Iron [Fe] as principal constituent

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H01L2224/2946

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2946Iron [Fe] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,546,831
- Issue date Jan 28, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,442,958
- Issue date Oct 15, 2019
- Dexerials Corporation
- Yuta Araki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and electronic device having the same
- Patent number 10,236,271
- Issue date Mar 19, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Yukie Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including conductive adhesive layer and...
- Patent number 9,490,228
- Issue date Nov 8, 2016
- Cheil Industries, Inc.
- Kyoung Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive microparticles, anisotropic electroconductive mat...
- Patent number 9,478,326
- Issue date Oct 25, 2016
- Sekisui Chemical Co., Ltd.
- Hiroya Ishida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device connected by anisotropic conductive adhesive film
- Patent number 9,437,346
- Issue date Sep 6, 2016
- Cheil Industries, Inc.
- Kyoung Hun Shin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connection device, method for manufacturing connection structure, m...
- Patent number 9,196,599
- Issue date Nov 24, 2015
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit component and method of making the same
- Patent number 9,019,714
- Issue date Apr 28, 2015
- Hitachi Chemical Company, Ltd.
- Kazuya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contacting means and method for contacting electrical components
- Patent number 8,925,789
- Issue date Jan 6, 2015
- Heraeus Materials Technology GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and electronic device having the same
- Patent number 8,783,577
- Issue date Jul 22, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Yukie Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 8,029,911
- Issue date Oct 4, 2011
- Hitachi Chemical Company, Ltd.
- Satoyuki Nomura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 7,208,105
- Issue date Apr 24, 2007
- Hitachi Chemical Co., Ltd.
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conducting materials and applications for microelectronic...
- Patent number 6,114,413
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Sung Kwon Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of producing connection electrodes
- Patent number 5,034,245
- Issue date Jul 23, 1991
- Sharp Kabushiki Kaisha
- Hiroshi Matsubara
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Electrically Conductive Film and Connection Structure
- Publication number 20180301432
- Publication date Oct 18, 2018
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...
- Publication number 20170271299
- Publication date Sep 21, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- HONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...
- Publication number 20170004901
- Publication date Jan 5, 2017
- TRILLION SCIENCE, INC.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20140319684
- Publication date Oct 30, 2014
- Yukie SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM
- Publication number 20140097548
- Publication date Apr 10, 2014
- Kyoung Hun SHIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN
- Publication number 20130251447
- Publication date Sep 26, 2013
- ROBERT BOSCH GmbH
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN
- Publication number 20130216848
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICES CONNECTED BY ANISOTROPIC CONDUCTIVE FILM COMP...
- Publication number 20130154095
- Publication date Jun 20, 2013
- Arum YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20130120948
- Publication date May 16, 2013
- HITACHI CHEMICAL CO., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Metal Layer on a Substrate and Device
- Publication number 20120292773
- Publication date Nov 22, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Contacting Means and Method for Contacting Electrical Components
- Publication number 20120055978
- Publication date Mar 8, 2012
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Michael SCHÄFER
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FLIP CHIP PACKAGE
- Publication number 20110115078
- Publication date May 19, 2011
- Samsung Electronics Co., Ltd.
- Se-Young JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...
- Publication number 20100294551
- Publication date Nov 25, 2010
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATER...
- Publication number 20100065311
- Publication date Mar 18, 2010
- Hitachi Chemical Company, Ltd.
- Masaru Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Electronic Device Having the Same
- Publication number 20080169349
- Publication date Jul 17, 2008
- Semiconductor Energy Laboratory Co., Ltd.
- Yukie Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive for circuit connection, circuit connection method using th...
- Publication number 20070166549
- Publication date Jul 19, 2007
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method and materials for printing particle-enhanced electrical cont...
- Publication number 20040087128
- Publication date May 6, 2004
- Herbert J Neuhaus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive for circuit connection , circuit connection method using t...
- Publication number 20030141014
- Publication date Jul 31, 2003
- Nomura Satoyuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductive fillers and conductive polymers made therefrom
- Publication number 20030113531
- Publication date Jun 19, 2003
- Karel Hajmrle
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Iron [Fe] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alternative compositions for high temperature soldering applications

Sintering materials and attachment methods using same

Anisotropic electrically conductive film and connection structure

Anisotropic electrically conductive film and connection structure

Anisotropic electrically conductive film and connection structure

Anisotropic conductive film and production method of the same

Semiconductor device and electronic device having the same

Anisotropic conductive film including conductive adhesive layer and...

Electroconductive microparticles, anisotropic electroconductive mat...

Semiconductor device connected by anisotropic conductive adhesive film

Connection device, method for manufacturing connection structure, m...

Circuit component and method of making the same

Contacting means and method for contacting electrical components

Semiconductor device and electronic device having the same

Adhesive for circuit connection, circuit connection method using th...

Adhesive for circuit connection, circuit connection method using th...

Method of production of semiconductor device

Thermally conducting materials and applications for microelectronic...

Method of producing connection electrodes

Patents Applicationslast 30 patents

Core-Shell Particle Die-Attach Material

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

Anisotropic Electrically Conductive Film and Connection Structure

ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...

FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

SEMICONDUCTOR DEVICES CONNECTED BY ANISOTROPIC CONDUCTIVE FILM COMP...

CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME

Method for Producing a Metal Layer on a Substrate and Device

Contacting Means and Method for Contacting Electrical Components

FLIP CHIP PACKAGE

ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...

CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATER...

Semiconductor Device and Electronic Device Having the Same

Adhesive for circuit connection, circuit connection method using th...

Method and materials for printing particle-enhanced electrical cont...

Adhesive for circuit connection , circuit connection method using t...

Conductive fillers and conductive polymers made therefrom