Iron [Fe] as principal constituent

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CPC
H01L2224/3766

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3766Iron [Fe] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connection member with bulk body and electrically and thermally con...
- Patent number 10,366,946
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure therefor
- Patent number 9,460,995
- Issue date Oct 4, 2016
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a HEMT semiconductor device and structure therefor
- Patent number 9,214,423
- Issue date Dec 15, 2015
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a discrete device mounted on a DCB substrate
- Patent number 9,147,637
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...
- Publication number 20240222311
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection member with bulk body and electrically and thermally con...
- Publication number 20190131218
- Publication date May 2, 2019
- INFINEON TECHNOLOGIES AG
- Wu Hu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
- Publication number 20140264452
- Publication date Sep 18, 2014
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
- Publication number 20130017652
- Publication date Jan 17, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS

Iron [Fe] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection member with bulk body and electrically and thermally con...

Semiconductor device and structure therefor

Method of forming a HEMT semiconductor device and structure therefor

Module including a discrete device mounted on a DCB substrate

Semiconductor device using diffusion soldering

Patents Applicationslast 30 patents

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...

Connection member with bulk body and electrically and thermally con...

METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR

Semiconductor Device Using Diffusion Soldering

Module Including a Discrete Device Mounted on a DCB Substrate

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK