Iron [Fe] as principal constituent

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H01L2224/1386

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1386Iron [Fe] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Package on package structure and method of manufacturing the same
- Patent number 9,230,935
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Doping minor elements into metal bumps
- Patent number 8,227,334
- Issue date Jul 24, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140159233
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120018878
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS