Iron [Fe]

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H01L2924/01026

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01026Iron [Fe]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structure and bonding material
- Patent number 11,515,281
- Issue date Nov 29, 2022
- Panasonic Holdings Corporation
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for microstructure modification of conducting lines
- Patent number 11,430,693
- Issue date Aug 30, 2022
- Yuan Ze University
- Cheng En Ho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnection of copper surfaces using copper sintering material
- Patent number 11,329,023
- Issue date May 10, 2022
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having magnetic interconnects and related met...
- Patent number 10,978,415
- Issue date Apr 13, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of light-emitting diode package structure
- Patent number 10,886,264
- Issue date Jan 5, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, and semiconductor device
- Patent number 10,818,610
- Issue date Oct 27, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for achieving uniformity across a redistributio...
- Patent number 10,714,436
- Issue date Jul 14, 2020
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Light-emitting diode package structure and manufacturing method the...
- Patent number 10,700,049
- Issue date Jun 30, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,822
- Issue date Dec 10, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including soldered surface-mount component
- Patent number 10,297,539
- Issue date May 21, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a solder joint between metal layers
- Patent number 10,252,363
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 10,217,698
- Issue date Feb 26, 2019
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that includes a molecular bonding layer for bo...
- Patent number 10,163,765
- Issue date Dec 25, 2018
- Kabushiki Kaisha Toshiba
- Akihiko Happoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having magnetic bonding between substrates
- Patent number 10,157,885
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,153,266
- Issue date Dec 11, 2018
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package devices with magnetic shielding
- Patent number 10,147,685
- Issue date Dec 4, 2018
- Apple Inc.
- Phillip R. Sommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding process and structure
- Patent number 10,128,209
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 10,056,308
- Issue date Aug 21, 2018
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic circuit package
- Patent number 9,966,343
- Issue date May 8, 2018
- TDK Corporation
- Kenichi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit package
- Patent number 9,953,932
- Issue date Apr 24, 2018
- TDK Corporation
- Kenichi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing techniques for silicon-based transient devices
- Patent number 9,875,974
- Issue date Jan 23, 2018
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder ball
- Patent number 9,780,055
- Issue date Oct 3, 2017
- Senju Metal Industry Co., Ltd.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power device with improved cooling
- Patent number 9,711,432
- Issue date Jul 18, 2017
- SAFRAN ELECTRONICS & DEFENSE
- Jean-Christophe Riou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with diffusion barrier structures
- Patent number 9,620,481
- Issue date Apr 11, 2017
- GLOBALFOUNDRIES Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,613,883
- Issue date Apr 4, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240412991
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AI BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240312946
- Publication date Sep 19, 2024
- Tetsuya OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Al WIRING MATERIAL
- Publication number 20230299037
- Publication date Sep 21, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES
- Publication number 20220293467
- Publication date Sep 15, 2022
- YUAN ZE UNIVERSITY
- Cheng EN HO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
- Publication number 20220093549
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL
- Publication number 20210320082
- Publication date Oct 14, 2021
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR...
- Publication number 20210210416
- Publication date Jul 8, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MAGNETIC INTERCONNECTS AND RELATED MET...
- Publication number 20210005566
- Publication date Jan 7, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND BONDING MATERIAL
- Publication number 20200335470
- Publication date Oct 22, 2020
- PANASONIC CORPORATION
- Akio FURUSAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE
- Publication number 20200266181
- Publication date Aug 20, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20200075564
- Publication date Mar 5, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
- Publication number 20190326226
- Publication date Oct 24, 2019
- LG CHEM, LTD.
- Hee Jung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
"Lead-Free Solder Ball"
- Publication number 20190088611
- Publication date Mar 21, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing Techniques for Silicon-Based Transient Devices
- Publication number 20180286820
- Publication date Oct 4, 2018
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- G01 - MEASURING TESTING
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20180268724
- Publication date Sep 20, 2018
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G08 - SIGNALLING
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180033773
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Peter Yu-Fei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20180005970
- Publication date Jan 4, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC CIRCUIT PACKAGE
- Publication number 20170309576
- Publication date Oct 26, 2017
- TDK Corporation
- KENICHI KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT PACKAGE
- Publication number 20170301628
- Publication date Oct 19, 2017
- TDK Corporation
- KENICHI KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...
- Publication number 20170301615
- Publication date Oct 19, 2017
- Kabushiki Kaisha Toshiba
- Akihiko HAPPOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
- Publication number 20170287862
- Publication date Oct 5, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
System-in-Package Devices With Magnetic Shielding
- Publication number 20170263569
- Publication date Sep 14, 2017
- Apple Inc.
- Phillip R. Sommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ACHIEVING UNIFORMITY ACROSS A REDISTRIBUTIO...
- Publication number 20170243839
- Publication date Aug 24, 2017
- LAM RESEARCH CORPORATION
- Bryan L. Buckalew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170170085
- Publication date Jun 15, 2017
- Intel Corporation
- Paul J. Gwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHMENT FOR PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20170098597
- Publication date Apr 6, 2017
- NXP USA, Inc.
- AKHILESH K. SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT
- Publication number 20160379951
- Publication date Dec 29, 2016
- Intel Corporation
- RAJASEKARAN SWAMINATHAN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded structure and bonding material

Metal paste for joints, assembly, production method for assembly, s...

Method for microstructure modification of conducting lines

Interconnection of copper surfaces using copper sintering material

Semiconductor package having magnetic interconnects and related met...

Manufacturing method of light-emitting diode package structure

Adhesive film for semiconductor, and semiconductor device

Cu column, Cu core column, solder joint, and through-silicon via

Systems and methods for achieving uniformity across a redistributio...

Light-emitting diode package structure and manufacturing method the...

Semiconductor device

Method for soldering surface-mount component and surface-mount comp...

Electronic device including soldered surface-mount component

Forming a solder joint between metal layers

Die attachment for packaged semiconductor device

Semiconductor device that includes a molecular bonding layer for bo...

Package structure having magnetic bonding between substrates

Semiconductor device

System-in-package devices with magnetic shielding

Wafer bonding process and structure

Molded composite enclosure for integrated circuit assembly

Electronic circuit package

Electronic circuit package

Processing techniques for silicon-based transient devices

Magnetic intermetallic compound interconnect

Lead-free solder ball

Epoxy resin composition for encapsulating semiconductor device and...

Electronic power device with improved cooling

Substrate bonding with diffusion barrier structures

Semiconductor device

Patents Applicationslast 30 patents

MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME

Lead-Free Solder Ball

AI BONDING WIRE FOR SEMICONDUCTOR DEVICES

Al WIRING MATERIAL

METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES

HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...

INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL

METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR...

SEMICONDUCTOR PACKAGE HAVING MAGNETIC INTERCONNECTS AND RELATED MET...

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

BONDED STRUCTURE AND BONDING MATERIAL

MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...

ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

"Lead-Free Solder Ball"

WIRE BONDING SYSTEMS AND RELATED METHODS

Processing Techniques for Silicon-Based Transient Devices

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Lead-Free Solder Ball

ELECTRONIC CIRCUIT PACKAGE

ELECTRONIC CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...

Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via

System-in-Package Devices With Magnetic Shielding

SYSTEMS AND METHODS FOR ACHIEVING UNIFORMITY ACROSS A REDISTRIBUTIO...

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

DIE ATTACHMENT FOR PACKAGED SEMICONDUCTOR DEVICE

MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT