Iron [Fe] as principal constituent

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CPC
H01L2924/1676

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1676Iron [Fe] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package and electronic apparatus
- Patent number 10,645,824
- Issue date May 5, 2020
- Kyocera Corporation
- Noritaka Niino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged integrated circuit including a switch-mode regulator and m...
- Patent number 10,103,627
- Issue date Oct 16, 2018
- Altera Corporation
- Teik Wah Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,735,130
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 9,693,462
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,640,518
- Issue date May 2, 2017
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,318,411
- Issue date Apr 19, 2016
- BRODGE SEMICONDUCTOR CORPORATION
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 9,245,854
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 8,952,503
- Issue date Feb 10, 2015
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with warpage control and method...
- Patent number 8,766,426
- Issue date Jul 1, 2014
- Stats Chippac Ltd.
- Hin Hwa Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230378024
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
- Publication number 20140210059
- Publication date Jul 31, 2014
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING ELECTRICAL, ELECTRONIC, ELECTROMECHANICAL OR ELECT...
- Publication number 20130207248
- Publication date Aug 15, 2013
- THALES
- Alain Bensoussan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...
- Publication number 20120074560
- Publication date Mar 29, 2012
- Hin Hwa Goh
- H01 - BASIC ELECTRIC ELEMENTS

Iron [Fe] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic package for high CTE mismatch

Electronic component housing package and electronic apparatus

Packaged integrated circuit including a switch-mode regulator and m...

Chip packages and methods of manufacture thereof

Printed circuit board

Semiconductor package with package-on-package stacking capability a...

Semiconductor package with package-on-package stacking capability a...

Organic module EMI shielding structures and methods

Organic module EMI shielding structures and methods

Integrated circuit packaging system with warpage control and method...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME

ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS

DEVICE INCLUDING ELECTRICAL, ELECTRONIC, ELECTROMECHANICAL OR ELECT...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...