Iron (Fe) as principal constituent

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H01L2224/4876

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4876Iron (Fe) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire ball bonding in semiconductor devices
- Patent number 10,340,246
- Issue date Jul 2, 2019
- Texas Instruments Incorporated
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film and method for manufacturing s...
- Patent number 10,157,865
- Issue date Dec 18, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 10,049,994
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adding cap to copper passivation flow for electroless plating
- Patent number 10,026,706
- Issue date Jul 17, 2018
- Texas Instruments Incorporated
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package
- Patent number 9,379,033
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 9,331,050
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor module, and method for con...
- Patent number 9,196,562
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,190,385
- Issue date Nov 17, 2015
- Carsem (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bondable top metal contacts for gallium nitride power devices
- Patent number 8,916,871
- Issue date Dec 23, 2014
- Avogy, Inc.
- Brian Joel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
- Patent number 8,912,651
- Issue date Dec 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with pads of enhanced moisture blocking ability
- Patent number 8,906,705
- Issue date Dec 9, 2014
- Fujitsu Semiconductor Limited
- Kaoru Saigoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing electronic device having contact elements with a spec...
- Patent number 8,871,630
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 8,822,327
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable low-profile lead frame package
- Patent number 8,796,830
- Issue date Aug 5, 2014
- Google Inc.
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having copper interconnect for bonding
- Patent number 8,759,970
- Issue date Jun 24, 2014
- Round Rock Research, LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,759,987
- Issue date Jun 24, 2014
- Nichia Corporation
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
WIRE BALL BONDING IN SEMICONDUCTOR DEVICES
- Publication number 20190221537
- Publication date Jul 18, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Han ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
- Publication number 20180308816
- Publication date Oct 25, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140319689
- Publication date Oct 30, 2014
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPLEMENTING WIRE BONDS
- Publication number 20140264952
- Publication date Sep 18, 2014
- Power Integrations, Inc.
- Jayson M. DENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20140225267
- Publication date Aug 14, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded System with Coated Copper Conductor
- Publication number 20140197539
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20140197503
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140124911
- Publication date May 8, 2014
- PANASONIC CORPORATION
- TEPPEI IWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES
- Publication number 20140070226
- Publication date Mar 13, 2014
- AVOGY, INC.
- Brian Joel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...
- Publication number 20140048936
- Publication date Feb 20, 2014
- Kulite Semiconductor Products, Inc.
- Alex Ned
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140048941
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers
- Publication number 20140048958
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20130328204
- Publication date Dec 12, 2013
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20130306352
- Publication date Nov 21, 2013
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20130242500
- Publication date Sep 19, 2013
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF
- Publication number 20130223018
- Publication date Aug 29, 2013
- Tianshui Huatian Technology Co., Ltd.
- Jianyou Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF STRESS BALANCING IN GALLIUM ARSENIDE WAFER PROCESSING
- Publication number 20130193573
- Publication date Aug 1, 2013
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Conductive Clip
- Publication number 20130140602
- Publication date Jun 6, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure and Method
- Publication number 20130134588
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Iron (Fe) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Semiconductor device, electronic component and method

Semiconductor integrated circuit device

Package-on-package (PoP) structure including stud bulbs

Wire ball bonding in semiconductor devices

Semiconductor device with metal film and method for manufacturing s...

Package-on-package (PoP) structure including stud bulbs

Contact pads with sidewall spacers and method of making contact pad...

Adding cap to copper passivation flow for electroless plating

Package on-package (PoP) structure including stud bulbs

Thin plastic leadless package with exposed metal die paddle

Integrated circuit chip using top post-passivation technology and b...

Package on-Package (PoP) structure including stud bulbs and method

Semiconductor integrated circuit device

Sensor package

Bonding structure of bonding wire

Localized alloying for improved bond reliability

Device including a semiconductor chip and wires

Submount, encapsulated semiconductor element, and methods of manufa...

Semiconductor arrangement, semiconductor module, and method for con...

Thin plastic leadless package with exposed metal die paddle

Bondable top metal contacts for gallium nitride power devices

Package-on-package (PoP) structure including stud bulbs and method

Semiconductor device with pads of enhanced moisture blocking ability

Manufacturing electronic device having contact elements with a spec...

Contact pads with sidewall spacers and method of making contact pad...

Chip package and a method for manufacturing a chip package

Stackable low-profile lead frame package

Semiconductor device having copper interconnect for bonding

Semiconductor device and method of manufacturing the semiconductor...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

WIRE BALL BONDING IN SEMICONDUCTOR DEVICES

Package-On-Package (PoP) Structure Including Stud Bulbs

ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING

Package-On-Package (PoP) Structure Including Stud Bulbs

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

SUPPLEMENTING WIRE BONDS

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

Solderless Die Attach to a Direct Bonded Aluminum Substrate

Device Including a Semiconductor Chip and Wires

Bonded System with Coated Copper Conductor

SENSOR PACKAGE

SEMICONDUCTOR DEVICE

BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers

SEMICONDUCTOR DEVICE

Package-In-Packages and Methods of Formation Thereof

Solderless Die Attach to a Direct Bonded Aluminum Substrate

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

BONDING WIRE FOR SEMICONDUCTOR

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF

METHODS OF STRESS BALANCING IN GALLIUM ARSENIDE WAFER PROCESSING

Module Including a Discrete Device Mounted on a DCB Substrate

Power Semiconductor Package with Conductive Clip

Package-On-Package (PoP) Structure and Method