Iridium [Ir] as principal constituent

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H01L2224/05178

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05178Iridium [Ir] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 10,707,089
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Durable bond pad structure for electrical connection to extreme env...
- Patent number 10,256,202
- Issue date Apr 9, 2019
- The United States of America as Represented by the Administrator of National...
- David J. Spry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,607,954
- Issue date Mar 28, 2017
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with Al pad
- Patent number 8,222,736
- Issue date Jul 17, 2012
- Eudyna Devices Inc.
- Takeshi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,759,177
- Issue date Jul 20, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20200303202
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20190304796
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190131510
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190103542
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170040267
- Publication date Feb 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira YAJlMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS
- Publication number 20080237866
- Publication date Oct 2, 2008
- Fujitsu Limited
- Wensheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080230908
- Publication date Sep 25, 2008
- EUDYNA DEVICES INC.
- Takeshi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Preparing an Intergrated Circuits Device Having a Reinfo...
- Publication number 20080132053
- Publication date Jun 5, 2008
- ProMOS Technologies Inc.
- Hsiao Che Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitride-based semiconductor light-emitting device and method of man...
- Publication number 20070051968
- Publication date Mar 8, 2007
- Shuichiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20070037337
- Publication date Feb 15, 2007
- Semiconductor Energy Laboratory Co., Ltd
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical device contact terminals free of particle generation
- Publication number 20030107137
- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Iridium [Ir] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Dry etch process landing on metal oxide etch stop layer over metal...

Dry etch process landing on metal oxide etch stop layer over metal...

Low-temperature bonding with spaced nanorods and eutectic alloys

Two-component bump metallization

Two-component bump metallization

Durable bond pad structure for electrical connection to extreme env...

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device with Al pad

Manufacturing method of semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

TWO-COMPONENT BUMP METALLIZATION

TWO-COMPONENT BUMP METALLIZATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS

SEMICONDUCTOR DEVICE

Method for Preparing an Intergrated Circuits Device Having a Reinfo...

Nitride-based semiconductor light-emitting device and method of man...

Manufacturing method of semiconductor device

Micromechanical device contact terminals free of particle generation