyne Electronics
- Michael C. Smith
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20200373226
- Publication date Nov 26, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
- Publication number 20120299175
- Publication date Nov 29, 2012
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANO MEMORY, LIGHT, ENERGY, ANTENNA AND STRAND-BASED SYSTEMS AND ME...
- Publication number 20100155692
- Publication date Jun 24, 2010
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC FLAME-OFF ELECTRODE WITH BALL-SHAPED TIP
- Publication number 20080264907
- Publication date Oct 30, 2008
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANO IC
- Publication number 20060260674
- Publication date Nov 23, 2006
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Nano memory, light, energy, antenna and strand-based systems and me...
- Publication number 20060198209
- Publication date Sep 7, 2006
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Application
NANO IC packaging
- Publication number 20060145326
- Publication date Jul 6, 2006
- AVAILABLE FOR LICENSING
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Iridium oxide nanowires and method for forming same
- Publication number 20060086314
- Publication date Apr 27, 2006
- Sharp Laboratories of America, Inc.
- Fengyan Zhang
- C30 - CRYSTAL GROWTH
Information Patent Application
Electronic flame-off electrode with ball-shaped tip
- Publication number 20060076337
- Publication date Apr 13, 2006
- Kulicke & Soffa Investments, Inc.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANO IC packaging
- Publication number 20050230822
- Publication date Oct 20, 2005
- AvailableIP.com
- Bao Tran
- G11 - INFORMATION STORAGE

Iridium (Ir) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Nano memory, light, energy, antenna and strand-based systems and me...

Apparatus with a multi-layer coating and method of forming the same

Electronic flame-off electrode with ball-shaped tip

Nano memory, light, energy, antenna and strand-based systems and me...

Electronic flame-off electrode with ball-shaped tip

NANO IC packaging

Iridium oxide nanowires and method for forming same

NANO IC packaging

Method and apparatus for bonding and breaking leads to semiconductors

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Apparatus with a Multi-Layer Coating and Method of Forming the Same

NANO MEMORY, LIGHT, ENERGY, ANTENNA AND STRAND-BASED SYSTEMS AND ME...

ELECTRONIC FLAME-OFF ELECTRODE WITH BALL-SHAPED TIP

NANO IC

Nano memory, light, energy, antenna and strand-based systems and me...

NANO IC packaging

Iridium oxide nanowires and method for forming same

Electronic flame-off electrode with ball-shaped tip

NANO IC packaging