Iron [Fe] as principal constituent

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H01L2224/1326

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1326Iron [Fe] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
- Patent number 11,658,277
- Issue date May 23, 2023
- OSRAM OLED GmbH
- Guido Weiss
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
- Patent number 11,094,866
- Issue date Aug 17, 2021
- OSRAM OLED GmbH
- Guido Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 10,700,249
- Issue date Jun 30, 2020
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 10,283,685
- Issue date May 7, 2019
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,224,301
- Issue date Mar 5, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230215830
- Publication date Jul 6, 2023
- Sony Semiconductor Solutions Corporation
- Mutsuo TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
- Publication number 20220093549
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Optoelectronic Component, and Optoelectroni...
- Publication number 20210336111
- Publication date Oct 28, 2021
- OSRAM OLED GmbH
- Guido Weiss
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Producing an Optoelectronic Component, and Optoelectroni...
- Publication number 20200028045
- Publication date Jan 23, 2020
- Osram Opto Semiconductors GmbH
- Guido Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013284
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20180204991
- Publication date Jul 19, 2018
- Seoul Viosys Co., Ltd.
- Chang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20170279020
- Publication date Sep 28, 2017
- Seoul Viosys Co., Ltd.
- Chang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS

Iron [Fe] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing an optoelectronic component, and optoelectroni...

Method for producing an optoelectronic component, and optoelectroni...

Lead free solder columns and methods for making same

Light emitting device and method of fabricating the same

Light emitting device and method of fabricating the same

Semiconductor package device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...

Method for Producing an Optoelectronic Component, and Optoelectroni...

Method for Producing an Optoelectronic Component, and Optoelectroni...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME