Iridium [Ir] as principal constituent

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H01L2224/05678

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05678Iridium [Ir] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder bumping
- Patent number 10,615,143
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,853,005
- Issue date Dec 26, 2017
- Renesas Electronics Corporation
- Takehiko Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, semiconductor device and method for manufact...
- Patent number 9,553,063
- Issue date Jan 24, 2017
- Mitsubishi Electric Corporation
- Kenji Ohtsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 8,912,088
- Issue date Dec 16, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having structures for reducing substrate noise...
- Patent number 7,701,057
- Issue date Apr 20, 2010
- Xilinx, Inc.
- Arifur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor component with adjustment circ...
- Patent number 7,257,884
- Issue date Aug 21, 2007
- Micron Technology, Inc.
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of producing the same
- Patent number 7,037,754
- Issue date May 2, 2006
- Rohm Co., Ltd.
- Shigeyuki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor component
- Patent number 7,007,375
- Issue date Mar 7, 2006
- Micron Technology, Inc.
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with electrical characteristic adjustment c...
- Patent number 6,914,275
- Issue date Jul 5, 2005
- Micron Technology, Inc.
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with adjustment circuitry
- Patent number 6,753,482
- Issue date Jun 22, 2004
- Micron Technology, Inc.
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of producing the same
- Patent number 6,744,140
- Issue date Jun 1, 2004
- Rohm Co., Ltd.
- Shigeyuki Ueda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153900
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153902
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...
- Publication number 20240014165
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER
- Publication number 20230072996
- Publication date Mar 9, 2023
- ISHIHARA CHEMICAL CO., LTD.
- Takahiro TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180068964
- Publication date Mar 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Takehiko MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170365567
- Publication date Dec 21, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yun Bog KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20170033075
- Publication date Feb 2, 2017
- Advanced Semiconductor, Inc.
- Min-Fong SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160013142
- Publication date Jan 14, 2016
- RENESAS ELECTRONICS CORPORATION
- Takehiko MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACT...
- Publication number 20140312361
- Publication date Oct 23, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Kenji Ohtsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...
- Publication number 20130196504
- Publication date Aug 1, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Preparing an Intergrated Circuits Device Having a Reinfo...
- Publication number 20080132053
- Publication date Jun 5, 2008
- ProMOS Technologies Inc.
- Hsiao Che Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor component with adjustment circ...
- Publication number 20070137029
- Publication date Jun 21, 2007
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor component with adjustment circ...
- Publication number 20060006551
- Publication date Jan 12, 2006
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and method of producing the same
- Publication number 20040173917
- Publication date Sep 9, 2004
- Shigeyuki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with electrical characteristic adjustment c...
- Publication number 20040135253
- Publication date Jul 15, 2004
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with adjustment circuitry and method of fab...
- Publication number 20030207501
- Publication date Nov 6, 2003
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS

Iridium [Ir] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding process with inhibited oxide formation

Protective surface layer on under bump metallurgy for solder joining

Bonding process with inhibited oxide formation

Bonding process with inhibited oxide formation

Non-destructive testing of integrated circuit chips

Two-component bump metallization

Injection molded solder bumping

Two-component bump metallization

Transfer substrate for forming metal wiring and method for forming...

Electronic device and method for producing an electronic device

Bonding structure for semiconductor package and method of manufactu...

Semiconductor device and method of manufacturing the same

Semiconductor packaging containing sintering die-attach material

Semiconductor element, semiconductor device and method for manufact...

Transfer substrate for forming metal wiring and method for forming...

Semiconductor device having structures for reducing substrate noise...

Method for fabricating semiconductor component with adjustment circ...

Semiconductor chip and method of producing the same

Method for fabricating a semiconductor component

Semiconductor component with electrical characteristic adjustment c...

Semiconductor component with adjustment circuitry

Semiconductor chip and method of producing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...

STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE

BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACT...

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...

Method for Preparing an Intergrated Circuits Device Having a Reinfo...

Method for fabricating semiconductor component with adjustment circ...

Method for fabricating semiconductor component with adjustment circ...

Semiconductor chip and method of producing the same

Semiconductor component with electrical characteristic adjustment c...

Semiconductor component with adjustment circuitry and method of fab...