Iron [Fe] as principal constituent

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H01L2224/0586

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0586Iron [Fe] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,964,964
- Issue date Jun 21, 2011
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,618,844
- Issue date Nov 17, 2009
- Intelleflex Corporation
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20100038770
- Publication date Feb 18, 2010
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20070040272
- Publication date Feb 22, 2007
- INTELLEFLEX CORPORATION
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR