Iron (Fe) as principal constituent

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CPC
H01L2224/4536

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4536Iron (Fe) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire and bonded connection
- Patent number 7,319,196
- Issue date Jan 15, 2008
- EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
- Guy LeFranc
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bonding wire and bonded connection
- Publication number 20060055041
- Publication date Mar 16, 2006
- Eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
- Guy LeFranc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE METAL-GOLD WIRE FOR WIRE BONDING IN SEMICONDUCTOR FABRICATION
- Publication number 20020056915
- Publication date May 16, 2002
- BERNARD A. GO
- H01 - BASIC ELECTRIC ELEMENTS