Iron [Fe] as principal constituent

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3716Iron [Fe] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device having terminals directly attachable to circui...
- Patent number 10,930,582
- Issue date Feb 23, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,916,491
- Issue date Feb 9, 2021
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with temperature detecting element
- Patent number 10,580,754
- Issue date Mar 3, 2020
- Mitsubishi Electric Corporation
- Shinya Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,491
- Issue date Nov 26, 2019
- Mitsubishi Electric Corporation
- Kazuhiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection member with bulk body and electrically and thermally con...
- Patent number 10,366,946
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,199,347
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 10,121,763
- Issue date Nov 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 9,911,712
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure therefor
- Patent number 9,460,995
- Issue date Oct 4, 2016
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip device including a substrate
- Patent number 9,385,107
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a HEMT semiconductor device and structure therefor
- Patent number 9,214,423
- Issue date Dec 15, 2015
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a discrete device mounted on a DCB substrate
- Patent number 9,147,637
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a contact clip having protrusions an...
- Patent number 8,987,879
- Issue date Mar 24, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements, a chip package and a method for manufacturing a...
- Patent number 8,853,835
- Issue date Oct 7, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device package and method of making an electric device pac...
- Patent number 8,824,145
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power semiconductor chip having two metal layers on one face
- Patent number 8,643,176
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having enhanced thermal dissipation...
- Patent number 7,944,044
- Issue date May 17, 2011
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240203929
- Publication date Jun 20, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING BOARD
- Publication number 20240203928
- Publication date Jun 20, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...
- Publication number 20210257327
- Publication date Aug 19, 2021
- Hitachi Metals, Ltd.
- Junya NISHINA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection member with bulk body and electrically and thermally con...
- Publication number 20190131218
- Publication date May 2, 2019
- INFINEON TECHNOLOGIES AG
- Wu Hu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
- Publication number 20140264452
- Publication date Sep 18, 2014
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
- Publication number 20140097528
- Publication date Apr 10, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package and Method of Making an Electric Device Pac...
- Publication number 20130329365
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130062743
- Publication date Mar 14, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING ENHANCED THERMAL DISSIPATION...
- Publication number 20070278664
- Publication date Dec 6, 2007
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Iron [Fe] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and electronic device

Method for electrically contacting a component by galvanic connecti...

Semiconductor device having terminals directly attachable to circui...

Semiconductor module

Semiconductor module with temperature detecting element

Semiconductor device

Connection member with bulk body and electrically and thermally con...

Semiconductor device

Clip and related methods

Clip and related methods

Electrode connection structure and electrode connection method

Semiconductor device and structure therefor

Multichip power semiconductor device

Multichip device including a substrate

Method of forming a HEMT semiconductor device and structure therefor

Module including a discrete device mounted on a DCB substrate

Semiconductor device including a contact clip having protrusions an...

Multichip power semiconductor device

Chip arrangements, a chip package and a method for manufacturing a...

Electric device package and method of making an electric device pac...

Power semiconductor chip having two metal layers on one face

Semiconductor package structure having enhanced thermal dissipation...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

METAL WIRING BOARD

ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...

Connection member with bulk body and electrically and thermally con...

CLIP AND RELATED METHODS

METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR

CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...

Electric Device Package and Method of Making an Electric Device Pac...

Multichip Power Semiconductor Device

Module Including a Discrete Device Mounted on a DCB Substrate

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device Including a Contact Clip Having Protrusions an...

SEMICONDUCTOR PACKAGE STRUCTURE HAVING ENHANCED THERMAL DISSIPATION...