Iron [Fe] as principal constituent

Industry

CPC
H01L2924/1776

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1776Iron [Fe] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip-shaped substrate for producing chip carriers, electronic modu...
- Patent number 9,941,197
- Issue date Apr 10, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eckhard Ditzel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Encapsulating resin composition, semiconductor device using the enc...
- Patent number 9,932,473
- Issue date Apr 3, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Emi Iwatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 9,917,036
- Issue date Mar 13, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip assemblies using stacked leadframes
- Patent number 9,917,041
- Issue date Mar 13, 2018
- Intel Corporation
- Cory A. Runyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for stabilizing leads in wire-bonded semicondu...
- Patent number 9,824,959
- Issue date Nov 21, 2017
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with thick die pad functioning as a...
- Patent number 9,418,920
- Issue date Aug 16, 2016
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,373,572
- Issue date Jun 21, 2016
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded semiconductor package with wettable flank
- Patent number 9,324,637
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP ASSEMBLIES USING STACKED LEADFRAMES
- Publication number 20180158764
- Publication date Jun 7, 2018
- Intel Corporation
- Cory A. Runyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDU...
- Publication number 20170278776
- Publication date Sep 28, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20170229371
- Publication date Aug 10, 2017
- Denso Corporation
- Shinji HIRAMITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PORTABLE APPARATUS USING THE SAME
- Publication number 20170194294
- Publication date Jul 6, 2017
- UBIQ Semiconductor Corp.
- Masamichi Yanagida
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODU...
- Publication number 20170133313
- Publication date May 11, 2017
- Heraeus Deutschland GmbH & Co. KG
- Eckhard DITZEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Device with Multi-Layer Contact
- Publication number 20170025375
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING...
- Publication number 20160343643
- Publication date Nov 24, 2016
- SH MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING THE ENC...
- Publication number 20160289443
- Publication date Oct 6, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- EMI IWATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH THICK DIE PAD, AND ASSOCIATED...
- Publication number 20160197030
- Publication date Jul 7, 2016
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20160190044
- Publication date Jun 30, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having Etched Foil Capacitor Integrated Into...
- Publication number 20160035655
- Publication date Feb 4, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD FOR MANUFACTURING A CHIP PACKAGE, A METHOD FOR MANUFACTURI...
- Publication number 20130334712
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

Iron [Fe] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic package for high CTE mismatch

Electronic device with multi-layer contact and system

Chip package and a wafer level package

Method for producing electronic device with multi-layer contact

Strip-shaped substrate for producing chip carriers, electronic modu...

Encapsulating resin composition, semiconductor device using the enc...

Chip package and a wafer level package

3D chip assemblies using stacked leadframes

Structure and method for stabilizing leads in wire-bonded semicondu...

Integrated circuit (IC) package with thick die pad functioning as a...

Semiconductor package having etched foil capacitor integrated into...

Quad flat non-leaded semiconductor package with wettable flank

Patents Applicationslast 30 patents

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

Electronic Device with Multi-Layer Contact and System

Method for Producing Electronic Device With Multi-Layer Contact

3D CHIP ASSEMBLIES USING STACKED LEADFRAMES

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDU...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND PORTABLE APPARATUS USING THE SAME

STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODU...

Electronic Device with Multi-Layer Contact

SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING...

ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING THE ENC...

INTEGRATED CIRCUIT (IC) PACKAGE WITH THICK DIE PAD, AND ASSOCIATED...

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

Semiconductor Package Having Etched Foil Capacitor Integrated Into...

A METHOD FOR MANUFACTURING A CHIP PACKAGE, A METHOD FOR MANUFACTURI...