Iron [Fe] as principal constituent

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H01L2924/1576

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1576Iron [Fe] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,553
- Issue date Jan 17, 2023
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Graphite-laminated chip-on-film-type semiconductor package allowing...
- Patent number 11,437,556
- Issue date Sep 6, 2022
- Hag Mo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-laminated chip-on-film-type semiconductor package having i...
- Patent number 11,355,687
- Issue date Jun 7, 2022
- Hag Mo Kim
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,315,854
- Issue date Apr 26, 2022
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power decoupling attachment
- Patent number 11,297,717
- Issue date Apr 5, 2022
- ELPIS TECHNOLOGIES INC.
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating packaging substrate
- Patent number 11,031,329
- Issue date Jun 8, 2021
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having terminals directly attachable to circui...
- Patent number 10,930,582
- Issue date Feb 23, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,903,151
- Issue date Jan 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure, chip module and electronic terminal
- Patent number 10,854,526
- Issue date Dec 1, 2020
- Shenzhen Goodix Technology Co., Ltd.
- Shengbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting board and electronic device
- Patent number 10,720,394
- Issue date Jul 21, 2020
- Kyocera Corporation
- Takuji Okamura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having nanoparticle adhesion layer pa...
- Patent number 10,636,679
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive interconnect in a semiconductor package
- Patent number 10,609,813
- Issue date Mar 31, 2020
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,497,663
- Issue date Dec 3, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,468,376
- Issue date Nov 5, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,461,055
- Issue date Oct 29, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, semiconductor package structure and method...
- Patent number 10,418,316
- Issue date Sep 17, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost substrates
- Patent number 10,283,484
- Issue date May 7, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,236,272
- Issue date Mar 19, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having polyimide layer
- Patent number 10,211,143
- Issue date Feb 19, 2019
- Intel Corporation
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated circuit package comprising surface capacitor and ground...
- Patent number 10,181,410
- Issue date Jan 15, 2019
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230076573
- Publication date Mar 9, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE
- Publication number 20220299278
- Publication date Sep 22, 2022
- JFE PRECISION CORPORATION
- Hoshiaki TERAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...
- Publication number 20220102235
- Publication date Mar 31, 2022
- INFINEON TECHNOLOGIES AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR...
- Publication number 20210210416
- Publication date Jul 8, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210066158
- Publication date Mar 4, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210035931
- Publication date Feb 4, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20200013747
- Publication date Jan 9, 2020
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190363040
- Publication date Nov 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD...
- Publication number 20190311979
- Publication date Oct 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20190164927
- Publication date May 30, 2019
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...
- Publication number 20190057880
- Publication date Feb 21, 2019
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
- Publication number 20180374827
- Publication date Dec 27, 2018
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20180240747
- Publication date Aug 23, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20180240748
- Publication date Aug 23, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POWER DECOUPLING ATTACHMENT
- Publication number 20170359898
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE INTERCONNECT IN A SEMICONDUCTOR PACKAGE
- Publication number 20170359893
- Publication date Dec 14, 2017
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20170338174
- Publication date Nov 23, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20170148723
- Publication date May 25, 2017
- Intel Corporation
- Ravindra V. Tanikella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...
- Publication number 20170133352
- Publication date May 11, 2017
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170133311
- Publication date May 11, 2017
- Advanced Semiconductor Engineering, Inc.
- Chin-Li KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
- Publication number 20170133353
- Publication date May 11, 2017
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT
- Publication number 20170012030
- Publication date Jan 12, 2017
- DELTA ELECTRONICS,INC.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING LOW COST SUBSTRATES
- Publication number 20160329301
- Publication date Nov 10, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20160293508
- Publication date Oct 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGES AND METHODS OF MAKING AND USING THE SAME
- Publication number 20160155693
- Publication date Jun 2, 2016
- GENERAL ELECTRIC COMPANY
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PACKAGED INTEGRATED CIRCUIT
- Publication number 20160020189
- Publication date Jan 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH STAINLESS STEEL LEADFRAME
- Publication number 20140239471
- Publication date Aug 28, 2014
- NXP B.V.
- Peeradech Khunpukdee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140124912
- Publication date May 8, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS

Iron [Fe] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat sink, semiconductor package and semiconductor module

Hermetic package for high CTE mismatch

Package for a semiconductor device

Semiconductor package having a chip carrier and a metal plate sized...

Semiconductor device

Chip assembly

Jointing material, fabrication method for semiconductor device usin...

Graphite-laminated chip-on-film-type semiconductor package allowing...

Graphite-laminated chip-on-film-type semiconductor package having i...

Semiconductor device and method of manufacturing semiconductor device

Power decoupling attachment

Method of fabricating packaging substrate

Semiconductor device having terminals directly attachable to circui...

Semiconductor device package and method of manufacturing the same

Chip packaging structure, chip module and electronic terminal

Electronic component mounting board and electronic device

Cu alloy core bonding wire with Pd coating for semiconductor device

Chip assembly

Packaged semiconductor device having nanoparticle adhesion layer pa...

Capacitive interconnect in a semiconductor package

Cu alloy core bonding wire with Pd coating for semiconductor device

Semiconductor device and method for manufacturing the same

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Semiconductor substrate, semiconductor package structure and method...

Low cost substrates

Cu alloy core bonding wire with Pd coating for semiconductor device

Semiconductor device having polyimide layer

Integrated circuit package comprising surface capacitor and ground...

Bonding wire for semiconductor device

Patents Applicationslast 30 patents

PACKAGE FOR A SEMICONDUCTOR DEVICE

HEAT SINK, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...

METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD...

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...

SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

BONDING WIRE FOR SEMICONDUCTOR DEVICE

POWER DECOUPLING ATTACHMENT

CAPACITIVE INTERCONNECT IN A SEMICONDUCTOR PACKAGE

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...

POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT

METHOD FOR PREPARING LOW COST SUBSTRATES

SEMICONDUCTOR DEVICE PACKAGES

ELECTRONIC PACKAGES AND METHODS OF MAKING AND USING THE SAME

FLEXIBLE PACKAGED INTEGRATED CIRCUIT

IC PACKAGE WITH STAINLESS STEEL LEADFRAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME