TREA

Iridium [Ir] as principal constituent

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  • CPC
  • H01L2224/29678
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29678Iridium [Ir] as principal constituent
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Patents Grantslast 30 patents

  • Information Patent Grant

    Back side metallization
    • Patent number 11,488,922
    • Issue date Nov 1, 2022
    • Advanced Micro Devices, Inc.
    • Thomas P. Dolbear
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Back side metallization
    • Patent number 10,957,669
    • Issue date Mar 23, 2021
    • Advanced Micro Devices, Inc.
    • Thomas P. Dolbear
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Back side metallization
    • Patent number 10,431,562
    • Issue date Oct 1, 2019
    • Advanced Micro Devices, Inc.
    • Thomas P. Dolbear
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Back side metallization
    • Patent number 10,242,962
    • Issue date Mar 26, 2019
    • Advanced Micro Devices, Inc.
    • Thomas P. Dolbear
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Solder, solder joint structure and method of forming solder joint s...
    • Patent number 9,308,603
    • Issue date Apr 12, 2016
    • Industrial Technology Research Institute
    • Kuo-Shu Kao
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents