Jet impingement

Industry

CPC
H01L23/4735

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4735Jet impingement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hood for MEMS-based cooling systems
- Patent number 12,127,369
- Issue date Oct 22, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of electronics using co-located microjet nozzles...
- Patent number 12,100,643
- Issue date Sep 24, 2024
- JetCool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vacuum modulated two phase cooling loop efficiency and parallelism...
- Patent number 12,057,370
- Issue date Aug 6, 2024
- Intel Corporation
- Paul Diglio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow-through, hot-spot-targeting immersion cooling assembly
- Patent number 12,048,118
- Issue date Jul 23, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microjet liquid-cooled heat spreader
- Patent number 12,029,008
- Issue date Jul 2, 2024
- The Penn State Research Foundation
- Bladimir Ramos Alvarado
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Jet impingement cooling for high power semiconductor devices
- Patent number 12,002,736
- Issue date Jun 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jesse Emmett Galloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchor and cavity configuration for MEMS-based cooling systems
- Patent number 11,978,690
- Issue date May 7, 2024
- Frore Systems Inc.
- Vikram Mukundan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,968,802
- Issue date Apr 23, 2024
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-based heat exchanger
- Patent number 11,967,541
- Issue date Apr 23, 2024
- The Provost, Fellows, Foundation Scholars and the other members of Board, of...
- Anthony Robinson
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid-cooled assembly and method
- Patent number 11,950,394
- Issue date Apr 2, 2024
- GE Aviation Systems LLC
- Brian Magann Rush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling module and method of forming the same
- Patent number 11,948,861
- Issue date Apr 2, 2024
- Agency for Science, Technology and Research
- Yong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink
- Patent number 11,948,860
- Issue date Apr 2, 2024
- WELCON Inc.
- Yutaka Suzuki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management of GPU-HBM package by microchannel integrated su...
- Patent number 11,915,997
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for liquid cooling
- Patent number 11,917,796
- Issue date Feb 27, 2024
- Iceotope Group Limited
- Nathan Longhurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redundant heat sink module
- Patent number 11,906,218
- Issue date Feb 20, 2024
- EBULLIENT, INC.
- Timothy A. Shedd
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Mobile phone and other compute device cooling architecture
- Patent number 11,830,789
- Issue date Nov 28, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Liquid cooling of high current devices in power flow control systems
- Patent number 11,812,592
- Issue date Nov 7, 2023
- Smart Wires Inc.
- Haroon Inam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct liquid micro jet (DLMJ) structures for addressing thermal pe...
- Patent number 11,804,418
- Issue date Oct 31, 2023
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and system for driving piezoelectric MEMS-based active cooli...
- Patent number 11,784,109
- Issue date Oct 10, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooling system
- Patent number 11,778,790
- Issue date Oct 3, 2023
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric MEMS-based active cooling for heat dissipation in com...
- Patent number 11,735,496
- Issue date Aug 22, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooling system
- Patent number 11,737,247
- Issue date Aug 22, 2023
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device embedded driver board assemblies with cooling structur...
- Patent number 11,728,241
- Issue date Aug 15, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined architecture for cooling devices
- Patent number 11,710,678
- Issue date Jul 25, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Two-dimensional addessable array of piezoelectric MEMS-based active...
- Patent number 11,705,382
- Issue date Jul 18, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Power electronics unit
- Patent number 11,659,699
- Issue date May 23, 2023
- Mahle International GmbH
- Sebastian Egger
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Devices, systems, and methods for the rapid transient cooling of pu...
- Patent number 11,649,995
- Issue date May 16, 2023
- Purdue Research Foundation
- Timothy Fisher
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 11,622,474
- Issue date Apr 4, 2023
- Google LLC
- Soheil Farshchian
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Jet impingement cooling for high power semiconductor devices
- Patent number 11,600,550
- Issue date Mar 7, 2023
- Semiconductor Components Industries, LLC
- Jesse Emmett Galloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jet impingement cooling apparatus and method
- Patent number 11,592,241
- Issue date Feb 28, 2023
- Oxford University Innovation Limited
- Jack Nicholas
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...
- Publication number 20250014967
- Publication date Jan 9, 2025
- Intel Corporation
- Kyle Jordan Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID-COOLED POWER MODULE
- Publication number 20250006589
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- John MOOKKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOOD FOR MEMS-BASED COOLING SYSTEMS
- Publication number 20240431068
- Publication date Dec 26, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealed Rack Server Unit
- Publication number 20240407139
- Publication date Dec 5, 2024
- Nexalus Limited
- Richard Jenkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES
- Publication number 20240312873
- Publication date Sep 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jesse Emmett GALLOWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET IMPINGEMENT HEATSINK FOR HIGH POWER SEMICONDUCTOR DEVICES
- Publication number 20240274506
- Publication date Aug 15, 2024
- Semiconductor Components Industries, LLC
- Changsun YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20240266255
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHOR AND CAVITY CONFIGURATION FOR MEMS-BASED COOLING SYSTEMS
- Publication number 20240243035
- Publication date Jul 18, 2024
- Frore Systems Inc.
- Vikram Mukundan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240234247
- Publication date Jul 11, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
HEAT SINK
- Publication number 20240203828
- Publication date Jun 20, 2024
- WELCON Inc.
- Yutaka SUZUKI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...
- Publication number 20240203827
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR LIQUID COOLING
- Publication number 20240196572
- Publication date Jun 13, 2024
- ICEOTOPE GROUP LIMITED
- Nathan Longhurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUNDANT HEAT SINK MODULE
- Publication number 20240175611
- Publication date May 30, 2024
- EBULLIENT, INC.
- Timothy A. Shedd
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240136252
- Publication date Apr 25, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
POWER MODULE THERMAL MANAGEMENT SYSTEM
- Publication number 20240096749
- Publication date Mar 21, 2024
- PC Krause and Associates, Inc.
- Jason WELLS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COOLING ARRANGEMENT WITH IMPROVED HEATSINK
- Publication number 20240057303
- Publication date Feb 15, 2024
- YASA LIMITED
- Simon David HART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SE...
- Publication number 20240047304
- Publication date Feb 8, 2024
- Semiconductor Components Industries, LLC
- John MOOKKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond Wafer Based Electronic Vehicle Power Electronics
- Publication number 20230411459
- Publication date Dec 21, 2023
- Diamond Foundry Inc.
- JEAN-CLAUDE HAREL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR A HEAT EXCHANGER
- Publication number 20230262947
- Publication date Aug 17, 2023
- Dana Canada Corporation
- Farbod VAKILIMOGHADDAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF NANO-PARTICLE BONDING FOR ELECTRONICS COOLING
- Publication number 20230215781
- Publication date Jul 6, 2023
- Corning Research & Development Corporation
- James Scott Sutherland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro Heat Transfer Arrays, Micro Cold Plates, and Thermal Manageme...
- Publication number 20230207426
- Publication date Jun 29, 2023
- Microfabrica Inc.
- Onnik Yaglioglu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES
- Publication number 20230187312
- Publication date Jun 15, 2023
- Semiconductor Components Industries, LLC
- Jesse Emmett GALLOWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING APPARATUS
- Publication number 20230180437
- Publication date Jun 8, 2023
- Motivair Corporation
- Rich S. Whitmore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Accessible Metal Clips
- Publication number 20230048878
- Publication date Feb 16, 2023
- Hitachi Energy Switzerland AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHOR AND CAVITY CONFIGURATION FOR MEMS-BASED COOLING SYSTEMS
- Publication number 20230030322
- Publication date Feb 2, 2023
- Frore Systems Inc.
- Vikram Mukundan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IMPINGEMENT COOLING IN HIGH POWER PACKAGE
- Publication number 20230030167
- Publication date Feb 2, 2023
- Cobham Advanced Electronic Solutions Inc.
- Chul Hong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES
- Publication number 20230027562
- Publication date Jan 26, 2023
- Deere & Company
- BRIJ N. SINGH
- B60 - VEHICLES IN GENERAL
Information Patent Application
COOLING ELECTRONIC DEVICES IN A DATA CENTER
- Publication number 20220304195
- Publication date Sep 22, 2022
- Google LLC
- Soheil Farshchian
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POWER MODULE WITH VASCULAR JET IMPINGEMENT COOLING SYSTEM
- Publication number 20220230938
- Publication date Jul 21, 2022
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Anthony M. Coppola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID COOLING SYSTEM
- Publication number 20220217874
- Publication date Jul 7, 2022
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS

Jet impingement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hood for MEMS-based cooling systems

Thermal management of electronics using co-located microjet nozzles...

Vacuum modulated two phase cooling loop efficiency and parallelism...

Flow-through, hot-spot-targeting immersion cooling assembly

Hybrid microjet liquid-cooled heat spreader

Jet impingement cooling for high power semiconductor devices

Anchor and cavity configuration for MEMS-based cooling systems

Heat sink, heat sink arrangement and module for liquid immersion co...

Liquid-based heat exchanger

Liquid-cooled assembly and method

Liquid cooling module and method of forming the same

Heat sink

Thermal management of GPU-HBM package by microchannel integrated su...

Heat sink for liquid cooling

Redundant heat sink module

Mobile phone and other compute device cooling architecture

Liquid cooling of high current devices in power flow control systems

Direct liquid micro jet (DLMJ) structures for addressing thermal pe...

Method and system for driving piezoelectric MEMS-based active cooli...

Fluid cooling system

Piezoelectric MEMS-based active cooling for heat dissipation in com...

Fluid cooling system

Power device embedded driver board assemblies with cooling structur...

Combined architecture for cooling devices

Two-dimensional addessable array of piezoelectric MEMS-based active...

Power electronics unit

Devices, systems, and methods for the rapid transient cooling of pu...

Cooling electronic devices in a data center

Jet impingement cooling for high power semiconductor devices

Jet impingement cooling apparatus and method

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...

FLUID-COOLED POWER MODULE

HOOD FOR MEMS-BASED COOLING SYSTEMS

Sealed Rack Server Unit

JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES

JET IMPINGEMENT HEATSINK FOR HIGH POWER SEMICONDUCTOR DEVICES

ELECTRONIC DEVICE COOLING STRUCTURES

ANCHOR AND CAVITY CONFIGURATION FOR MEMS-BASED COOLING SYSTEMS

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

HEAT SINK

THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...

HEAT SINK FOR LIQUID COOLING

REDUNDANT HEAT SINK MODULE

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

POWER MODULE THERMAL MANAGEMENT SYSTEM

SEMICONDUCTOR COOLING ARRANGEMENT WITH IMPROVED HEATSINK

JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SE...

Diamond Wafer Based Electronic Vehicle Power Electronics

SYSTEMS FOR A HEAT EXCHANGER

SYSTEMS AND METHODS OF NANO-PARTICLE BONDING FOR ELECTRONICS COOLING

Micro Heat Transfer Arrays, Micro Cold Plates, and Thermal Manageme...

JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES

COOLING APPARATUS

Power Semiconductor Module with Accessible Metal Clips

ANCHOR AND CAVITY CONFIGURATION FOR MEMS-BASED COOLING SYSTEMS

IMPINGEMENT COOLING IN HIGH POWER PACKAGE

DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES

COOLING ELECTRONIC DEVICES IN A DATA CENTER

POWER MODULE WITH VASCULAR JET IMPINGEMENT COOLING SYSTEM

FLUID COOLING SYSTEM