Membership
Tour
Register
Log in
IV-VI
Follow
Industry
CPC
H01L2924/1052
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
Current Industry
H01L2924/1052
IV-VI
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
P-type amorphous oxide semiconductor including gallium, method of m...
Patent number
10,797,192
Issue date
Oct 6, 2020
University-Industry Cooperation Group of Kyung Hee University
Jin Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
Patent number
9,859,248
Issue date
Jan 2, 2018
Intel Corporation
Danish Faruqui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
Patent number
9,412,702
Issue date
Aug 9, 2016
Intel Corporation
Danish Faruqui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method for forming the same
Patent number
9,355,975
Issue date
May 31, 2016
Xintec Inc.
Yen-Shih Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming die backside coating structures with coreless packages
Patent number
9,165,914
Issue date
Oct 20, 2015
Intel Corporation
Rahul N. Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming die backside coating structures with coreless packages
Patent number
8,466,559
Issue date
Jun 18, 2013
Intel Corporation
Rahul N. Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20140332969
Publication date
Nov 13, 2014
Yen-Shih HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
Publication number
20140264951
Publication date
Sep 18, 2014
Danish Faruqui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
Publication number
20140213017
Publication date
Jul 31, 2014
Samsung Electronics Co., Ltd.
Jong-Youn KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
Publication number
20130252376
Publication date
Sep 26, 2013
Rahul N. Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
Publication number
20120153494
Publication date
Jun 21, 2012
Rahul N. Manepalli
H01 - BASIC ELECTRIC ELEMENTS