Iron (Fe) as principal constituent

Industry

CPC
H01L2224/4516

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4516Iron (Fe) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same and metal b...
- Patent number 11,908,824
- Issue date Feb 20, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 11,749,634
- Issue date Sep 5, 2023
- Kioxia Corporation
- Kazuya Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag alloy bonding wire for semiconductor device
- Patent number 11,612,966
- Issue date Mar 28, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum alloy material, and conductive member, conductive componen...
- Patent number 11,466,346
- Issue date Oct 11, 2022
- Furukawa Electric Co., Ltd.
- Hiroshi Kaneko
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 11,373,934
- Issue date Jun 28, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number RE49045
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,227,983
- Issue date Jan 18, 2022
- Nichia Corporation
- Tsuzuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy bonding wire for semiconductor device
- Patent number 10,985,130
- Issue date Apr 20, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,571
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements
- Patent number 10,930,614
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,892,251
- Issue date Jan 12, 2021
- TOSHIBA MEMORY CORPORATION
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 10,873,015
- Issue date Dec 22, 2020
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser ablation for wire bonding on organic solderability preservati...
- Patent number 10,833,043
- Issue date Nov 10, 2020
- Vitesco Technologies USA, LLC.
- Jared Yagoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with multiple molding routing layers and a me...
- Patent number 10,734,247
- Issue date Aug 4, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire having a silver alloy core, wire bonding method using...
- Patent number 10,658,326
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 10,622,308
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 10,396,261
- Issue date Aug 27, 2019
- Nichia Corporation
- Tsuzuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR MODULE
- Publication number 20240363655
- Publication date Oct 31, 2024
- Reco BioTek Co., Ltd
- Chang Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...
- Publication number 20240213430
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
- Publication number 20240105667
- Publication date Mar 28, 2024
- TANAKA DENSHI KOGYO K.K.
- Shuichi MITOMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
AI WIRING MATERIAL
- Publication number 20240105668
- Publication date Mar 28, 2024
- NIPPON MICROMETAL CORPORATION
- Yuto KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DE...
- Publication number 20240079305
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240023346
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Younghun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AL BONDING WIRE
- Publication number 20230142531
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE
- Publication number 20230105851
- Publication date Apr 6, 2023
- NIPPON MICROMETAL CORPORATION
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230008518
- Publication date Jan 12, 2023
- AMOSENSE CO.,LTD
- Ji-Hyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME AND METAL B...
- Publication number 20220359452
- Publication date Nov 10, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20220266396
- Publication date Aug 25, 2022
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
IC PACKAGE PROVIDING ISOLATED FILTER ON LEAD-FRAME
- Publication number 20220093581
- Publication date Mar 24, 2022
- BeRex Inc.
- Lothar Johannes Maria Musiol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20210210457
- Publication date Jul 8, 2021
- KIOXIA Corporation
- Kazuya MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20210167034
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUPD WIRE BOND CAPILLARY DESIGN
- Publication number 20210111146
- Publication date Apr 15, 2021
- Skyworks Solutions, Inc.
- Miguel Camargo Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20210043599
- Publication date Feb 11, 2021
- NIPPON STREET CHEMICAL & MATERTIAL CORPORATION CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20200373226
- Publication date Nov 26, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200303346
- Publication date Sep 24, 2020
- Toshiba Memory Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20200243444
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM ALLOY MATERIAL, AND CONDUCTIVE MEMBER, CONDUCTIVE COMPONEN...
- Publication number 20200017938
- Publication date Jan 16, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Hiroshi KANEKO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Iron (Fe) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Bonding wire for semiconductor devices

Semiconductor package, method of manufacturing the same and metal b...

Semiconductor device and wire bonding method

Ag alloy bonding wire for semiconductor device

Aluminum alloy material, and conductive member, conductive componen...

Bonding wire for semiconductor device

Bonding wire for semiconductor devices

Package on package devices and methods of packaging semiconductor dies

Light emitting device and method of manufacturing the light emittin...

Wire bonding tool including a wedge tool

Cu alloy bonding wire for semiconductor device

Coated wire

Bonding wire for semiconductor device

Chip arrangements

Semiconductor device

Light emitting device and method of manufacturing the light emittin...

Bonding wire for semiconductor device

Laser ablation for wire bonding on organic solderability preservati...

Semiconductor integrated circuit device

Bonding wire for semiconductor device

Semiconductor package with multiple molding routing layers and a me...

Bonding wire having a silver alloy core, wire bonding method using...

Packaged semiconductor assemblies and methods for manufacturing suc...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Light emitting device and method of manufacturing the light emittin...

Silver bonding wire for semiconductor device containing indium, gal...

Patents Applicationslast 30 patents

IMAGE SENSOR MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

AI WIRING MATERIAL

EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

AL BONDING WIRE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

COPPER BONDING WIRE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME AND METAL B...

Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

IC PACKAGE PROVIDING ISOLATED FILTER ON LEAD-FRAME

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

CHIP ARRANGEMENTS

CUPD WIRE BOND CAPILLARY DESIGN

Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

ALUMINUM ALLOY MATERIAL, AND CONDUCTIVE MEMBER, CONDUCTIVE COMPONEN...